Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

Wire bonding (Electronic packaging) --- Nuclear pressure vessels --- Defects.

Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

Wire bonding (Electronic packaging) --- Electronic packaging --- Electronic packaging --- Semiconductors --- Production control. --- Reliability. --- Defects. --- Failures.

Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.

Electronic packaging - Reliability. --- Electronics. --- Engineering. --- Machinery. --- Optical materials. --- Systems engineering. --- Wire bonding (Electronic packaging). --- Wire bonding (Electronic packaging) --- Electronic packaging --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Production control --- Reliability --- Manufactures. --- Microelectronics. --- Electronic circuits. --- Electronic materials. --- Manufacturing, Machines, Tools, Processes. --- Electronics and Microelectronics, Instrumentation. --- Circuits and Systems. --- Optical and Electronic Materials. --- Electronic materials --- Optics --- Materials --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Electrical engineering --- Physical sciences --- Manufactured goods --- Manufactured products --- Products --- Products, Manufactured --- Commercial products --- Manufacturing industries --- Production control. --- Reliability. --- Packaging (Electronics) --- Electronic apparatus and appliances --- Lead bonding (Electronic packaging) --- Wirebonding (Electronic packaging) --- Metal bonding

Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

Microelectronic packaging. --- Wire bonding (Electronic packaging). --- Microelectronic packaging --- Wire bonding (Electronic packaging) --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Electronic packaging. --- Packaging (Electronics) --- Packaging (Microelectronics) --- Materials science. --- Engineering. --- Quality control. --- Reliability. --- Industrial safety. --- Electronics. --- Microelectronics. --- Optical materials. --- Electronic materials. --- Nanotechnology. --- Materials Science. --- Optical and Electronic Materials. --- Engineering, general. --- Quality Control, Reliability, Safety and Risk. --- Electronics and Microelectronics, Instrumentation. --- Electronic apparatus and appliances --- Electronics --- Electronic packaging --- Microelectronics --- System safety. --- Electrical engineering --- Physical sciences --- Safety, System --- Safety of systems --- Systems safety --- Accidents --- Industrial safety --- Systems engineering --- Construction --- Industrial arts --- Technology --- Optics --- Materials --- Molecular technology --- Nanoscale technology --- High technology --- Prevention --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Industrial accidents --- Industries --- Job safety --- Occupational hazards, Prevention of --- Occupational health and safety --- Occupational safety and health --- Prevention of industrial accidents --- Prevention of occupational hazards --- Safety, Industrial --- Safety engineering --- Safety measures --- Safety of workers --- System safety --- Dependability --- Trustworthiness --- Conduct of life --- Factory management --- Industrial engineering --- Reliability (Engineering) --- Sampling (Statistics) --- Standardization --- Quality assurance --- Quality of products --- Electronic materials

Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

The Terahertz frequency range (0.1 – 10)THz has demonstrated to provide many opportunities in prominent research fields such as high-speed communications, biomedicine, sensing, and imaging. This spectral range, lying between electronics and photonics, has been historically known as “terahertz gap” because of the lack of experimental as well as fabrication technologies. However, many efforts are now being carried out worldwide in order improve technology working at this frequency range. This book represents a mechanism to highlight some of the work being done within this range of the electromagnetic spectrum. The topics covered include non-destructive testing, teraherz imaging and sensing, among others.

Research & information: general --- W band --- Schottky Diode Detectors --- ZBD modeling --- wire bonding --- flip-chip --- Terahertz radar --- radar cross-section --- signal-to-noise ratio --- adaptive range gates --- cascaded doubler --- quadrupler --- Schottky varactor --- hybrid integrated circuit --- terahertz spectroscopy --- optical delay line --- correction --- optical encoder --- terahertz spectra --- terahertz metrology --- bias --- sub-harmonic mixer --- anti-series --- Schottky diode --- conversion loss --- terahertz wave generation --- InGaAs --- molecular beam epitaxy --- time-domain spectroscopy --- photoconductive antenna --- open stone relics --- hollowing --- weathered --- preservation of cultural heritage --- THz-TDS --- rubber --- vulcanization --- silica dispersion --- terahertz imaging --- light field imaging --- synthetic aperture imaging --- image distortion --- resolving power --- THz detector --- rectangular inset-feed patch antenna --- catadioptric horn-like lens --- CMOS process --- resonances --- periodic waveguides --- reflection phases --- topological properties --- oscillator --- THz --- high output power --- CMOS --- terahertz waves --- honeycomb sandwiches --- foreign materials --- time-of-flight --- electric field --- W band --- Schottky Diode Detectors --- ZBD modeling --- wire bonding --- flip-chip --- Terahertz radar --- radar cross-section --- signal-to-noise ratio --- adaptive range gates --- cascaded doubler --- quadrupler --- Schottky varactor --- hybrid integrated circuit --- terahertz spectroscopy --- optical delay line --- correction --- optical encoder --- terahertz spectra --- terahertz metrology --- bias --- sub-harmonic mixer --- anti-series --- Schottky diode --- conversion loss --- terahertz wave generation --- InGaAs --- molecular beam epitaxy --- time-domain spectroscopy --- photoconductive antenna --- open stone relics --- hollowing --- weathered --- preservation of cultural heritage --- THz-TDS --- rubber --- vulcanization --- silica dispersion --- terahertz imaging --- light field imaging --- synthetic aperture imaging --- image distortion --- resolving power --- THz detector --- rectangular inset-feed patch antenna --- catadioptric horn-like lens --- CMOS process --- resonances --- periodic waveguides --- reflection phases --- topological properties --- oscillator --- THz --- high output power --- CMOS --- terahertz waves --- honeycomb sandwiches --- foreign materials --- time-of-flight --- electric field