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Wire bonding (Electronic packaging) --- Nuclear pressure vessels --- Defects.
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To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
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Wire bonding (Electronic packaging) --- Electronic packaging --- Electronic packaging --- Semiconductors --- Production control. --- Reliability. --- Defects. --- Failures.
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Wire bonding (Electronic packaging) --- Electronic packaging --- Semiconductors --- Failures in semiconductors --- System failures (Engineering) --- Packaging (Electronics) --- Electronic apparatus and appliances --- Electronics --- Lead bonding (Electronic packaging) --- Wirebonding (Electronic packaging) --- Metal bonding --- Production control. --- Reliability. --- Defects. --- Failures. --- Defects --- Reliability --- Failures --- Production control
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Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.
Electronic packaging - Reliability. --- Electronics. --- Engineering. --- Machinery. --- Optical materials. --- Systems engineering. --- Wire bonding (Electronic packaging). --- Wire bonding (Electronic packaging) --- Electronic packaging --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Production control --- Reliability --- Manufactures. --- Microelectronics. --- Electronic circuits. --- Electronic materials. --- Manufacturing, Machines, Tools, Processes. --- Electronics and Microelectronics, Instrumentation. --- Circuits and Systems. --- Optical and Electronic Materials. --- Electronic materials --- Optics --- Materials --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Electrical engineering --- Physical sciences --- Manufactured goods --- Manufactured products --- Products --- Products, Manufactured --- Commercial products --- Manufacturing industries --- Production control. --- Reliability. --- Packaging (Electronics) --- Electronic apparatus and appliances --- Lead bonding (Electronic packaging) --- Wirebonding (Electronic packaging) --- Metal bonding
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This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Metal bonding. --- Wire bonding (Electronic packaging) --- Lead bonding (Electronic packaging) --- Wirebonding (Electronic packaging) --- Metals --- Bonding --- Engineering. --- Mechatronics. --- Industrial engineering. --- Optical materials. --- Electronic materials. --- Operating Procedures, Materials Treatment. --- Optical and Electronic Materials. --- Electronic packaging --- Metal bonding --- Sealing (Technology) --- Manufactures. --- Manufacturing, Machines, Tools, Processes. --- Optics --- Materials --- Manufactured goods --- Manufactured products --- Products --- Products, Manufactured --- Commercial products --- Manufacturing industries --- Electronic materials --- Mechanical engineering --- Microelectronics --- Microelectromechanical systems --- Copper wire.
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This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.
Microelectronic packaging. --- Wire bonding (Electronic packaging). --- Microelectronic packaging --- Wire bonding (Electronic packaging) --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Electronic packaging. --- Packaging (Electronics) --- Packaging (Microelectronics) --- Materials science. --- Engineering. --- Quality control. --- Reliability. --- Industrial safety. --- Electronics. --- Microelectronics. --- Optical materials. --- Electronic materials. --- Nanotechnology. --- Materials Science. --- Optical and Electronic Materials. --- Engineering, general. --- Quality Control, Reliability, Safety and Risk. --- Electronics and Microelectronics, Instrumentation. --- Electronic apparatus and appliances --- Electronics --- Electronic packaging --- Microelectronics --- System safety. --- Electrical engineering --- Physical sciences --- Safety, System --- Safety of systems --- Systems safety --- Accidents --- Industrial safety --- Systems engineering --- Construction --- Industrial arts --- Technology --- Optics --- Materials --- Molecular technology --- Nanoscale technology --- High technology --- Prevention --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Industrial accidents --- Industries --- Job safety --- Occupational hazards, Prevention of --- Occupational health and safety --- Occupational safety and health --- Prevention of industrial accidents --- Prevention of occupational hazards --- Safety, Industrial --- Safety engineering --- Safety measures --- Safety of workers --- System safety --- Dependability --- Trustworthiness --- Conduct of life --- Factory management --- Industrial engineering --- Reliability (Engineering) --- Sampling (Statistics) --- Standardization --- Quality assurance --- Quality of products --- Electronic materials
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The Terahertz frequency range (0.1 – 10)THz has demonstrated to provide many opportunities in prominent research fields such as high-speed communications, biomedicine, sensing, and imaging. This spectral range, lying between electronics and photonics, has been historically known as “terahertz gap” because of the lack of experimental as well as fabrication technologies. However, many efforts are now being carried out worldwide in order improve technology working at this frequency range. This book represents a mechanism to highlight some of the work being done within this range of the electromagnetic spectrum. The topics covered include non-destructive testing, teraherz imaging and sensing, among others.
W band --- Schottky Diode Detectors --- ZBD modeling --- wire bonding --- flip-chip --- Terahertz radar --- radar cross-section --- signal-to-noise ratio --- adaptive range gates --- cascaded doubler --- quadrupler --- Schottky varactor --- hybrid integrated circuit --- terahertz spectroscopy --- optical delay line --- correction --- optical encoder --- terahertz spectra --- terahertz metrology --- bias --- sub-harmonic mixer --- anti-series --- Schottky diode --- conversion loss --- terahertz wave generation --- InGaAs --- molecular beam epitaxy --- time-domain spectroscopy --- photoconductive antenna --- open stone relics --- hollowing --- weathered --- preservation of cultural heritage --- THz-TDS --- rubber --- vulcanization --- silica dispersion --- terahertz imaging --- light field imaging --- synthetic aperture imaging --- image distortion --- resolving power --- THz detector --- rectangular inset-feed patch antenna --- catadioptric horn-like lens --- CMOS process --- resonances --- periodic waveguides --- reflection phases --- topological properties --- oscillator --- THz --- high output power --- CMOS --- terahertz waves --- honeycomb sandwiches --- foreign materials --- time-of-flight --- electric field --- n/a
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The Terahertz frequency range (0.1 – 10)THz has demonstrated to provide many opportunities in prominent research fields such as high-speed communications, biomedicine, sensing, and imaging. This spectral range, lying between electronics and photonics, has been historically known as “terahertz gap” because of the lack of experimental as well as fabrication technologies. However, many efforts are now being carried out worldwide in order improve technology working at this frequency range. This book represents a mechanism to highlight some of the work being done within this range of the electromagnetic spectrum. The topics covered include non-destructive testing, teraherz imaging and sensing, among others.
Research & information: general --- W band --- Schottky Diode Detectors --- ZBD modeling --- wire bonding --- flip-chip --- Terahertz radar --- radar cross-section --- signal-to-noise ratio --- adaptive range gates --- cascaded doubler --- quadrupler --- Schottky varactor --- hybrid integrated circuit --- terahertz spectroscopy --- optical delay line --- correction --- optical encoder --- terahertz spectra --- terahertz metrology --- bias --- sub-harmonic mixer --- anti-series --- Schottky diode --- conversion loss --- terahertz wave generation --- InGaAs --- molecular beam epitaxy --- time-domain spectroscopy --- photoconductive antenna --- open stone relics --- hollowing --- weathered --- preservation of cultural heritage --- THz-TDS --- rubber --- vulcanization --- silica dispersion --- terahertz imaging --- light field imaging --- synthetic aperture imaging --- image distortion --- resolving power --- THz detector --- rectangular inset-feed patch antenna --- catadioptric horn-like lens --- CMOS process --- resonances --- periodic waveguides --- reflection phases --- topological properties --- oscillator --- THz --- high output power --- CMOS --- terahertz waves --- honeycomb sandwiches --- foreign materials --- time-of-flight --- electric field --- W band --- Schottky Diode Detectors --- ZBD modeling --- wire bonding --- flip-chip --- Terahertz radar --- radar cross-section --- signal-to-noise ratio --- adaptive range gates --- cascaded doubler --- quadrupler --- Schottky varactor --- hybrid integrated circuit --- terahertz spectroscopy --- optical delay line --- correction --- optical encoder --- terahertz spectra --- terahertz metrology --- bias --- sub-harmonic mixer --- anti-series --- Schottky diode --- conversion loss --- terahertz wave generation --- InGaAs --- molecular beam epitaxy --- time-domain spectroscopy --- photoconductive antenna --- open stone relics --- hollowing --- weathered --- preservation of cultural heritage --- THz-TDS --- rubber --- vulcanization --- silica dispersion --- terahertz imaging --- light field imaging --- synthetic aperture imaging --- image distortion --- resolving power --- THz detector --- rectangular inset-feed patch antenna --- catadioptric horn-like lens --- CMOS process --- resonances --- periodic waveguides --- reflection phases --- topological properties --- oscillator --- THz --- high output power --- CMOS --- terahertz waves --- honeycomb sandwiches --- foreign materials --- time-of-flight --- electric field
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