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Wide gap semiconductors --- Power electronics --- Wide band gap semiconductors --- Wide bandgap semiconductors --- Semiconductors

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A global high level forum aiming at promoting collaborative innovation of the whole industry chain including wide band gap semiconductor materials, equipments, devices and related application sponsored by China Advanced Semiconductor Industry Innovation Alliance (CASA) This forum will focus on roadmap, application needs, integrated innovation of wide bandgap semiconductor technology and other contents, divided into several chapters to make in depth discussion.

Wide gap semiconductors --- Semiconductors --- Materials --- Wide band gap semiconductors --- Wide bandgap semiconductors

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Power electronics --- Wide gap semiconductors --- Wide band gap semiconductors --- Wide bandgap semiconductors --- Semiconductors

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"Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates"--

Wide gap semiconductors. --- Microelectronic packaging. --- Packaging (Microelectronics) --- Electronic packaging --- Microelectronics --- Wide band gap semiconductors --- Wide bandgap semiconductors --- Semiconductors

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This book provides a summary of the current state-of-the-art in SiC and GaN and identify future areas of development. The remarkable improvements in material quality and device performance in the last few years show the promise of these technologies for areas that Si cannot operate because of it's smaller bandgap. We feel that this collection of chapters provides an excellent introduction to the field and is an outstanding reference for those performing research on wide bandgap semiconductors. In this book, we bring together numerous experts in the field to review progress in SiC and GaN ele

Gallium arsenide semiconductors. --- Power semiconductors. --- Silicon carbide. --- Wide gap semiconductors. --- Wide band gap semiconductors --- Wide bandgap semiconductors --- Semiconductors --- Power electronics --- Carborundum --- Crystolon --- Silundum --- Carbides --- Silicon compounds