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IEEE Std 1838 is a die-centric standard; it applies to a die that is intended to be part of a multi-die stack. This standard defines die-level features that, when compliant dies are brought together in a stack, comprise a stack-level architecture that enables transportation of control and data signals for the test of (1) intra-die circuitry and (2) inter-die interconnects in both (a) pre-stacking and (b) post-stacking situations, the latter for both partial and complete stacks in both pre-packaging, post-packaging, and board-level situations. The primary focus of inter-die interconnect technology addressed by this standard is through-silicon vias (TSVs); however, this does not preclude its use with other interconnect technologies such as wire-bonding.

Microwave transmission lines --- Standards.

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Up-to-date coverage of the analysis and applications of coplanar waveguides to microwave circuits and antennas The unique feature of coplanar waveguides, as opposed to more conventional waveguides, is their uniplanar construction, in which all of the conductors are aligned on the same side of the substrate. This feature simplifies manufacturing and allows faster and less expensive characterization using on-wafer techniques. Coplanar Waveguide Circuits, Components, and Systems is an engineer's complete resource, collecting all of the available data on the subject. Rainee Simons thoroughly discusses propagation parameters for conventional coplanar waveguides and includes valuable details such as the derivation of the fundamental equations, physical explanations, and numerical examples. Coverage also includes: . Discontinuities and circuit elements. Transitions to other transmission media. Directional couplers, hybrids, and magic T. Microelectromechanical systems based switches and phase shifters. Tunable devices using ferroelectric materials. Photonic bandgap structures. Printed circuit antennas.

Microwave transmission lines --- Antennas (Electronics) --- Microwave transmission lines. --- Wave guides.

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Co-published with Oxford University Press. A volume in the IEEE Press/OUP Electromagnetic Wave Series. Gain a thorough understanding of one of the most important simulation tools in computational electromagnetics with this comprehensive introduction to the TLM method. Written by one of the foremost researchers in the TLM method, this book covers the entire area of electromagnetics from the basic principles to advanced formulations and applications and including microwaves, antennas, RCS, electromagnetic compatibility, and electromagnetic heating, while providing a clear explanation of modeling principles from lumped components through 1, 2 and 3 dimensional complex systems.

Microwave transmission lines --- Mathematical models.

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Microwave transmission lines. --- Microwave circuits.

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Microwave filters. --- Microwave transmission lines.