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Ultra-precision machining is a multi-disciplinary research area that is an important branch of manufacturing technology. It targets achieving ultra-precision form or surface roughness accuracy, forming the backbone and support of today’s innovative technology industries in aerospace, semiconductors, optics, telecommunications, energy, etc. The increasing demand for components with ultra-precision accuracy has stimulated the development of ultra-precision machining technology in recent decades. Accordingly, this Special Issue includes reviews and regular research papers on the frontiers of ultra-precision machining and will serve as a platform for the communication of the latest development and innovations of ultra-precision machining technologies.

Technology: general issues --- History of engineering & technology --- fused silica --- small-scale damage --- magnetorheological removing method --- combined repairing process --- evolution law --- diamond grinding --- single crystal silicon --- subsurface damage --- crystal orientation --- spherical shell --- thin-walled part --- wall-thickness --- benchmark coincidence --- data processing --- ultra-precision machining --- computer-controlled optical surfacing --- dwell time algorithm --- removal function --- elementary approximation --- atmospheric pressure plasma jet --- continuous phase plate --- surface topography --- high accuracy and efficiency --- polar microstructures --- optimization --- machining parameters --- cutting strategy --- flexible grinding --- shear thickening fluid --- cluster effect --- high-shear low-pressure --- aluminum --- ion beam sputtering --- morphology evolution --- molecular dynamics --- electrochemical discharge machining (ECDM) --- material removal rate (MRR) --- electrode wear ratio (EWR) --- overcut (OC) --- electrical properties --- tool material --- diamond tool --- single-point diamond turning --- lubricant --- ferrous metal --- electrorheological polishing --- polishing tool --- roughness --- integrated electrode --- Nano-ZrO2 ceramics --- ultra-precision grinding --- surface residual material --- surface quality --- three-dimensional surface roughness --- reversal method --- eccentricity --- piezoelectric actuator --- flange --- dynamic modeling --- surface characterization --- cutting forces --- tool servo diamond cutting --- data-dependent systems --- surface topography variation --- microstructured surfaces --- microlens array --- three-dimensional elliptical vibration cutting --- piezoelectric hysteresis --- Bouc–Wen model --- flower pollination algorithm --- dynamic switching probability strategy --- parameter identification --- atom probe tomography (APT) --- single-wedge --- lift-out --- focused ion beam (FIB) --- Al/Ni multilayers --- vibration-assisted electrochemical machining (ECM) --- blisk --- narrow channel --- high aspect ratio --- multi-physics coupling simulation --- machining stability --- n/a --- Bouc-Wen model

Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

Ultra-precision machining is a multi-disciplinary research area that is an important branch of manufacturing technology. It targets achieving ultra-precision form or surface roughness accuracy, forming the backbone and support of today’s innovative technology industries in aerospace, semiconductors, optics, telecommunications, energy, etc. The increasing demand for components with ultra-precision accuracy has stimulated the development of ultra-precision machining technology in recent decades. Accordingly, this Special Issue includes reviews and regular research papers on the frontiers of ultra-precision machining and will serve as a platform for the communication of the latest development and innovations of ultra-precision machining technologies.

fused silica --- small-scale damage --- magnetorheological removing method --- combined repairing process --- evolution law --- diamond grinding --- single crystal silicon --- subsurface damage --- crystal orientation --- spherical shell --- thin-walled part --- wall-thickness --- benchmark coincidence --- data processing --- ultra-precision machining --- computer-controlled optical surfacing --- dwell time algorithm --- removal function --- elementary approximation --- atmospheric pressure plasma jet --- continuous phase plate --- surface topography --- high accuracy and efficiency --- polar microstructures --- optimization --- machining parameters --- cutting strategy --- flexible grinding --- shear thickening fluid --- cluster effect --- high-shear low-pressure --- aluminum --- ion beam sputtering --- morphology evolution --- molecular dynamics --- electrochemical discharge machining (ECDM) --- material removal rate (MRR) --- electrode wear ratio (EWR) --- overcut (OC) --- electrical properties --- tool material --- diamond tool --- single-point diamond turning --- lubricant --- ferrous metal --- electrorheological polishing --- polishing tool --- roughness --- integrated electrode --- Nano-ZrO2 ceramics --- ultra-precision grinding --- surface residual material --- surface quality --- three-dimensional surface roughness --- reversal method --- eccentricity --- piezoelectric actuator --- flange --- dynamic modeling --- surface characterization --- cutting forces --- tool servo diamond cutting --- data-dependent systems --- surface topography variation --- microstructured surfaces --- microlens array --- three-dimensional elliptical vibration cutting --- piezoelectric hysteresis --- Bouc–Wen model --- flower pollination algorithm --- dynamic switching probability strategy --- parameter identification --- atom probe tomography (APT) --- single-wedge --- lift-out --- focused ion beam (FIB) --- Al/Ni multilayers --- vibration-assisted electrochemical machining (ECM) --- blisk --- narrow channel --- high aspect ratio --- multi-physics coupling simulation --- machining stability --- n/a --- Bouc-Wen model