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Aerodynamics. --- Optical resonance. --- Optical fibers. --- Flame spraying. --- Optical measuring instruments. --- Microinstrumentation. --- Aerospace systems. --- Flow characteristics. --- Temperature sensors.

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This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.

History of engineering & technology --- Dual-Phase-Lag heat transfer model --- thermal simulation algorithm --- thermal measurements --- Finite Difference Method scheme --- Grünwald–Letnikov fractional derivative --- Krylov subspace-based model order reduction --- algorithm efficiency analysis --- relative error analysis --- algorithm convergence analysis --- computational complexity analysis --- finite difference method scheme --- BJT --- modelling --- self-heating --- silicon carbide --- SPICE --- IGBT --- DC–DC converter --- electrothermal model --- averaged model --- thermal phenomena --- diode–transistor switch --- power electronics --- multi-LED lighting modules --- device thermal coupling --- compact thermal models --- temperature sensors --- microprocessor --- throughput improvement --- inductors --- ferromagnetic cores --- thermal model --- transient thermal impedance --- thermal resistance --- electrothermal (ET) simulation --- finite-element method (FEM) --- model-order reduction (MOR) --- multicellular power MOSFET --- silicon carbide (SiC)

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This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.

History of engineering & technology --- Dual-Phase-Lag heat transfer model --- thermal simulation algorithm --- thermal measurements --- Finite Difference Method scheme --- Grünwald–Letnikov fractional derivative --- Krylov subspace-based model order reduction --- algorithm efficiency analysis --- relative error analysis --- algorithm convergence analysis --- computational complexity analysis --- finite difference method scheme --- BJT --- modelling --- self-heating --- silicon carbide --- SPICE --- IGBT --- DC–DC converter --- electrothermal model --- averaged model --- thermal phenomena --- diode–transistor switch --- power electronics --- multi-LED lighting modules --- device thermal coupling --- compact thermal models --- temperature sensors --- microprocessor --- throughput improvement --- inductors --- ferromagnetic cores --- thermal model --- transient thermal impedance --- thermal resistance --- electrothermal (ET) simulation --- finite-element method (FEM) --- model-order reduction (MOR) --- multicellular power MOSFET --- silicon carbide (SiC)

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This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.

Dual-Phase-Lag heat transfer model --- thermal simulation algorithm --- thermal measurements --- Finite Difference Method scheme --- Grünwald–Letnikov fractional derivative --- Krylov subspace-based model order reduction --- algorithm efficiency analysis --- relative error analysis --- algorithm convergence analysis --- computational complexity analysis --- finite difference method scheme --- BJT --- modelling --- self-heating --- silicon carbide --- SPICE --- IGBT --- DC–DC converter --- electrothermal model --- averaged model --- thermal phenomena --- diode–transistor switch --- power electronics --- multi-LED lighting modules --- device thermal coupling --- compact thermal models --- temperature sensors --- microprocessor --- throughput improvement --- inductors --- ferromagnetic cores --- thermal model --- transient thermal impedance --- thermal resistance --- electrothermal (ET) simulation --- finite-element method (FEM) --- model-order reduction (MOR) --- multicellular power MOSFET --- silicon carbide (SiC)

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In the past, when elements in sructures were composed of perishable materials, such as wood, the maintenance of houses, bridges, etc., was considered of vital importance for their safe use and to preserve their efficiency. With the advent of materials such as reinforced concrete and steel, given their relatively long useful life, periodic and constant maintenance has often been considered a secondary concern. When it was realized that even for structures fabricated with these materials that the useful life has an end and that it was being approached, planning maintenance became an important and non-negligible aspect. Thus, the concept of structural health monitoring (SHM) was introduced, designed, and implemented as a multidisciplinary method. Computational mechanics, static and dynamic analysis of structures, electronics, sensors, and, recently, the Internet of Things (IoT) and artificial intelligence (AI) are required, but it is also important to consider new materials, especially those with intrinsic self-diagnosis characteristics, and to use measurement and survey methods typical of modern geomatics, such as satellite surveys and highly sophisticated laser tools.

Medicine --- structural health monitoring --- jointless bridge --- high-speed railway --- bearing --- expansion device --- displacement analysis --- structural reliability estimation --- modal identification --- finite element model updating --- cyber-physical systems --- crowdsourcing --- temperature effects --- time-lag effect --- Fourier series expansion --- box-girder bridges --- structural engineering --- overall deformation monitoring --- perspective transformation --- edge detection --- close-range photogrammetry --- railway embankment --- condition assessment --- ground penetrating radar --- multi-attribute utility theory --- laser scanner --- line scanner --- structure monitoring --- deformation --- dynamic measurements --- scan-to-BIM --- point cloud --- HBIM --- FEM --- Rhinoceros --- terrestrial laser scanner (TLS) --- ground-based real aperture radar (GB-RAR) --- vibration frequency --- spectral analysis --- displacement --- structural health monitoring (SHM) --- vibration-based damage detection --- system identification --- subspace system identification (SSI) --- tie rod --- natural frequencies --- mode shapes --- root-mean-square error (RMSE) --- environmental monitoring --- long-range mapping --- MMS --- sub-millimetric EDM geodetic techniques --- damage detection --- damage localization --- hybrid approach --- neural network --- timber bridges --- stress-laminated timber decks --- monitoring --- humidity-temperature sensors --- wood moisture content --- multi-phase models --- finite element method --- moving load identification --- strain influence line --- load transverse distribution --- strain integral coefficient --- identification error --- n/a