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Connected intelligent sensing reshapes our society by empowering people with increasing new ways of mutual interactions. As integration technologies keep their scaling roadmap, the horizon of sensory applications is rapidly widening, thanks to myriad light-weight low-power or, in same cases even self-powered, smart devices with high-connectivity capabilities. CMOS integrated circuits technology is the best candidate to supply the required smartness and to pioneer these emerging sensory systems. As a result, new challenges are arising around the design of these integrated circuits and systems for sensory applications in terms of low-power edge computing, power management strategies, low-range wireless communications, integration with sensing devices. In this Special Issue recent advances in application-specific integrated circuits (ASIC) and systems for smart sensory applications in the following five emerging topics: (I) dedicated short-range communications transceivers; (II) digital smart sensors, (III) implantable neural interfaces, (IV) Power Management Strategies in wireless sensor nodes and (V) neuromorphic hardware.

Technology: general issues --- History of engineering & technology --- wake-up receiver --- digital controller --- reliability --- electronic toll collection (ETC) system --- dedicated short range communication (DSRC) --- temperature compensation --- piezoresistive --- pressure sensor --- negative temperature coefficient --- ACE-Q100 --- CMOS --- epilepsy --- seizure --- multichannel neural recording --- feature extraction --- closed-loop neurostimulator --- low-power --- low-noise amplifier --- implantable medical device --- switched capacitor --- voltage converter --- wide load range --- multiphase operation --- variable frequency --- integrated circuits --- EEPROM reprogrammable fuses --- memory cells --- trimming techniques with fuses --- digital temperature sensor --- temperature sensor with digital serial interface --- asynchronous control logic --- successive approximation register (SAR) --- wireless access in vehicular environments (WAVE) --- low power consumption --- capacitive digital to analog converter (CDAC) --- CMOS neural amplifier --- AC coupling --- pseudoresistor --- nonlinear distortion --- area-efficient design --- sensor node --- power mode --- wireless sensor networks --- power management --- spiking neural network --- leaky integrate and fire --- neuromorphic --- artificial neural networks --- artificial intelligence --- image classification --- capacitance-to-digital converter --- iterative-delay-chain discharge --- CMOS capacitive sensor interface

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Connected intelligent sensing reshapes our society by empowering people with increasing new ways of mutual interactions. As integration technologies keep their scaling roadmap, the horizon of sensory applications is rapidly widening, thanks to myriad light-weight low-power or, in same cases even self-powered, smart devices with high-connectivity capabilities. CMOS integrated circuits technology is the best candidate to supply the required smartness and to pioneer these emerging sensory systems. As a result, new challenges are arising around the design of these integrated circuits and systems for sensory applications in terms of low-power edge computing, power management strategies, low-range wireless communications, integration with sensing devices. In this Special Issue recent advances in application-specific integrated circuits (ASIC) and systems for smart sensory applications in the following five emerging topics: (I) dedicated short-range communications transceivers; (II) digital smart sensors, (III) implantable neural interfaces, (IV) Power Management Strategies in wireless sensor nodes and (V) neuromorphic hardware.

wake-up receiver --- digital controller --- reliability --- electronic toll collection (ETC) system --- dedicated short range communication (DSRC) --- temperature compensation --- piezoresistive --- pressure sensor --- negative temperature coefficient --- ACE-Q100 --- CMOS --- epilepsy --- seizure --- multichannel neural recording --- feature extraction --- closed-loop neurostimulator --- low-power --- low-noise amplifier --- implantable medical device --- switched capacitor --- voltage converter --- wide load range --- multiphase operation --- variable frequency --- integrated circuits --- EEPROM reprogrammable fuses --- memory cells --- trimming techniques with fuses --- digital temperature sensor --- temperature sensor with digital serial interface --- asynchronous control logic --- successive approximation register (SAR) --- wireless access in vehicular environments (WAVE) --- low power consumption --- capacitive digital to analog converter (CDAC) --- CMOS neural amplifier --- AC coupling --- pseudoresistor --- nonlinear distortion --- area-efficient design --- sensor node --- power mode --- wireless sensor networks --- power management --- spiking neural network --- leaky integrate and fire --- neuromorphic --- artificial neural networks --- artificial intelligence --- image classification --- capacitance-to-digital converter --- iterative-delay-chain discharge --- CMOS capacitive sensor interface

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Infrared (IR) technologies—from Herschel’s initial experiment in the 1800s to thermal detector development in the 1900s, followed by defense-focused developments using HgCdTe—have now incorporated a myriad of novel materials for a wide variety of applications in numerous high-impact fields. These include astronomy applications; composition identifications; toxic gas and explosive detection; medical diagnostics; and industrial, commercial, imaging, and security applications. Various types of semiconductor-based (including quantum well, dot, ring, wire, dot in well, hetero and/or homo junction, Type II super lattice, and Schottky) IR (photon) detectors, based on various materials (type IV, III-V, and II-VI), have been developed to satisfy these needs. Currently, room temperature detectors operating over a wide wavelength range from near IR to terahertz are available in various forms, including focal plane array cameras. Recent advances include performance enhancements by using surface Plasmon and ultrafast, high-sensitivity 2D materials for infrared sensing. Specialized detectors with features such as multiband, selectable wavelength, polarization sensitive, high operating temperature, and high performance (including but not limited to very low dark currents) are also being developed. This Special Issue highlights advances in these various types of infrared detectors based on various material systems.

Technology: general issues --- microbolometer --- infrared sensor --- complementary metal-oxide semiconductor (CMOS) --- high sensitivity --- temperature sensor --- microresonator --- MEMS --- clamped–clamped beam --- thermal detector --- Infrared detector --- strained layer superlattice --- InAs/InAsSb --- absorption coefficient --- barrier detector --- high operating temperature --- manganite --- heterostructure --- photodetector --- heterostructures --- split-off band --- wavelength extension --- device performance --- ultrasound transducer --- photoacoustic imaging --- piezoelectric --- micromachined --- CMUT --- PMUT --- optical ultrasound detection --- type-II superlattice --- infrared detector --- mid-wavelength infrared (MWIR) --- unipolar barrier --- InAs/GaSb --- T2SL --- IR --- TE-cooled --- spectroscopy --- RoHS --- MCT --- n/a --- clamped-clamped beam

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Flexible Electronics platforms are increasingly used in the fields of sensors, displays, and energy conversion with the ultimate goal of facilitating their ubiquitous integration in our daily lives. Some of the key advantages associated with flexible electronic platforms are: bendability, lightweight, elastic, conformally shaped, nonbreakable, roll-to-roll manufacturable, and large-area. To realize their full potential, however, it is necessary to develop new methods for the fabrication of multifunctional flexible electronics at a reduced cost and with an increased resistance to mechanical fatigue. Accordingly, this Special Issue seeks to showcase short communications, research papers, and review articles that focus on novel methodological development for the fabrication, and integration of flexible electronics in healthcare, environmental monitoring, displays and human-machine interactivity, robotics, communication and wireless networks, and energy conversion, management, and storage.

hydrophobic paper --- n/a --- conformal design --- stretchability --- stretchable circuits --- long-term plasticity --- tunnel encapsulation --- bio-integrated devices --- epidermal sensors --- artificial synapses --- droplet circuits --- stretchable electronics --- island-bridge --- bottom-up approaches --- liquid metal --- feedback control --- durability --- dry/wet conditions --- solution electronics --- nano-fabrication --- surface plasmon-polariton (SPP) --- electronic measurements --- Polyvinyl Alcohol --- wireless power --- quantum tunneling effect --- low-cost manufacture --- non-developable surface --- top-down approaches --- reliability --- microwave photonics --- tissue adhesives --- temperature sensor --- brain-like intelligence --- electron transport --- wearable stimulators --- variable optical attenuator (VOA) --- ionic conduction --- design metrics --- flexible electronics --- flexible organic electronics --- soft biological tissue --- neuromorphic computing --- wearable heater --- quantum computing --- epidermal electronics --- tunable adhesion --- paper electronics

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Silica and silicon-based nanostructures are now well-understood materials for which the technologies are mature. The most obvious applications, such as electronic devices, have been widely explored over the last two decades. The aim of this Special Issue is to bring together the state of the art in the field and to enable the emergence of new ideas and concepts for silicon and silica-based nanostructures.

Research & information: general --- Physics --- maize --- NPK --- SiO2-NPs --- productivity --- fertilizer --- mineral --- weevils --- LC50 --- toxicity --- mesoporous silica --- nanomaterials --- desulfurization --- fuel --- JP-8 --- black silicon --- light absorption enhanced --- micro-nano manufacturing --- nanometer surface --- nano-silica --- tricalcium aluminate --- pozzolanic reaction --- C-A-S-H gel --- silicon nanoparticles --- silicon nanowires --- synthesis --- high energy density --- lithium-ion batteries --- high-capacity anode --- VLS --- laser pyrolysis --- size effect --- shape effect --- biomass rice husk --- silicon --- nanocrystals --- luminescence --- high porosity --- pH sensor --- temperature sensor --- dual sensor --- metal-assisted chemical etching --- Si nanostructures --- high aspect ratio --- zone plate --- silicon nanowire --- nanowire array --- silicon anode --- n-type silicon anode --- Li-ion battery --- nanowires --- nanonets --- transistor --- integration process --- n/a --- Research. --- Physics.