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The prevalence of smart devices and cloud computing has led to an explosion in the amount of data generated by IoT devices. Moreover, emerging IoT applications, such as augmented and virtual reality (AR/VR), intelligent transportation systems, and smart factories require ultra-low latency for data communication and processing. Fog/edge computing is a new computing paradigm where fully distributed fog/edge nodes located nearby end devices provide computing resources. By analyzing, filtering, and processing at local fog/edge resources instead of transferring tremendous data to the centralized cloud servers, fog/edge computing can reduce the processing delay and network traffic significantly. With these advantages, fog/edge computing is expected to be one of the key enabling technologies for building the IoT infrastructure. Aiming to explore the recent research and development on fog/edge computing technologies for building an IoT infrastructure, this book collected 10 articles. The selected articles cover diverse topics such as resource management, service provisioning, task offloading and scheduling, container orchestration, and security on edge/fog computing infrastructure, which can help to grasp recent trends, as well as state-of-the-art algorithms of fog/edge computing technologies.

cloud computing --- container orchestration --- custom metrics --- Docker --- edge computing --- Horizontal Pod Autoscaling (HPA) --- Kubernetes --- Prometheus --- resource metrics --- fog computing --- task allocation --- multi-objective optimization --- evolutionary genetics --- hyper-angle --- crowding distance --- containers --- leader election --- load balancing --- stateful --- multi-access edge computing --- orchestrator --- task offloading --- fuzzy logic --- 5G --- fog/edge computing --- service provisioning --- service placement --- service offloading --- Internet of Things (IoT) --- task scheduling --- markov decision process (MDP) --- deep reinforcement learning (DRL) --- resource management --- algorithm classification --- evaluation framework --- web --- Web Assembly --- OpenCL --- LWC --- fast implementation --- Internet of things --- IoT actor --- data manager --- GDPR --- computing --- computational offloading --- dynamic offloading threshold --- minimizing delay --- minimizing energy consumption --- maximizing throughputs --- n/a

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This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.

History of engineering & technology --- lithium-ion battery --- thermal modelling --- electro-thermal model --- heat generation --- experimental validation --- thermal transient testing --- non-destructive testing --- thermal testability --- accuracy repeatability and reproducibility of thermal measurements --- thermal testing standards --- 3D IC --- microchannels --- liquid cooling --- compact thermal model --- thermal simulation --- hotspot --- thermal-aware task scheduling --- DVFS --- statistical analysis --- electronic packages --- detailed thermal model --- Joint Electron Device Engineering Council (JEDEC) metrics --- thermal impedance --- AlGaN-GaN HEMT --- TDTR --- thermal conductivity --- thermal interface resistance --- size effect --- phonon transport mechanisms --- nonlinear thermal model --- SPICE --- pulse transformer --- thermal phenomena --- self-heating --- modelling --- measurements --- BCI-DCTM --- ROM --- modal approach --- BGA --- module temperature --- solar energy --- heat transfer mechanisms --- power LED measurement and simulation --- life testing --- reliability testing --- LM-80 --- TM-21 --- LED lifetime modelling --- LED multi-domain modelling --- Spice-like modelling of LEDs --- lifetime extrapolation and modelling of LEDs --- beyond CMOS --- VO2 --- thermal-electronic circuits --- electro-thermal simulation --- vertical structure --- power LEDs --- thermal pads --- thermal resistance --- optical efficiency --- electronics cooling --- Light-emitting diodes --- CoB LEDs --- multi-domain modeling --- finite volume method --- phosphor modeling --- magnetic nanoparticle --- microfluidics --- CFD --- OpenFOAM --- two-phase solver --- rheology --- LED --- Delphi4LED --- digital twin --- digital luminaire design --- computation time --- Industry 4.0 --- lithium-ion battery --- thermal modelling --- electro-thermal model --- heat generation --- experimental validation --- thermal transient testing --- non-destructive testing --- thermal testability --- accuracy repeatability and reproducibility of thermal measurements --- thermal testing standards --- 3D IC --- microchannels --- liquid cooling --- compact thermal model --- thermal simulation --- hotspot --- thermal-aware task scheduling --- DVFS --- statistical analysis --- electronic packages --- detailed thermal model --- Joint Electron Device Engineering Council (JEDEC) metrics --- thermal impedance --- AlGaN-GaN HEMT --- TDTR --- thermal conductivity --- thermal interface resistance --- size effect --- phonon transport mechanisms --- nonlinear thermal model --- SPICE --- pulse transformer --- thermal phenomena --- self-heating --- modelling --- measurements --- BCI-DCTM --- ROM --- modal approach --- BGA --- module temperature --- solar energy --- heat transfer mechanisms --- power LED measurement and simulation --- life testing --- reliability testing --- LM-80 --- TM-21 --- LED lifetime modelling --- LED multi-domain modelling --- Spice-like modelling of LEDs --- lifetime extrapolation and modelling of LEDs --- beyond CMOS --- VO2 --- thermal-electronic circuits --- electro-thermal simulation --- vertical structure --- power LEDs --- thermal pads --- thermal resistance --- optical efficiency --- electronics cooling --- Light-emitting diodes --- CoB LEDs --- multi-domain modeling --- finite volume method --- phosphor modeling --- magnetic nanoparticle --- microfluidics --- CFD --- OpenFOAM --- two-phase solver --- rheology --- LED --- Delphi4LED --- digital twin --- digital luminaire design --- computation time --- Industry 4.0

Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.

lithium-ion battery --- thermal modelling --- electro-thermal model --- heat generation --- experimental validation --- thermal transient testing --- non-destructive testing --- thermal testability --- accuracy repeatability and reproducibility of thermal measurements --- thermal testing standards --- 3D IC --- microchannels --- liquid cooling --- compact thermal model --- thermal simulation --- hotspot --- thermal-aware task scheduling --- DVFS --- statistical analysis --- electronic packages --- detailed thermal model --- Joint Electron Device Engineering Council (JEDEC) metrics --- thermal impedance --- AlGaN-GaN HEMT --- TDTR --- thermal conductivity --- thermal interface resistance --- size effect --- phonon transport mechanisms --- nonlinear thermal model --- SPICE --- pulse transformer --- thermal phenomena --- self-heating --- modelling --- measurements --- BCI-DCTM --- ROM --- modal approach --- BGA --- module temperature --- solar energy --- heat transfer mechanisms --- power LED measurement and simulation --- life testing --- reliability testing --- LM-80 --- TM-21 --- LED lifetime modelling --- LED multi-domain modelling --- Spice-like modelling of LEDs --- lifetime extrapolation and modelling of LEDs --- beyond CMOS --- VO2 --- thermal-electronic circuits --- electro-thermal simulation --- vertical structure --- power LEDs --- thermal pads --- thermal resistance --- optical efficiency --- electronics cooling --- Light-emitting diodes --- CoB LEDs --- multi-domain modeling --- finite volume method --- phosphor modeling --- magnetic nanoparticle --- microfluidics --- CFD --- OpenFOAM --- two-phase solver --- rheology --- LED --- Delphi4LED --- digital twin --- digital luminaire design --- computation time --- Industry 4.0