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Research on radiation-tolerant electronics has increased rapidly over the past few years, resulting in many interesting approaches to modeling radiation effects and designing radiation-hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation-hardened electronics for space applications, high-energy physics experiments such as those on the Large Hadron Collider at CERN, and many terrestrial nuclear applications including nuclear energy and nuclear safety. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their susceptibility to ionizing radiation has raised many exciting challenges, which are expected to drive research in the coming decade. In this book we highlight recent breakthroughs in the study of radiation effects in advanced semiconductor devices, as well as in high-performance analog, mixed signal, RF, and digital integrated circuits. We also focus on advances in embedded radiation hardening in both FPGA and microcontroller systems and apply radiation-hardened embedded systems for cryptography and image processing, targeting space applications.

single event effects --- n/a --- radiation-hardening-by-design (RHBD) --- frequency divider by two --- single event upset --- Image processing --- CMOS analog integrated circuits --- FPGA --- total ionizing dose (TID) --- Impulse Sensitive Function --- soft error --- hardening by design --- radiation hardening by design --- X-rays --- Single-Event Upsets (SEUs) --- line buffer --- heavy ions --- VHDL --- FPGA-based digital controller --- radiation hardening by design (RHBD) --- radiation hardening --- SRAM-based FPGA --- proton irradiation --- ring oscillator --- sensor readout IC --- fault tolerance --- space application --- physical unclonable function --- voltage controlled oscillator (VCO) --- Ring Oscillators --- analog single-event transient (ASET) --- single event opset (SEU) --- SEB --- single event upsets --- bipolar transistor --- total ionizing dose --- protons --- triple modular redundancy (TMR) --- gain degradation --- space electronics --- saturation effect --- configuration memory --- Co-60 gamma radiation --- total ionization dose (TID) --- frequency synthesizers --- CMOS --- PLL --- TDC --- single-event upsets (SEUs) --- bandgap voltage reference (BGR) --- 4MR --- single-shot --- error rates --- Radiation Hardening by Design --- soft errors --- heavy-ions --- single-event effects (SEE) --- single event transient (SET) --- SEE testing --- proton irradiation effects --- RFIC --- single event upset (SEU) --- FMR --- ionization --- radiation tolerant --- triplex–duplex --- neutron irradiation effects --- digital integrated circuits --- single event gate rupture (SEGR) --- power MOSFETs --- ring-oscillator --- selective hardening --- voltage reference --- nuclear fusion --- TMR --- gamma-rays --- gamma ray --- instrumentation amplifier --- radiation effects --- reference circuits --- radiation-hardened --- triplex-duplex

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This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards.

3D-IC (three-dimensional integrated circuit) --- electromagnetic interference --- near field measurement --- SAC305 --- BGA --- low temperature --- fracture failure --- factorial design of experiment --- genetic algorithm optimization --- return loss --- multiple-input multiple-output (MIMO) --- single event effects --- linear energy transfer --- Monte Carlo simulation --- radiation hardness --- pressureless sintered micron silver joints --- deep space environment --- extreme thermal shocks --- reconstruction --- simulation --- elastic mechanical properties --- state of health --- remaining useful life --- electrochemistry based electrical model --- semi-empirical capacity fading model --- useful life distribution --- quality and reliability assurance --- single event effect --- microdosimetry --- lineal energy --- deconvolution --- gamma process --- lifetime --- measurement system analysis --- reliability estimation --- GaN --- operational amplifier --- proton therapy --- prompt gamma imaging --- 3D X-ray --- bias temperature-humidity reliability test --- conductive anodic filament (CAF) --- de-penalization --- finite element analysis --- n/a

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The rapid increase in new power electronic devices and converters for electric transportation and smart grid technologies requires a deepanalysis of their component performances, considering all of the different environmental scenarios, overload conditions, and high stressoperations. Therefore, evaluation of the reliability and availability of these devices becomes fundamental both from technical and economicalpoints of view. The rapid evolution of technologies and the high reliability level offered by these components have shown that estimating reliability through the traditional approaches is difficult, as historical failure data and/or past observed scenarios demonstrate. With the aim topropose new approaches for the evaluation of reliability, in this book, eleven innovative contributions are collected, all focusedon the reliability assessment of power electronic devices and related components.

Technology: general issues --- Energy industries & utilities --- photovoltaic system --- battery --- DC-coupled configuration --- AC-coupled configuration --- mission profile --- reliability --- LED --- thermal cycling test --- accelerated test --- solder joint --- cracks --- current harmonics --- voltage harmonics --- power electronic converters --- cables --- capacitors --- PPS --- high-power thyristors --- reverse recovery currents --- electromagnetic launching field --- segmented LSTM --- microgrid inverter --- IGBT reliability --- online evaluation --- fusion algorithm --- multi-chip IGBT module --- bond wire --- module transconductance --- temperature calibration --- failure monitoring --- sensor lamp --- low-light mode --- high-light mode --- AC motor drive --- junction temperature --- lifetime prediction --- power MOSFET --- loss modeling --- SiC MOSFET --- AlGaN/GaN HEMT --- cascode structure --- single event effects --- technology computer-aided design simulation --- heavy-ion irradiation experiment --- photovoltaic systems --- DC/AC converter --- maintenance --- power system faults --- availability --- condition monitoring --- power device --- power electronics --- n/a

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The rapid increase in new power electronic devices and converters for electric transportation and smart grid technologies requires a deepanalysis of their component performances, considering all of the different environmental scenarios, overload conditions, and high stressoperations. Therefore, evaluation of the reliability and availability of these devices becomes fundamental both from technical and economicalpoints of view. The rapid evolution of technologies and the high reliability level offered by these components have shown that estimating reliability through the traditional approaches is difficult, as historical failure data and/or past observed scenarios demonstrate. With the aim topropose new approaches for the evaluation of reliability, in this book, eleven innovative contributions are collected, all focusedon the reliability assessment of power electronic devices and related components.

Technology: general issues --- Energy industries & utilities --- photovoltaic system --- battery --- DC-coupled configuration --- AC-coupled configuration --- mission profile --- reliability --- LED --- thermal cycling test --- accelerated test --- solder joint --- cracks --- current harmonics --- voltage harmonics --- power electronic converters --- cables --- capacitors --- PPS --- high-power thyristors --- reverse recovery currents --- electromagnetic launching field --- segmented LSTM --- microgrid inverter --- IGBT reliability --- online evaluation --- fusion algorithm --- multi-chip IGBT module --- bond wire --- module transconductance --- temperature calibration --- failure monitoring --- sensor lamp --- low-light mode --- high-light mode --- AC motor drive --- junction temperature --- lifetime prediction --- power MOSFET --- loss modeling --- SiC MOSFET --- AlGaN/GaN HEMT --- cascode structure --- single event effects --- technology computer-aided design simulation --- heavy-ion irradiation experiment --- photovoltaic systems --- DC/AC converter --- maintenance --- power system faults --- availability --- condition monitoring --- power device --- power electronics

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This book features the manuscripts accepted for the Special Issue “Applications in Electronics Pervading Industry, Environment and Society—Sensing Systems and Pervasive Intelligence” of the MDPI journal Sensors. Most of the papers come from a selection of the best papers of the 2019 edition of the “Applications in Electronics Pervading Industry, Environment and Society” (APPLEPIES) Conference, which was held in November 2019. All these papers have been significantly enhanced with novel experimental results. The papers give an overview of the trends in research and development activities concerning the pervasive application of electronics in industry, the environment, and society. The focus of these papers is on cyber physical systems (CPS), with research proposals for new sensor acquisition and ADC (analog to digital converter) methods, high-speed communication systems, cybersecurity, big data management, and data processing including emerging machine learning techniques. Physical implementation aspects are discussed as well as the trade-off found between functional performance and hardware/system costs.

Technology: general issues --- model-based design --- FPGA --- HDL code generation --- wearable sensors --- embedded devices --- face recognition --- face verification --- biometric sensors --- deep learning --- distillation --- convolutional neural networks --- spatial transformer network --- video coding --- discrete cosine transform --- directional transform --- VLSI --- alternative representations to float numbers --- posit arithmetic --- Deep Neural Networks (DNNs) --- neural network activation functions --- surface electromyography --- event-driven --- functional electrical stimulation --- embedded system --- resampling --- interpolating polynomial --- polyphase filter --- digital circuit design --- ASIC --- bitmap indexing --- processing in memory --- memory wall --- big data --- internet of things --- intelligent sensors --- autonomous driving --- cyber security --- HW accelerator --- on-chip random number generator (RNG) --- SHA2 --- ASIC standard-cell --- machine learning --- edge computing --- edge analytics --- ANN --- k-NN --- SVM --- decision trees --- ARM --- X-Cube-AI --- STM32 Nucleo --- rad-hard --- PLL (phase-locked loop) --- SEE (single event effects) --- Spacefibre --- TID (total ionization dose) --- charge pump --- phase/frequency detector --- frequency divider --- ring oscillator --- LC-tank oscillator --- SpaceFibre --- rad-hard circuits --- radiation effects --- high-speed data transfer --- support attitude --- inertial measurement unit --- coal mining --- unscented Kalman filter --- quaternion --- gradient descent --- research data collection and sharing --- connected and automated driving --- deployment and field testing --- vehicular sensors --- impact assessment --- knowledge management --- collaborative project methodology --- n/a