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Micro and nano-electro-mechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within Integrated Circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors. The CMOS ICs and M/NEMS dies can be combined in the same package (SiP), or integrated within a single chip (SoC). In the SoC approach the M/NEMS devices are monolithically integrated together with CMOS circuitry allowing the development of compact and low-cost CMOS-M/NEMS devices for multiple applications (physical sensors, chemical sensors, biosensors, actuators, energy actuators, filters, mechanical relays, and others). On-chip CMOS electronics integration can overcome limitations related to the extremely low-level signals in sub-micrometer and nanometer scale electromechanical transducers enabling novel breakthrough applications. This Special Issue aims to gather high quality research contributions dealing with MEMS and NEMS devices monolithically integrated with CMOS, independently of the final application and fabrication approach adopted (MEMS-first, interleaved MEMS, MEMS-last or others).]

encapsulation --- n/a --- NEM memory switch --- magnetotransistor --- gas sensor --- nano-system array --- metal oxide (MOX) sensor --- capacitive pressure sensor --- real-time temperature compensation loop --- mechanical relays --- single-crystal silicon (SC-Si) --- MEMS relays --- MEMS --- oscillator --- micro-electro-mechanical system (MEMS) --- uncooled IR-bolometer --- microelectromechanical systems --- microbolometer --- programmable sustaining amplifier --- micro sensor --- CMOS-MEMS --- pierce oscillator --- MEMS resonators --- micro/nanoelectromechanical systems (MEMS/NEMS) --- resonator --- microhotplate --- NEMS --- application-specific integrated circuit (ASIC) --- MEMS modelling --- magnetic field --- chopper instrumentation amplifier --- microresonators --- interface circuit --- Hall effect --- thermal detector --- temperature sensor --- infrared sensor --- CMOS–NEMS --- CMOS --- atomic force microscope --- MEMS switches --- stent --- micro-electro-mechanical systems (MEMS) sensors --- nano resonator --- silicon-on-insulator (SOI) --- MEMS-ASIC integration --- Sigma-Delta --- MEMS characterization --- high-Q capacitive accelerometer --- mass sensors --- M3D --- CMOS-NEMS

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Ultra-precision machining is a multi-disciplinary research area that is an important branch of manufacturing technology. It targets achieving ultra-precision form or surface roughness accuracy, forming the backbone and support of today’s innovative technology industries in aerospace, semiconductors, optics, telecommunications, energy, etc. The increasing demand for components with ultra-precision accuracy has stimulated the development of ultra-precision machining technology in recent decades. Accordingly, this Special Issue includes reviews and regular research papers on the frontiers of ultra-precision machining and will serve as a platform for the communication of the latest development and innovations of ultra-precision machining technologies.

Technology: general issues --- History of engineering & technology --- fused silica --- small-scale damage --- magnetorheological removing method --- combined repairing process --- evolution law --- diamond grinding --- single crystal silicon --- subsurface damage --- crystal orientation --- spherical shell --- thin-walled part --- wall-thickness --- benchmark coincidence --- data processing --- ultra-precision machining --- computer-controlled optical surfacing --- dwell time algorithm --- removal function --- elementary approximation --- atmospheric pressure plasma jet --- continuous phase plate --- surface topography --- high accuracy and efficiency --- polar microstructures --- optimization --- machining parameters --- cutting strategy --- flexible grinding --- shear thickening fluid --- cluster effect --- high-shear low-pressure --- aluminum --- ion beam sputtering --- morphology evolution --- molecular dynamics --- electrochemical discharge machining (ECDM) --- material removal rate (MRR) --- electrode wear ratio (EWR) --- overcut (OC) --- electrical properties --- tool material --- diamond tool --- single-point diamond turning --- lubricant --- ferrous metal --- electrorheological polishing --- polishing tool --- roughness --- integrated electrode --- Nano-ZrO2 ceramics --- ultra-precision grinding --- surface residual material --- surface quality --- three-dimensional surface roughness --- reversal method --- eccentricity --- piezoelectric actuator --- flange --- dynamic modeling --- surface characterization --- cutting forces --- tool servo diamond cutting --- data-dependent systems --- surface topography variation --- microstructured surfaces --- microlens array --- three-dimensional elliptical vibration cutting --- piezoelectric hysteresis --- Bouc–Wen model --- flower pollination algorithm --- dynamic switching probability strategy --- parameter identification --- atom probe tomography (APT) --- single-wedge --- lift-out --- focused ion beam (FIB) --- Al/Ni multilayers --- vibration-assisted electrochemical machining (ECM) --- blisk --- narrow channel --- high aspect ratio --- multi-physics coupling simulation --- machining stability --- n/a --- Bouc-Wen model

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• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

Ultra-precision machining is a multi-disciplinary research area that is an important branch of manufacturing technology. It targets achieving ultra-precision form or surface roughness accuracy, forming the backbone and support of today’s innovative technology industries in aerospace, semiconductors, optics, telecommunications, energy, etc. The increasing demand for components with ultra-precision accuracy has stimulated the development of ultra-precision machining technology in recent decades. Accordingly, this Special Issue includes reviews and regular research papers on the frontiers of ultra-precision machining and will serve as a platform for the communication of the latest development and innovations of ultra-precision machining technologies.

fused silica --- small-scale damage --- magnetorheological removing method --- combined repairing process --- evolution law --- diamond grinding --- single crystal silicon --- subsurface damage --- crystal orientation --- spherical shell --- thin-walled part --- wall-thickness --- benchmark coincidence --- data processing --- ultra-precision machining --- computer-controlled optical surfacing --- dwell time algorithm --- removal function --- elementary approximation --- atmospheric pressure plasma jet --- continuous phase plate --- surface topography --- high accuracy and efficiency --- polar microstructures --- optimization --- machining parameters --- cutting strategy --- flexible grinding --- shear thickening fluid --- cluster effect --- high-shear low-pressure --- aluminum --- ion beam sputtering --- morphology evolution --- molecular dynamics --- electrochemical discharge machining (ECDM) --- material removal rate (MRR) --- electrode wear ratio (EWR) --- overcut (OC) --- electrical properties --- tool material --- diamond tool --- single-point diamond turning --- lubricant --- ferrous metal --- electrorheological polishing --- polishing tool --- roughness --- integrated electrode --- Nano-ZrO2 ceramics --- ultra-precision grinding --- surface residual material --- surface quality --- three-dimensional surface roughness --- reversal method --- eccentricity --- piezoelectric actuator --- flange --- dynamic modeling --- surface characterization --- cutting forces --- tool servo diamond cutting --- data-dependent systems --- surface topography variation --- microstructured surfaces --- microlens array --- three-dimensional elliptical vibration cutting --- piezoelectric hysteresis --- Bouc–Wen model --- flower pollination algorithm --- dynamic switching probability strategy --- parameter identification --- atom probe tomography (APT) --- single-wedge --- lift-out --- focused ion beam (FIB) --- Al/Ni multilayers --- vibration-assisted electrochemical machining (ECM) --- blisk --- narrow channel --- high aspect ratio --- multi-physics coupling simulation --- machining stability --- n/a --- Bouc-Wen model