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Book
Metal Micro-forming
Author:
Year: 2020 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

The miniaturization of industrial products is a global trend. Metal forming technology is not only suitable for mass production and excellent in productivity and cost reduction, but it is also a key processing method that is essential for products that utilize advantage of the mechanical and functional properties of metals. However, it is not easy to realize the processing even if the conventional metal forming technology is directly scaled down. This is because the characteristics of materials, processing methods, die and tools, etc., vary greatly with miniaturization. In metal micro forming technology, the size effect of major issues for micro forming have also been clarified academically. New processing methods for metal micro forming have also been developed by introducing new special processing techniques, and it is a new wave of innovation toward high precision, high degree of processing, and high flexibility. To date, several special issues and books have been published on micro-forming technology. This book contains 11 of the latest research results on metal micro forming technology. The editor believes that it will be very useful for understanding the state-of-the-art of metal micro forming technology and for understanding future trends.


Book
Metal Micro-forming
Author:
Year: 2020 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

The miniaturization of industrial products is a global trend. Metal forming technology is not only suitable for mass production and excellent in productivity and cost reduction, but it is also a key processing method that is essential for products that utilize advantage of the mechanical and functional properties of metals. However, it is not easy to realize the processing even if the conventional metal forming technology is directly scaled down. This is because the characteristics of materials, processing methods, die and tools, etc., vary greatly with miniaturization. In metal micro forming technology, the size effect of major issues for micro forming have also been clarified academically. New processing methods for metal micro forming have also been developed by introducing new special processing techniques, and it is a new wave of innovation toward high precision, high degree of processing, and high flexibility. To date, several special issues and books have been published on micro-forming technology. This book contains 11 of the latest research results on metal micro forming technology. The editor believes that it will be very useful for understanding the state-of-the-art of metal micro forming technology and for understanding future trends.


Book
Metal Micro-forming
Author:
Year: 2020 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute

Loading...
Export citation

Choose an application

Bookmark

Abstract

The miniaturization of industrial products is a global trend. Metal forming technology is not only suitable for mass production and excellent in productivity and cost reduction, but it is also a key processing method that is essential for products that utilize advantage of the mechanical and functional properties of metals. However, it is not easy to realize the processing even if the conventional metal forming technology is directly scaled down. This is because the characteristics of materials, processing methods, die and tools, etc., vary greatly with miniaturization. In metal micro forming technology, the size effect of major issues for micro forming have also been clarified academically. New processing methods for metal micro forming have also been developed by introducing new special processing techniques, and it is a new wave of innovation toward high precision, high degree of processing, and high flexibility. To date, several special issues and books have been published on micro-forming technology. This book contains 11 of the latest research results on metal micro forming technology. The editor believes that it will be very useful for understanding the state-of-the-art of metal micro forming technology and for understanding future trends.

Keywords

History of engineering & technology --- laser impact liquid flexible embossing --- microforming --- 3-D large area micro arrays --- liquid shock wave --- high strain rate forming --- numerical simulation --- carbon nanotubes --- feedstock --- homogeneity --- metallic powders --- micro hot embossing --- shaping --- plasma printing --- micro-texturing --- screen printing --- low-temperature plasma nitriding --- selective anisotropic nitrogen embedding --- selective hardening --- sand blasting --- AISI316 --- micro-meshing punch array --- copper plates --- resistance heating system --- surface modification --- free surface roughness evolution --- compression --- thin sheet metal --- micro metal forming --- ultrasonic --- orbital forming --- micro-tubes --- micro-tube drawing --- micro-hydroforming --- laser assisted --- severe plastic deformation --- micro-tube testing --- dieless drawing --- SUS304 stainless steel wires --- oxide layer --- finite element simulation --- surface texturing --- sheet metal forming --- in-situ observation --- micro-dimple --- lubricant --- microtube --- hydroforming --- T-shape bulging --- tube materials --- friction --- tube length --- micro hydroformability --- process window --- FE analysis --- microstructure --- size effects --- deformation characterization --- micro-rolling --- wire --- laser impact liquid flexible embossing --- microforming --- 3-D large area micro arrays --- liquid shock wave --- high strain rate forming --- numerical simulation --- carbon nanotubes --- feedstock --- homogeneity --- metallic powders --- micro hot embossing --- shaping --- plasma printing --- micro-texturing --- screen printing --- low-temperature plasma nitriding --- selective anisotropic nitrogen embedding --- selective hardening --- sand blasting --- AISI316 --- micro-meshing punch array --- copper plates --- resistance heating system --- surface modification --- free surface roughness evolution --- compression --- thin sheet metal --- micro metal forming --- ultrasonic --- orbital forming --- micro-tubes --- micro-tube drawing --- micro-hydroforming --- laser assisted --- severe plastic deformation --- micro-tube testing --- dieless drawing --- SUS304 stainless steel wires --- oxide layer --- finite element simulation --- surface texturing --- sheet metal forming --- in-situ observation --- micro-dimple --- lubricant --- microtube --- hydroforming --- T-shape bulging --- tube materials --- friction --- tube length --- micro hydroformability --- process window --- FE analysis --- microstructure --- size effects --- deformation characterization --- micro-rolling --- wire


Book
Radiation Tolerant Electronics
Author:
ISBN: 303921280X 3039212796 Year: 2019 Publisher: MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

Research on radiation-tolerant electronics has increased rapidly over the past few years, resulting in many interesting approaches to modeling radiation effects and designing radiation-hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation-hardened electronics for space applications, high-energy physics experiments such as those on the Large Hadron Collider at CERN, and many terrestrial nuclear applications including nuclear energy and nuclear safety. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their susceptibility to ionizing radiation has raised many exciting challenges, which are expected to drive research in the coming decade. In this book we highlight recent breakthroughs in the study of radiation effects in advanced semiconductor devices, as well as in high-performance analog, mixed signal, RF, and digital integrated circuits. We also focus on advances in embedded radiation hardening in both FPGA and microcontroller systems and apply radiation-hardened embedded systems for cryptography and image processing, targeting space applications.

Keywords

single event effects --- n/a --- radiation-hardening-by-design (RHBD) --- frequency divider by two --- single event upset --- Image processing --- CMOS analog integrated circuits --- FPGA --- total ionizing dose (TID) --- Impulse Sensitive Function --- soft error --- hardening by design --- radiation hardening by design --- X-rays --- Single-Event Upsets (SEUs) --- line buffer --- heavy ions --- VHDL --- FPGA-based digital controller --- radiation hardening by design (RHBD) --- radiation hardening --- SRAM-based FPGA --- proton irradiation --- ring oscillator --- sensor readout IC --- fault tolerance --- space application --- physical unclonable function --- voltage controlled oscillator (VCO) --- Ring Oscillators --- analog single-event transient (ASET) --- single event opset (SEU) --- SEB --- single event upsets --- bipolar transistor --- total ionizing dose --- protons --- triple modular redundancy (TMR) --- gain degradation --- space electronics --- saturation effect --- configuration memory --- Co-60 gamma radiation --- total ionization dose (TID) --- frequency synthesizers --- CMOS --- PLL --- TDC --- single-event upsets (SEUs) --- bandgap voltage reference (BGR) --- 4MR --- single-shot --- error rates --- Radiation Hardening by Design --- soft errors --- heavy-ions --- single-event effects (SEE) --- single event transient (SET) --- SEE testing --- proton irradiation effects --- RFIC --- single event upset (SEU) --- FMR --- ionization --- radiation tolerant --- triplex–duplex --- neutron irradiation effects --- digital integrated circuits --- single event gate rupture (SEGR) --- power MOSFETs --- ring-oscillator --- selective hardening --- voltage reference --- nuclear fusion --- TMR --- gamma-rays --- gamma ray --- instrumentation amplifier --- radiation effects --- reference circuits --- radiation-hardened --- triplex-duplex

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