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MEMS Packaging Technologies and 3D Integration
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Year: 2022 Publisher: MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

Keywords

Research & information: general --- Biology, life sciences --- heterogeneous integration --- wafer bonding --- wafer sealing --- room-temperature bonding --- Au-Au bonding --- surface activated bonding --- Au film thickness --- surface roughness --- microelectromechanical systems (MEMS) packaging --- inkjet printing --- redistribution layers --- capacitive micromachined ultrasound transducers (CMUT) --- fan-out wafer-level packaging (FOWLP) --- adhesion --- thin film metal --- parylene --- neural probe --- scotch tape test --- FEM --- MEMS resonator --- temperature coefficient --- thermal stress --- millimeter-wave --- redundant TSV --- equivalent circuit model --- S-parameters extraction --- technology evaluation --- MEMS and IC integration --- MCDM --- fuzzy AHP --- fuzzy VIKOR --- fan-out wafer-level package --- finite element --- glass substrate --- reliability life --- packaging-on-packaging --- thermal sensors --- TMOS sensor --- finite difference time domain --- optical and electromagnetics simulations --- finite element analysis --- ultrasonic bonding --- metal direct bonding --- microsystem integration --- biocompatible packaging --- implantable --- reliability --- Finite element method (FEM) --- simulation --- multilayer reactive bonding --- integrated nanostructure-multilayer reactive system --- spontaneous self-ignition --- self-propagating exothermic reaction --- Pd/Al reactive multilayer system --- Ni/Al reactive multilayer system --- low-temperature MEMS packaging --- crack propagation --- microbump --- deflection angle --- stress intensity factor (SIF) --- polymer packaging --- neural interface --- chronic implantation --- heterogeneous integration --- wafer bonding --- wafer sealing --- room-temperature bonding --- Au-Au bonding --- surface activated bonding --- Au film thickness --- surface roughness --- microelectromechanical systems (MEMS) packaging --- inkjet printing --- redistribution layers --- capacitive micromachined ultrasound transducers (CMUT) --- fan-out wafer-level packaging (FOWLP) --- adhesion --- thin film metal --- parylene --- neural probe --- scotch tape test --- FEM --- MEMS resonator --- temperature coefficient --- thermal stress --- millimeter-wave --- redundant TSV --- equivalent circuit model --- S-parameters extraction --- technology evaluation --- MEMS and IC integration --- MCDM --- fuzzy AHP --- fuzzy VIKOR --- fan-out wafer-level package --- finite element --- glass substrate --- reliability life --- packaging-on-packaging --- thermal sensors --- TMOS sensor --- finite difference time domain --- optical and electromagnetics simulations --- finite element analysis --- ultrasonic bonding --- metal direct bonding --- microsystem integration --- biocompatible packaging --- implantable --- reliability --- Finite element method (FEM) --- simulation --- multilayer reactive bonding --- integrated nanostructure-multilayer reactive system --- spontaneous self-ignition --- self-propagating exothermic reaction --- Pd/Al reactive multilayer system --- Ni/Al reactive multilayer system --- low-temperature MEMS packaging --- crack propagation --- microbump --- deflection angle --- stress intensity factor (SIF) --- polymer packaging --- neural interface --- chronic implantation


Book
MEMS Packaging Technologies and 3D Integration
Author:
Year: 2022 Publisher: MDPI - Multidisciplinary Digital Publishing Institute

Loading...
Export citation

Choose an application

Bookmark

Abstract

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

Keywords

Research & information: general --- Biology, life sciences --- heterogeneous integration --- wafer bonding --- wafer sealing --- room-temperature bonding --- Au-Au bonding --- surface activated bonding --- Au film thickness --- surface roughness --- microelectromechanical systems (MEMS) packaging --- inkjet printing --- redistribution layers --- capacitive micromachined ultrasound transducers (CMUT) --- fan-out wafer-level packaging (FOWLP) --- adhesion --- thin film metal --- parylene --- neural probe --- scotch tape test --- FEM --- MEMS resonator --- temperature coefficient --- thermal stress --- millimeter-wave --- redundant TSV --- equivalent circuit model --- S-parameters extraction --- technology evaluation --- MEMS and IC integration --- MCDM --- fuzzy AHP --- fuzzy VIKOR --- fan-out wafer-level package --- finite element --- glass substrate --- reliability life --- packaging-on-packaging --- thermal sensors --- TMOS sensor --- finite difference time domain --- optical and electromagnetics simulations --- finite element analysis --- ultrasonic bonding --- metal direct bonding --- microsystem integration --- biocompatible packaging --- implantable --- reliability --- Finite element method (FEM) --- simulation --- multilayer reactive bonding --- integrated nanostructure-multilayer reactive system --- spontaneous self-ignition --- self-propagating exothermic reaction --- Pd/Al reactive multilayer system --- Ni/Al reactive multilayer system --- low-temperature MEMS packaging --- crack propagation --- microbump --- deflection angle --- stress intensity factor (SIF) --- polymer packaging --- neural interface --- chronic implantation --- n/a


Book
MEMS Packaging Technologies and 3D Integration
Author:
Year: 2022 Publisher: MDPI - Multidisciplinary Digital Publishing Institute

Loading...
Export citation

Choose an application

Bookmark

Abstract

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

Keywords

heterogeneous integration --- wafer bonding --- wafer sealing --- room-temperature bonding --- Au-Au bonding --- surface activated bonding --- Au film thickness --- surface roughness --- microelectromechanical systems (MEMS) packaging --- inkjet printing --- redistribution layers --- capacitive micromachined ultrasound transducers (CMUT) --- fan-out wafer-level packaging (FOWLP) --- adhesion --- thin film metal --- parylene --- neural probe --- scotch tape test --- FEM --- MEMS resonator --- temperature coefficient --- thermal stress --- millimeter-wave --- redundant TSV --- equivalent circuit model --- S-parameters extraction --- technology evaluation --- MEMS and IC integration --- MCDM --- fuzzy AHP --- fuzzy VIKOR --- fan-out wafer-level package --- finite element --- glass substrate --- reliability life --- packaging-on-packaging --- thermal sensors --- TMOS sensor --- finite difference time domain --- optical and electromagnetics simulations --- finite element analysis --- ultrasonic bonding --- metal direct bonding --- microsystem integration --- biocompatible packaging --- implantable --- reliability --- Finite element method (FEM) --- simulation --- multilayer reactive bonding --- integrated nanostructure-multilayer reactive system --- spontaneous self-ignition --- self-propagating exothermic reaction --- Pd/Al reactive multilayer system --- Ni/Al reactive multilayer system --- low-temperature MEMS packaging --- crack propagation --- microbump --- deflection angle --- stress intensity factor (SIF) --- polymer packaging --- neural interface --- chronic implantation --- n/a

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