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This eBook is a collection of articles from a Frontiers Research Topic. Frontiers Research Topics are very popular trademarks of the Frontiers Journals Series: they are collections of at least ten articles, all centered on a particular subject. With their unique mix of varied contributions from Original Research to Review Articles, Frontiers Research Topics unify the most influential researchers, the latest key findings and historical advances in a hot research area! Find out more on how to host your own Frontiers Research Topic or contribute to one as an author by contacting the Frontiers Editorial Office: frontiersin.org/about/contact

Science: general issues --- Neurosciences --- bionics --- electrostimulation --- nervous system --- prosthesis --- cochlear --- modeling --- electrode --- neural interface --- bionics --- electrostimulation --- nervous system --- prosthesis --- cochlear --- modeling --- electrode --- neural interface

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Neural electrodes enable the recording and stimulation of bioelectrical activity in the nervous system. This technology provides neuroscientists with the means to probe the functionality of neural circuitry in both health and disease. In addition, neural electrodes can deliver therapeutic stimulation for the relief of debilitating symptoms associated with neurological disorders such as Parkinson’s disease and may serve as the basis for the restoration of sensory perception through peripheral nerve and brain regions after disease or injury. Lastly, microscale neural electrodes recording signals associated with volitional movement in paralyzed individuals can be decoded for controlling external devices and prosthetic limbs or driving the stimulation of paralyzed muscles for functional movements. In spite of the promise of neural electrodes for a range of applications, chronic performance remains a goal for long-term basic science studies, as well as clinical applications. New perspectives and opportunities from fields including tissue biomechanics, materials science, and biological mechanisms of inflammation and neurodegeneration are critical to advances in neural electrode technology. This Special Issue will address the state-of-the-art knowledge and emerging opportunities for the development and demonstration of advanced neural electrodes.

n/a --- closed-loop --- in vivo imaging --- education --- thermoresistance --- neural probe --- electroless plating --- neural stimulation and recording --- peripheral nerve stimulation --- shape-memory-polymer --- artifact --- sensor interface --- magnetic coupling --- neuroprosthetics --- intracortical implant --- µECoG --- neural interfaces --- implantable --- electrochemistry --- shape memory polymer --- neuroscience --- micromachine --- microelectromechanical systems --- stiffness --- Parylene C --- intracranial electrodes --- chronic implantation --- neural interfacing --- microelectrodes --- multiplexing --- microstimulators --- freely-behaving --- windowed integration sampling --- system-on-chip --- brain-machine interfaces --- insertion force --- microelectrode array --- vagus nerve --- diversity --- micro-electromechanical systems (MEMS) technologies --- mixed-signal feedback --- temperature monitoring --- foreign body reaction --- peripheral nerves --- brain–computer interface --- multi-disciplinary --- neurotechnology --- photolithography --- micro-electrocorticography --- robust microelectrode --- conscious recording --- electrode array --- dopamine --- softening --- sciatic nerve --- bio-inspired --- neural prostheses --- neuroscientific research --- bidirectional --- LED chip --- microfluidic device --- electrode–tissue interface --- impedance --- intracortical --- silicon carbide --- three-dimensional --- bias --- micro-electromechanical systems (MEMS) --- silicon neural probes --- electrode degradation --- chronic --- microelectrode --- biocompatibility --- optogenetics --- fast-scan cyclic voltammetry (FSCV) --- glial encapsulation --- deep brain stimulation --- electrocorticography --- electrophysiology --- fast scan cyclic voltammetry --- precision medicine --- microfabrication --- BRAIN Initiative --- polymer --- magnetic resonance imaging --- polymer nanocomposite --- liquid crystal elastomer --- silicon probe --- training --- tissue response --- graphene --- electrode --- glassy carbon electrode --- immune response --- electrode implantation --- dextran --- immunohistochemistry --- neural interface response --- amorphous silicon carbide --- Utah electrode arrays --- neural amplifier --- neural electrode array --- neuromodulation --- in vivo electrophysiology --- neuronal recordings --- neural recording --- ECoG --- gene modification --- neural interface --- wireless --- enteric nervous system --- cellulose nanocrystals --- brain-computer interface --- electrode-tissue interface

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MEMS devices are found in many of today’s electronic devices and systems, from air-bag sensors in cars to smart phones, embedded systems, etc. Increasingly, the reduction in dimensions has led to nanometer-scale devices, called NEMS. The plethora of applications on the commercial market speaks for itself, and especially for the highly precise manufacturing of silicon-based MEMS and NEMS. While this is a tremendous achievement, silicon as a material has some drawbacks, mainly in the area of mechanical fatigue and thermal properties. Silicon carbide (SiC), a well-known wide-bandgap semiconductor whose adoption in commercial products is experiening exponential growth, especially in the power electronics arena. While SiC MEMS have been around for decades, in this Special Issue we seek to capture both an overview of the devices that have been demonstrated to date, as well as bring new technologies and progress in the MEMS processing area to the forefront. Thus, this Special Issue seeks to showcase research papers, short communications, and review articles that focus on: (1) novel designs, fabrication, control, and modeling of SiC MEMS and NEMS based on all kinds of actuation mechanisms; and (2) new developments in applying SiC MEMS and NEMS in consumer electronics, optical communications, industry, medicine, agriculture, space, and defense.

Engineering --- History. --- high-power impulse magnetron sputtering (HiPIMS) --- silicon carbide --- aluminum nitride --- thin film --- Rutherford backscattering spectrometry (RBS) --- grazing incidence X-ray diffraction (GIXRD) --- Raman spectroscopy --- 6H-SiC --- indentation --- deformation --- material removal mechanisms --- critical load --- 4H-SiC --- critical depth of cut --- Berkovich indenter --- cleavage strength --- nanoscratching --- power electronics --- high-temperature converters --- MEMS devices --- SiC power electronic devices --- neural interface --- neural probe --- neural implant --- microelectrode array --- MEA --- SiC --- 3C-SiC --- doped SiC --- n-type --- p-type --- amorphous SiC --- epitaxial growth --- electrochemical characterization --- MESFET --- simulation --- PAE --- bulk micromachining --- electrochemical etching --- circular membrane --- bulge test --- vibrometry --- mechanical properties --- Young’s modulus --- residual stress --- FEM --- semiconductor radiation detector --- microstrip detector --- power module --- negative gate-source voltage spike --- 4H-SiC, epitaxial layer --- Schottky barrier --- radiation detector --- point defects --- deep level transient spectroscopy (DLTS) --- thermally stimulated current spectroscopy (TSC) --- electron beam induced current spectroscopy (EBIC) --- pulse height spectroscopy (PHS) --- n/a --- Young's modulus

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This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

Research & information: general --- Biology, life sciences --- heterogeneous integration --- wafer bonding --- wafer sealing --- room-temperature bonding --- Au-Au bonding --- surface activated bonding --- Au film thickness --- surface roughness --- microelectromechanical systems (MEMS) packaging --- inkjet printing --- redistribution layers --- capacitive micromachined ultrasound transducers (CMUT) --- fan-out wafer-level packaging (FOWLP) --- adhesion --- thin film metal --- parylene --- neural probe --- scotch tape test --- FEM --- MEMS resonator --- temperature coefficient --- thermal stress --- millimeter-wave --- redundant TSV --- equivalent circuit model --- S-parameters extraction --- technology evaluation --- MEMS and IC integration --- MCDM --- fuzzy AHP --- fuzzy VIKOR --- fan-out wafer-level package --- finite element --- glass substrate --- reliability life --- packaging-on-packaging --- thermal sensors --- TMOS sensor --- finite difference time domain --- optical and electromagnetics simulations --- finite element analysis --- ultrasonic bonding --- metal direct bonding --- microsystem integration --- biocompatible packaging --- implantable --- reliability --- Finite element method (FEM) --- simulation --- multilayer reactive bonding --- integrated nanostructure-multilayer reactive system --- spontaneous self-ignition --- self-propagating exothermic reaction --- Pd/Al reactive multilayer system --- Ni/Al reactive multilayer system --- low-temperature MEMS packaging --- crack propagation --- microbump --- deflection angle --- stress intensity factor (SIF) --- polymer packaging --- neural interface --- chronic implantation --- heterogeneous integration --- wafer bonding --- wafer sealing --- room-temperature bonding --- Au-Au bonding --- surface activated bonding --- Au film thickness --- surface roughness --- microelectromechanical systems (MEMS) packaging --- inkjet printing --- redistribution layers --- capacitive micromachined ultrasound transducers (CMUT) --- fan-out wafer-level packaging (FOWLP) --- adhesion --- thin film metal --- parylene --- neural probe --- scotch tape test --- FEM --- MEMS resonator --- temperature coefficient --- thermal stress --- millimeter-wave --- redundant TSV --- equivalent circuit model --- S-parameters extraction --- technology evaluation --- MEMS and IC integration --- MCDM --- fuzzy AHP --- fuzzy VIKOR --- fan-out wafer-level package --- finite element --- glass substrate --- reliability life --- packaging-on-packaging --- thermal sensors --- TMOS sensor --- finite difference time domain --- optical and electromagnetics simulations --- finite element analysis --- ultrasonic bonding --- metal direct bonding --- microsystem integration --- biocompatible packaging --- implantable --- reliability --- Finite element method (FEM) --- simulation --- multilayer reactive bonding --- integrated nanostructure-multilayer reactive system --- spontaneous self-ignition --- self-propagating exothermic reaction --- Pd/Al reactive multilayer system --- Ni/Al reactive multilayer system --- low-temperature MEMS packaging --- crack propagation --- microbump --- deflection angle --- stress intensity factor (SIF) --- polymer packaging --- neural interface --- chronic implantation

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This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

heterogeneous integration --- wafer bonding --- wafer sealing --- room-temperature bonding --- Au-Au bonding --- surface activated bonding --- Au film thickness --- surface roughness --- microelectromechanical systems (MEMS) packaging --- inkjet printing --- redistribution layers --- capacitive micromachined ultrasound transducers (CMUT) --- fan-out wafer-level packaging (FOWLP) --- adhesion --- thin film metal --- parylene --- neural probe --- scotch tape test --- FEM --- MEMS resonator --- temperature coefficient --- thermal stress --- millimeter-wave --- redundant TSV --- equivalent circuit model --- S-parameters extraction --- technology evaluation --- MEMS and IC integration --- MCDM --- fuzzy AHP --- fuzzy VIKOR --- fan-out wafer-level package --- finite element --- glass substrate --- reliability life --- packaging-on-packaging --- thermal sensors --- TMOS sensor --- finite difference time domain --- optical and electromagnetics simulations --- finite element analysis --- ultrasonic bonding --- metal direct bonding --- microsystem integration --- biocompatible packaging --- implantable --- reliability --- Finite element method (FEM) --- simulation --- multilayer reactive bonding --- integrated nanostructure-multilayer reactive system --- spontaneous self-ignition --- self-propagating exothermic reaction --- Pd/Al reactive multilayer system --- Ni/Al reactive multilayer system --- low-temperature MEMS packaging --- crack propagation --- microbump --- deflection angle --- stress intensity factor (SIF) --- polymer packaging --- neural interface --- chronic implantation --- n/a