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Mechanical alloying is a technique of producing alloys and compounds that permits the development of metastable materials (with amorphous or nanocrystalline microstructure) or the fabrication of solid solutions with extended solubility. The elements or compounds to be mixed (usually as powders) are introduced in jars usually under a controlled atmosphere. Regarding the scope of this book, advanced materials have been developed by mechanical alloying: Fe–X–B–Cu (X = Nb, NiZr) nanocrystalline alloys, mixtures of the binary Fe–Mn and Fe–Cr alloys with chromium and manganese nitrides, Mn–Al–Co and Mn–Fe alloys, non-equiatomic refractory high-entropy alloys, nanocrystalline Fe–Cr steels, nanaocrystalline Mn–Co–Fe–Ge–Si alloys, Al–Y2O3 nanocomposite, and hydride-forming alloys. Likewise, production conditions and ulterior treatments can provide readers interesting ideas about the procedure to produce alloys with specific microstructure and functional behavior (mechanical, magnetic, corrosion resistance, hydrogen storage, magnetocaloric effect, wastewater treatment, and so on). As an example, to obtain the improvement in the functional properties of the alloys and compounds, sometimes controlled annealing is needed (annealing provokes the relaxation of the mechanical-induced strain). Furthermore, the powders can be consolidated (press, spark plasma sintering,and microwave sintering) to obtain bulk materials.
Technology. --- aluminum --- yttrium oxide (yttria) --- mechanical alloying --- microwave sintering --- microstructure and mechanical properties --- half-Heusler alloys --- Mössbauer spectroscopy --- metal hydrides --- hydrogen storage --- hydriding kinetics --- surface modification --- refractory --- high entropy alloy --- phase transformation --- mechanical properties --- reactive black 5 --- decolorization --- UV-visible spectrophotometry --- LC-MS analysis --- austenitic alloys --- high-nitrogen steels --- atomic redistribution --- point defects --- microstructure --- Fe based alloys --- nanocrystalline (NC) alloy --- microcrystalline (MC) alloy --- ball-milling --- oxidation resistance --- aluminum --- yttrium oxide (yttria) --- mechanical alloying --- microwave sintering --- microstructure and mechanical properties --- half-Heusler alloys --- Mössbauer spectroscopy --- metal hydrides --- hydrogen storage --- hydriding kinetics --- surface modification --- refractory --- high entropy alloy --- phase transformation --- mechanical properties --- reactive black 5 --- decolorization --- UV-visible spectrophotometry --- LC-MS analysis --- austenitic alloys --- high-nitrogen steels --- atomic redistribution --- point defects --- microstructure --- Fe based alloys --- nanocrystalline (NC) alloy --- microcrystalline (MC) alloy --- ball-milling --- oxidation resistance
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Mechanical alloying is a technique of producing alloys and compounds that permits the development of metastable materials (with amorphous or nanocrystalline microstructure) or the fabrication of solid solutions with extended solubility. The elements or compounds to be mixed (usually as powders) are introduced in jars usually under a controlled atmosphere. Regarding the scope of this book, advanced materials have been developed by mechanical alloying: Fe–X–B–Cu (X = Nb, NiZr) nanocrystalline alloys, mixtures of the binary Fe–Mn and Fe–Cr alloys with chromium and manganese nitrides, Mn–Al–Co and Mn–Fe alloys, non-equiatomic refractory high-entropy alloys, nanocrystalline Fe–Cr steels, nanaocrystalline Mn–Co–Fe–Ge–Si alloys, Al–Y2O3 nanocomposite, and hydride-forming alloys. Likewise, production conditions and ulterior treatments can provide readers interesting ideas about the procedure to produce alloys with specific microstructure and functional behavior (mechanical, magnetic, corrosion resistance, hydrogen storage, magnetocaloric effect, wastewater treatment, and so on). As an example, to obtain the improvement in the functional properties of the alloys and compounds, sometimes controlled annealing is needed (annealing provokes the relaxation of the mechanical-induced strain). Furthermore, the powders can be consolidated (press, spark plasma sintering,and microwave sintering) to obtain bulk materials.
Technology: general issues --- aluminum --- yttrium oxide (yttria) --- mechanical alloying --- microwave sintering --- microstructure and mechanical properties --- half-Heusler alloys --- Mössbauer spectroscopy --- metal hydrides --- hydrogen storage --- hydriding kinetics --- surface modification --- refractory --- high entropy alloy --- phase transformation --- mechanical properties --- reactive black 5 --- decolorization --- UV-visible spectrophotometry --- LC-MS analysis --- austenitic alloys --- high-nitrogen steels --- atomic redistribution --- point defects --- microstructure --- Fe based alloys --- nanocrystalline (NC) alloy --- microcrystalline (MC) alloy --- ball-milling --- oxidation resistance --- n/a --- Mössbauer spectroscopy --- Technology.
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Mechanical alloying is a technique of producing alloys and compounds that permits the development of metastable materials (with amorphous or nanocrystalline microstructure) or the fabrication of solid solutions with extended solubility. The elements or compounds to be mixed (usually as powders) are introduced in jars usually under a controlled atmosphere. Regarding the scope of this book, advanced materials have been developed by mechanical alloying: Fe–X–B–Cu (X = Nb, NiZr) nanocrystalline alloys, mixtures of the binary Fe–Mn and Fe–Cr alloys with chromium and manganese nitrides, Mn–Al–Co and Mn–Fe alloys, non-equiatomic refractory high-entropy alloys, nanocrystalline Fe–Cr steels, nanaocrystalline Mn–Co–Fe–Ge–Si alloys, Al–Y2O3 nanocomposite, and hydride-forming alloys. Likewise, production conditions and ulterior treatments can provide readers interesting ideas about the procedure to produce alloys with specific microstructure and functional behavior (mechanical, magnetic, corrosion resistance, hydrogen storage, magnetocaloric effect, wastewater treatment, and so on). As an example, to obtain the improvement in the functional properties of the alloys and compounds, sometimes controlled annealing is needed (annealing provokes the relaxation of the mechanical-induced strain). Furthermore, the powders can be consolidated (press, spark plasma sintering,and microwave sintering) to obtain bulk materials.
aluminum --- yttrium oxide (yttria) --- mechanical alloying --- microwave sintering --- microstructure and mechanical properties --- half-Heusler alloys --- Mössbauer spectroscopy --- metal hydrides --- hydrogen storage --- hydriding kinetics --- surface modification --- refractory --- high entropy alloy --- phase transformation --- mechanical properties --- reactive black 5 --- decolorization --- UV-visible spectrophotometry --- LC-MS analysis --- austenitic alloys --- high-nitrogen steels --- atomic redistribution --- point defects --- microstructure --- Fe based alloys --- nanocrystalline (NC) alloy --- microcrystalline (MC) alloy --- ball-milling --- oxidation resistance --- n/a --- Mössbauer spectroscopy --- Technology.
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Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials.
Technology: general issues --- Energy industries & utilities --- electromagnetic bandgap (EBG) --- dual perforation (DP) --- parallel-plate noise --- power delivery network (PDN) --- printed circuit board (PCB) --- meander split --- power/ground plane --- crosstalk --- signal integrity --- equivalent circuit --- capacitive and magnetic coupling --- hall-effect current sensors --- commercial current sensor --- electromagnetic compatibility (EMC) --- electromagnetic interference (EMI) --- direct power injection (DPI) test --- transverse-electromagnetic (TEM) test --- bulk current injection (BCI) test --- Spread Spectrum --- DC–DC power converters --- digital communications --- channel capacity --- resonant coupling --- Electromagnetic Interferences --- Amplifiers --- CMOS integrated circuits --- susceptibility of the output pin --- electromagnetic compatibility --- power electronics EMC --- EMI mitigation techniques --- EMI filter design and optimization --- common mode noise --- EMI modeling --- Fourier series --- impedance balancing --- resonant frequency --- battery management system (BMS) --- Li-ion battery pack --- electric vehicles (EVs) --- hybrid electric vehicles (HEVs) --- IC-level EMC --- susceptibility to electromagnetic interference (EMI) --- direct power injection (DPI) --- anechoic chamber --- polyaniline --- gelatin --- composite --- microwave absorption --- dielectric permittivity --- electrical conductivity --- shielding effectiveness --- biochar --- eco-friendly material --- cementitious composites --- waveguides --- electromagnetic interference (EMI) suppressors --- sleeve ferrite cores --- cable filtering --- nanocrystalline (NC) --- split-core --- snap ferrite --- gap --- DC currents --- relative permeability --- impedance --- conducted emissions --- Discrete Wavelet Transform --- electromagnetic interference --- Empirical Mode Decomposition --- harmonics --- Switched-Mode Power Supplies --- transients --- Wavelet Packet Transform --- electromagnetic bandgap (EBG) --- dual perforation (DP) --- parallel-plate noise --- power delivery network (PDN) --- printed circuit board (PCB) --- meander split --- power/ground plane --- crosstalk --- signal integrity --- equivalent circuit --- capacitive and magnetic coupling --- hall-effect current sensors --- commercial current sensor --- electromagnetic compatibility (EMC) --- electromagnetic interference (EMI) --- direct power injection (DPI) test --- transverse-electromagnetic (TEM) test --- bulk current injection (BCI) test --- Spread Spectrum --- DC–DC power converters --- digital communications --- channel capacity --- resonant coupling --- Electromagnetic Interferences --- Amplifiers --- CMOS integrated circuits --- susceptibility of the output pin --- electromagnetic compatibility --- power electronics EMC --- EMI mitigation techniques --- EMI filter design and optimization --- common mode noise --- EMI modeling --- Fourier series --- impedance balancing --- resonant frequency --- battery management system (BMS) --- Li-ion battery pack --- electric vehicles (EVs) --- hybrid electric vehicles (HEVs) --- IC-level EMC --- susceptibility to electromagnetic interference (EMI) --- direct power injection (DPI) --- anechoic chamber --- polyaniline --- gelatin --- composite --- microwave absorption --- dielectric permittivity --- electrical conductivity --- shielding effectiveness --- biochar --- eco-friendly material --- cementitious composites --- waveguides --- electromagnetic interference (EMI) suppressors --- sleeve ferrite cores --- cable filtering --- nanocrystalline (NC) --- split-core --- snap ferrite --- gap --- DC currents --- relative permeability --- impedance --- conducted emissions --- Discrete Wavelet Transform --- electromagnetic interference --- Empirical Mode Decomposition --- harmonics --- Switched-Mode Power Supplies --- transients --- Wavelet Packet Transform
Choose an application
Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials.
Technology: general issues --- Energy industries & utilities --- electromagnetic bandgap (EBG) --- dual perforation (DP) --- parallel-plate noise --- power delivery network (PDN) --- printed circuit board (PCB) --- meander split --- power/ground plane --- crosstalk --- signal integrity --- equivalent circuit --- capacitive and magnetic coupling --- hall-effect current sensors --- commercial current sensor --- electromagnetic compatibility (EMC) --- electromagnetic interference (EMI) --- direct power injection (DPI) test --- transverse-electromagnetic (TEM) test --- bulk current injection (BCI) test --- Spread Spectrum --- DC–DC power converters --- digital communications --- channel capacity --- resonant coupling --- Electromagnetic Interferences --- Amplifiers --- CMOS integrated circuits --- susceptibility of the output pin --- electromagnetic compatibility --- power electronics EMC --- EMI mitigation techniques --- EMI filter design and optimization --- common mode noise --- EMI modeling --- Fourier series --- impedance balancing --- resonant frequency --- battery management system (BMS) --- Li-ion battery pack --- electric vehicles (EVs) --- hybrid electric vehicles (HEVs) --- IC-level EMC --- susceptibility to electromagnetic interference (EMI) --- direct power injection (DPI) --- anechoic chamber --- polyaniline --- gelatin --- composite --- microwave absorption --- dielectric permittivity --- electrical conductivity --- shielding effectiveness --- biochar --- eco-friendly material --- cementitious composites --- waveguides --- electromagnetic interference (EMI) suppressors --- sleeve ferrite cores --- cable filtering --- nanocrystalline (NC) --- split-core --- snap ferrite --- gap --- DC currents --- relative permeability --- impedance --- conducted emissions --- Discrete Wavelet Transform --- electromagnetic interference --- Empirical Mode Decomposition --- harmonics --- Switched-Mode Power Supplies --- transients --- Wavelet Packet Transform
Choose an application
Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials.
electromagnetic bandgap (EBG) --- dual perforation (DP) --- parallel-plate noise --- power delivery network (PDN) --- printed circuit board (PCB) --- meander split --- power/ground plane --- crosstalk --- signal integrity --- equivalent circuit --- capacitive and magnetic coupling --- hall-effect current sensors --- commercial current sensor --- electromagnetic compatibility (EMC) --- electromagnetic interference (EMI) --- direct power injection (DPI) test --- transverse-electromagnetic (TEM) test --- bulk current injection (BCI) test --- Spread Spectrum --- DC–DC power converters --- digital communications --- channel capacity --- resonant coupling --- Electromagnetic Interferences --- Amplifiers --- CMOS integrated circuits --- susceptibility of the output pin --- electromagnetic compatibility --- power electronics EMC --- EMI mitigation techniques --- EMI filter design and optimization --- common mode noise --- EMI modeling --- Fourier series --- impedance balancing --- resonant frequency --- battery management system (BMS) --- Li-ion battery pack --- electric vehicles (EVs) --- hybrid electric vehicles (HEVs) --- IC-level EMC --- susceptibility to electromagnetic interference (EMI) --- direct power injection (DPI) --- anechoic chamber --- polyaniline --- gelatin --- composite --- microwave absorption --- dielectric permittivity --- electrical conductivity --- shielding effectiveness --- biochar --- eco-friendly material --- cementitious composites --- waveguides --- electromagnetic interference (EMI) suppressors --- sleeve ferrite cores --- cable filtering --- nanocrystalline (NC) --- split-core --- snap ferrite --- gap --- DC currents --- relative permeability --- impedance --- conducted emissions --- Discrete Wavelet Transform --- electromagnetic interference --- Empirical Mode Decomposition --- harmonics --- Switched-Mode Power Supplies --- transients --- Wavelet Packet Transform
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