Listing 1 - 7 of 7 |
Sort by
|
Choose an application
Infrared (IR) technologies—from Herschel’s initial experiment in the 1800s to thermal detector development in the 1900s, followed by defense-focused developments using HgCdTe—have now incorporated a myriad of novel materials for a wide variety of applications in numerous high-impact fields. These include astronomy applications; composition identifications; toxic gas and explosive detection; medical diagnostics; and industrial, commercial, imaging, and security applications. Various types of semiconductor-based (including quantum well, dot, ring, wire, dot in well, hetero and/or homo junction, Type II super lattice, and Schottky) IR (photon) detectors, based on various materials (type IV, III-V, and II-VI), have been developed to satisfy these needs. Currently, room temperature detectors operating over a wide wavelength range from near IR to terahertz are available in various forms, including focal plane array cameras. Recent advances include performance enhancements by using surface Plasmon and ultrafast, high-sensitivity 2D materials for infrared sensing. Specialized detectors with features such as multiband, selectable wavelength, polarization sensitive, high operating temperature, and high performance (including but not limited to very low dark currents) are also being developed. This Special Issue highlights advances in these various types of infrared detectors based on various material systems.
Technology: general issues --- microbolometer --- infrared sensor --- complementary metal-oxide semiconductor (CMOS) --- high sensitivity --- temperature sensor --- microresonator --- MEMS --- clamped-clamped beam --- thermal detector --- Infrared detector --- strained layer superlattice --- InAs/InAsSb --- absorption coefficient --- barrier detector --- high operating temperature --- manganite --- heterostructure --- photodetector --- heterostructures --- split-off band --- wavelength extension --- device performance --- ultrasound transducer --- photoacoustic imaging --- piezoelectric --- micromachined --- CMUT --- PMUT --- optical ultrasound detection --- type-II superlattice --- infrared detector --- mid-wavelength infrared (MWIR) --- unipolar barrier --- InAs/GaSb --- T2SL --- IR --- TE-cooled --- spectroscopy --- RoHS --- MCT --- microbolometer --- infrared sensor --- complementary metal-oxide semiconductor (CMOS) --- high sensitivity --- temperature sensor --- microresonator --- MEMS --- clamped-clamped beam --- thermal detector --- Infrared detector --- strained layer superlattice --- InAs/InAsSb --- absorption coefficient --- barrier detector --- high operating temperature --- manganite --- heterostructure --- photodetector --- heterostructures --- split-off band --- wavelength extension --- device performance --- ultrasound transducer --- photoacoustic imaging --- piezoelectric --- micromachined --- CMUT --- PMUT --- optical ultrasound detection --- type-II superlattice --- infrared detector --- mid-wavelength infrared (MWIR) --- unipolar barrier --- InAs/GaSb --- T2SL --- IR --- TE-cooled --- spectroscopy --- RoHS --- MCT
Choose an application
Infrared (IR) technologies—from Herschel’s initial experiment in the 1800s to thermal detector development in the 1900s, followed by defense-focused developments using HgCdTe—have now incorporated a myriad of novel materials for a wide variety of applications in numerous high-impact fields. These include astronomy applications; composition identifications; toxic gas and explosive detection; medical diagnostics; and industrial, commercial, imaging, and security applications. Various types of semiconductor-based (including quantum well, dot, ring, wire, dot in well, hetero and/or homo junction, Type II super lattice, and Schottky) IR (photon) detectors, based on various materials (type IV, III-V, and II-VI), have been developed to satisfy these needs. Currently, room temperature detectors operating over a wide wavelength range from near IR to terahertz are available in various forms, including focal plane array cameras. Recent advances include performance enhancements by using surface Plasmon and ultrafast, high-sensitivity 2D materials for infrared sensing. Specialized detectors with features such as multiband, selectable wavelength, polarization sensitive, high operating temperature, and high performance (including but not limited to very low dark currents) are also being developed. This Special Issue highlights advances in these various types of infrared detectors based on various material systems.
Technology: general issues --- microbolometer --- infrared sensor --- complementary metal-oxide semiconductor (CMOS) --- high sensitivity --- temperature sensor --- microresonator --- MEMS --- clamped–clamped beam --- thermal detector --- Infrared detector --- strained layer superlattice --- InAs/InAsSb --- absorption coefficient --- barrier detector --- high operating temperature --- manganite --- heterostructure --- photodetector --- heterostructures --- split-off band --- wavelength extension --- device performance --- ultrasound transducer --- photoacoustic imaging --- piezoelectric --- micromachined --- CMUT --- PMUT --- optical ultrasound detection --- type-II superlattice --- infrared detector --- mid-wavelength infrared (MWIR) --- unipolar barrier --- InAs/GaSb --- T2SL --- IR --- TE-cooled --- spectroscopy --- RoHS --- MCT --- n/a --- clamped-clamped beam
Choose an application
Infrared (IR) technologies—from Herschel’s initial experiment in the 1800s to thermal detector development in the 1900s, followed by defense-focused developments using HgCdTe—have now incorporated a myriad of novel materials for a wide variety of applications in numerous high-impact fields. These include astronomy applications; composition identifications; toxic gas and explosive detection; medical diagnostics; and industrial, commercial, imaging, and security applications. Various types of semiconductor-based (including quantum well, dot, ring, wire, dot in well, hetero and/or homo junction, Type II super lattice, and Schottky) IR (photon) detectors, based on various materials (type IV, III-V, and II-VI), have been developed to satisfy these needs. Currently, room temperature detectors operating over a wide wavelength range from near IR to terahertz are available in various forms, including focal plane array cameras. Recent advances include performance enhancements by using surface Plasmon and ultrafast, high-sensitivity 2D materials for infrared sensing. Specialized detectors with features such as multiband, selectable wavelength, polarization sensitive, high operating temperature, and high performance (including but not limited to very low dark currents) are also being developed. This Special Issue highlights advances in these various types of infrared detectors based on various material systems.
microbolometer --- infrared sensor --- complementary metal-oxide semiconductor (CMOS) --- high sensitivity --- temperature sensor --- microresonator --- MEMS --- clamped–clamped beam --- thermal detector --- Infrared detector --- strained layer superlattice --- InAs/InAsSb --- absorption coefficient --- barrier detector --- high operating temperature --- manganite --- heterostructure --- photodetector --- heterostructures --- split-off band --- wavelength extension --- device performance --- ultrasound transducer --- photoacoustic imaging --- piezoelectric --- micromachined --- CMUT --- PMUT --- optical ultrasound detection --- type-II superlattice --- infrared detector --- mid-wavelength infrared (MWIR) --- unipolar barrier --- InAs/GaSb --- T2SL --- IR --- TE-cooled --- spectroscopy --- RoHS --- MCT --- n/a --- clamped-clamped beam
Choose an application
Micro and nano-electro-mechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within Integrated Circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors. The CMOS ICs and M/NEMS dies can be combined in the same package (SiP), or integrated within a single chip (SoC). In the SoC approach the M/NEMS devices are monolithically integrated together with CMOS circuitry allowing the development of compact and low-cost CMOS-M/NEMS devices for multiple applications (physical sensors, chemical sensors, biosensors, actuators, energy actuators, filters, mechanical relays, and others). On-chip CMOS electronics integration can overcome limitations related to the extremely low-level signals in sub-micrometer and nanometer scale electromechanical transducers enabling novel breakthrough applications. This Special Issue aims to gather high quality research contributions dealing with MEMS and NEMS devices monolithically integrated with CMOS, independently of the final application and fabrication approach adopted (MEMS-first, interleaved MEMS, MEMS-last or others).]
encapsulation --- n/a --- NEM memory switch --- magnetotransistor --- gas sensor --- nano-system array --- metal oxide (MOX) sensor --- capacitive pressure sensor --- real-time temperature compensation loop --- mechanical relays --- single-crystal silicon (SC-Si) --- MEMS relays --- MEMS --- oscillator --- micro-electro-mechanical system (MEMS) --- uncooled IR-bolometer --- microelectromechanical systems --- microbolometer --- programmable sustaining amplifier --- micro sensor --- CMOS-MEMS --- pierce oscillator --- MEMS resonators --- micro/nanoelectromechanical systems (MEMS/NEMS) --- resonator --- microhotplate --- NEMS --- application-specific integrated circuit (ASIC) --- MEMS modelling --- magnetic field --- chopper instrumentation amplifier --- microresonators --- interface circuit --- Hall effect --- thermal detector --- temperature sensor --- infrared sensor --- CMOS–NEMS --- CMOS --- atomic force microscope --- MEMS switches --- stent --- micro-electro-mechanical systems (MEMS) sensors --- nano resonator --- silicon-on-insulator (SOI) --- MEMS-ASIC integration --- Sigma-Delta --- MEMS characterization --- high-Q capacitive accelerometer --- mass sensors --- M3D --- CMOS-NEMS
Choose an application
This reprint is a reprint of the articles that appeared in Sensors' (MDPI) Special Issue on “Sensors and Systems for Indoor Positioning". The published original contributions focused on systems and technologies to enable indoor applications.
Technology: general issues --- History of engineering & technology --- Energy industries & utilities --- acoustic diffraction --- acoustic signal aberration --- cross-correlation aberration --- ultrasonic ranging --- visible light communication --- indoor positioning system --- fingerprint positioning --- weighted K-nearest neighbor --- distance metric --- ultrasonic transducers --- time of flight estimation --- pulse-echo technique --- ferroelectric films --- piezopolymer --- infrared sensor --- angle of arrival --- indoor localization --- wireless sensor networks --- navigation --- reinforcement learning --- 3D indoor positioning --- visible light positioning --- Wi-Fi positioning --- location fingerprinting --- RSSI-based positioning --- probabilistic approach --- information service --- book tracking --- fingerprint-based indoor positioning --- clustering --- RSSI --- CNN --- presence detection --- passive localization --- room impulse response --- acoustic localization --- frequency dependent attenuation --- ultrasonic signal --- cyber-physical system --- Industry 4.0 --- internet-of-reader --- IREAD 4.0 --- radio frequency identification --- RFID classification method --- smart gate --- smart forklift --- smart warehouse --- extended Kalman filter --- localization --- time of arrival --- carrier phase --- ambiguity resolution --- n/a
Choose an application
This reprint is a reprint of the articles that appeared in Sensors' (MDPI) Special Issue on “Sensors and Systems for Indoor Positioning". The published original contributions focused on systems and technologies to enable indoor applications.
acoustic diffraction --- acoustic signal aberration --- cross-correlation aberration --- ultrasonic ranging --- visible light communication --- indoor positioning system --- fingerprint positioning --- weighted K-nearest neighbor --- distance metric --- ultrasonic transducers --- time of flight estimation --- pulse-echo technique --- ferroelectric films --- piezopolymer --- infrared sensor --- angle of arrival --- indoor localization --- wireless sensor networks --- navigation --- reinforcement learning --- 3D indoor positioning --- visible light positioning --- Wi-Fi positioning --- location fingerprinting --- RSSI-based positioning --- probabilistic approach --- information service --- book tracking --- fingerprint-based indoor positioning --- clustering --- RSSI --- CNN --- presence detection --- passive localization --- room impulse response --- acoustic localization --- frequency dependent attenuation --- ultrasonic signal --- cyber-physical system --- Industry 4.0 --- internet-of-reader --- IREAD 4.0 --- radio frequency identification --- RFID classification method --- smart gate --- smart forklift --- smart warehouse --- extended Kalman filter --- localization --- time of arrival --- carrier phase --- ambiguity resolution --- n/a
Choose an application
This reprint is a reprint of the articles that appeared in Sensors' (MDPI) Special Issue on “Sensors and Systems for Indoor Positioning". The published original contributions focused on systems and technologies to enable indoor applications.
Technology: general issues --- History of engineering & technology --- Energy industries & utilities --- acoustic diffraction --- acoustic signal aberration --- cross-correlation aberration --- ultrasonic ranging --- visible light communication --- indoor positioning system --- fingerprint positioning --- weighted K-nearest neighbor --- distance metric --- ultrasonic transducers --- time of flight estimation --- pulse-echo technique --- ferroelectric films --- piezopolymer --- infrared sensor --- angle of arrival --- indoor localization --- wireless sensor networks --- navigation --- reinforcement learning --- 3D indoor positioning --- visible light positioning --- Wi-Fi positioning --- location fingerprinting --- RSSI-based positioning --- probabilistic approach --- information service --- book tracking --- fingerprint-based indoor positioning --- clustering --- RSSI --- CNN --- presence detection --- passive localization --- room impulse response --- acoustic localization --- frequency dependent attenuation --- ultrasonic signal --- cyber-physical system --- Industry 4.0 --- internet-of-reader --- IREAD 4.0 --- radio frequency identification --- RFID classification method --- smart gate --- smart forklift --- smart warehouse --- extended Kalman filter --- localization --- time of arrival --- carrier phase --- ambiguity resolution --- acoustic diffraction --- acoustic signal aberration --- cross-correlation aberration --- ultrasonic ranging --- visible light communication --- indoor positioning system --- fingerprint positioning --- weighted K-nearest neighbor --- distance metric --- ultrasonic transducers --- time of flight estimation --- pulse-echo technique --- ferroelectric films --- piezopolymer --- infrared sensor --- angle of arrival --- indoor localization --- wireless sensor networks --- navigation --- reinforcement learning --- 3D indoor positioning --- visible light positioning --- Wi-Fi positioning --- location fingerprinting --- RSSI-based positioning --- probabilistic approach --- information service --- book tracking --- fingerprint-based indoor positioning --- clustering --- RSSI --- CNN --- presence detection --- passive localization --- room impulse response --- acoustic localization --- frequency dependent attenuation --- ultrasonic signal --- cyber-physical system --- Industry 4.0 --- internet-of-reader --- IREAD 4.0 --- radio frequency identification --- RFID classification method --- smart gate --- smart forklift --- smart warehouse --- extended Kalman filter --- localization --- time of arrival --- carrier phase --- ambiguity resolution
Listing 1 - 7 of 7 |
Sort by
|