Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

When it comes to dealing with high voltages or issues of high electric currents, infrastructure security and people’s safety are of paramount importance. These kinds of phenomena have dangerous consequences, therefore studies concerning the effects of lightning are crucial. The normal operation of transmission and distribution systems is greatly affected by lightning, which is one of the major causes of power interruptions: direct or nearby indirect strikes can cause flashovers in overhead transmission and distribution lines, resulting in over voltages on the line conductors. Contributions to this Special Issue have mainly focused on modelling lightning activity, investigating physical causes, and discussing and testing mathematical models for the electromagnetic fields associated with lighting phenomena. In this framework, two main topics have emerged: 1) the interaction between lightning phenomena and electrical infrastructures, such as wind turbines and overhead lines; and 2) the computation of lightning electromagnetic fields in the case of particular configuration, considering a negatively charged artificial thunderstorm or considering a complex terrain with arbitrary topography

Technology: general issues --- lightning --- lightning protection system --- wind turbine blades --- ANSYS workbench --- graphics processing unit (GPU) --- OpenACC (open accelerators) --- finite difference time domain (FDTD) --- lightning magnetic fields --- electromagnetic field --- analytical formula --- corona discharge --- lightning protection --- electromagnetic pulse --- lightning-induced voltages --- numerical codes --- distribution lines --- lightning-induced overvoltages --- grounding modeling --- soil resistivity --- artificial thunderstorm cell --- upward streamer discharges --- electromagnetic radiation spectrum --- wavelet --- transmission line monitoring system --- model element --- simulation --- corona --- lightning surge --- overhead line --- transient calculation --- lightning --- lightning protection system --- wind turbine blades --- ANSYS workbench --- graphics processing unit (GPU) --- OpenACC (open accelerators) --- finite difference time domain (FDTD) --- lightning magnetic fields --- electromagnetic field --- analytical formula --- corona discharge --- lightning protection --- electromagnetic pulse --- lightning-induced voltages --- numerical codes --- distribution lines --- lightning-induced overvoltages --- grounding modeling --- soil resistivity --- artificial thunderstorm cell --- upward streamer discharges --- electromagnetic radiation spectrum --- wavelet --- transmission line monitoring system --- model element --- simulation --- corona --- lightning surge --- overhead line --- transient calculation

Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

This publication provides a comprehensive and systematically organized coverage of higher order finite-difference time-domain or FDTD schemes, demonstrating their potential role as a powerful modeling tool in computational electromagnetics. Special emphasis is drawn on the analysis of contemporary waveguide and antenna structures. Acknowledged as a significant breakthrough in the evolution of the original Yee's algorithm, the higher order FDTD operators remain the subject of an ongoing scientific research. Among their indisputable merits, one can distinguish the enhanced levels of accuracy even for coarse grid resolutions, the fast convergence rates, and the adjustable stability. In fact, as the fabrication standards of modern systems get stricter, it is apparent that such properties become very appealing for the accomplishment of elaborate and credible designs.

Electromagnetism --- Wave guides --- Antennas (Electronics) --- Time-domain analysis. --- Finite differences. --- Mathematical models. --- Differences, Finite --- Finite difference method --- Analysis, Time-domain --- Waveguides --- Electromagnetics --- Finite-difference time-domain methods. --- FDTD. --- Computational electromagnetics. --- Yee's algorithm. --- Waveguide and antenna structure and analysis. --- Electromagnetic modeling. --- Numerical analysis --- System analysis --- Electronic apparatus and appliances --- Electric conductors --- Electric waves --- Electromagnetic waves --- Gyrators --- Microwave transmission lines --- Radio --- Transducers --- Magnetic induction --- Magnetism --- Metamaterials --- Equipment and supplies

Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

When it comes to dealing with high voltages or issues of high electric currents, infrastructure security and people’s safety are of paramount importance. These kinds of phenomena have dangerous consequences, therefore studies concerning the effects of lightning are crucial. The normal operation of transmission and distribution systems is greatly affected by lightning, which is one of the major causes of power interruptions: direct or nearby indirect strikes can cause flashovers in overhead transmission and distribution lines, resulting in over voltages on the line conductors. Contributions to this Special Issue have mainly focused on modelling lightning activity, investigating physical causes, and discussing and testing mathematical models for the electromagnetic fields associated with lighting phenomena. In this framework, two main topics have emerged: 1) the interaction between lightning phenomena and electrical infrastructures, such as wind turbines and overhead lines; and 2) the computation of lightning electromagnetic fields in the case of particular configuration, considering a negatively charged artificial thunderstorm or considering a complex terrain with arbitrary topography

lightning --- lightning protection system --- wind turbine blades --- ANSYS workbench --- graphics processing unit (GPU) --- OpenACC (open accelerators) --- finite difference time domain (FDTD) --- lightning magnetic fields --- electromagnetic field --- analytical formula --- corona discharge --- lightning protection --- electromagnetic pulse --- lightning-induced voltages --- numerical codes --- distribution lines --- lightning-induced overvoltages --- grounding modeling --- soil resistivity --- artificial thunderstorm cell --- upward streamer discharges --- electromagnetic radiation spectrum --- wavelet --- transmission line monitoring system --- model element --- simulation --- corona --- lightning surge --- overhead line --- transient calculation --- n/a

Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

This Special Issue focuses on computational detailed studies (simulation, modeling, and calculations) of the structures, main properties, and peculiarities of the various nanomaterials (nanocrystals, nanoparticles, nanolayers, nanofibers, nanotubes, etc.) based on various elements, including organic and biological components, such as amino acids and peptides. For many practical applications in nanoelectronics., such materials as ferroelectrics and ferromagnetics, having switching parameters (polarization, magnetization), are highly requested, and simulation of dynamics and kinetics of their switching are a very important task. An important task for these studies is computer modeling and computational research of the properties on the various composites of the other nanostructures with polymeric ferroelectrics and with different graphene-like 2-dimensional structures. A wide range of contemporary computational methods and software are used in all these studies.

Research & information: general --- Physics --- single nanowires --- silicon --- dual shells --- off-resonance --- absorption --- photocurrent --- magnetism --- transition-metal oxide clusters --- DFT calculations --- structure --- electronic properties --- LGD theory --- polarization --- nanoscale ferroelectrics --- kinetics --- homogeneous switching --- computer simulation --- fitting --- diphenylalanine --- peptide nanotubes --- self-assembly --- water molecules --- DFT --- molecular modelling --- semi-empirical methods --- chirality --- Ir-modified MoS2 --- decomposition components of SF6 --- adsorption and sensing --- atomistic simulation --- core–shell bi-magnetic nanoparticles --- Monte Carlo simulation --- interfacial exchange --- terahertz --- graphene --- plasmons --- Drude absorption --- polarization conversion --- yield surface --- plastic flow --- crystal plasticity --- polycrystalline aluminum --- dipeptides --- helical structures --- molecular modeling --- dipole moments --- tunnel junction --- machine learning --- III-nitride --- hydroxyapatite --- modeling --- density functional theory --- defects --- vacancies --- substitutions --- structural and optical properties --- band gap --- electronic density of states --- nanomaterials --- plasmon-induced transparency --- strontium titanate --- slow light --- iron doping --- hydroxyapatite bioceramics --- hybrid density functional --- X-ray absorption spectroscopy --- phenylalanine --- protein secondary structure --- optoelectronic devices --- nanostructured polymer film --- antireflection coating --- finite-difference time-domain method --- ferroelectrics --- heterostructures --- domains --- negative capacitance --- single nanowires --- silicon --- dual shells --- off-resonance --- absorption --- photocurrent --- magnetism --- transition-metal oxide clusters --- DFT calculations --- structure --- electronic properties --- LGD theory --- polarization --- nanoscale ferroelectrics --- kinetics --- homogeneous switching --- computer simulation --- fitting --- diphenylalanine --- peptide nanotubes --- self-assembly --- water molecules --- DFT --- molecular modelling --- semi-empirical methods --- chirality --- Ir-modified MoS2 --- decomposition components of SF6 --- adsorption and sensing --- atomistic simulation --- core–shell bi-magnetic nanoparticles --- Monte Carlo simulation --- interfacial exchange --- terahertz --- graphene --- plasmons --- Drude absorption --- polarization conversion --- yield surface --- plastic flow --- crystal plasticity --- polycrystalline aluminum --- dipeptides --- helical structures --- molecular modeling --- dipole moments --- tunnel junction --- machine learning --- III-nitride --- hydroxyapatite --- modeling --- density functional theory --- defects --- vacancies --- substitutions --- structural and optical properties --- band gap --- electronic density of states --- nanomaterials --- plasmon-induced transparency --- strontium titanate --- slow light --- iron doping --- hydroxyapatite bioceramics --- hybrid density functional --- X-ray absorption spectroscopy --- phenylalanine --- protein secondary structure --- optoelectronic devices --- nanostructured polymer film --- antireflection coating --- finite-difference time-domain method --- ferroelectrics --- heterostructures --- domains --- negative capacitance

Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

Research & information: general --- Biology, life sciences --- heterogeneous integration --- wafer bonding --- wafer sealing --- room-temperature bonding --- Au-Au bonding --- surface activated bonding --- Au film thickness --- surface roughness --- microelectromechanical systems (MEMS) packaging --- inkjet printing --- redistribution layers --- capacitive micromachined ultrasound transducers (CMUT) --- fan-out wafer-level packaging (FOWLP) --- adhesion --- thin film metal --- parylene --- neural probe --- scotch tape test --- FEM --- MEMS resonator --- temperature coefficient --- thermal stress --- millimeter-wave --- redundant TSV --- equivalent circuit model --- S-parameters extraction --- technology evaluation --- MEMS and IC integration --- MCDM --- fuzzy AHP --- fuzzy VIKOR --- fan-out wafer-level package --- finite element --- glass substrate --- reliability life --- packaging-on-packaging --- thermal sensors --- TMOS sensor --- finite difference time domain --- optical and electromagnetics simulations --- finite element analysis --- ultrasonic bonding --- metal direct bonding --- microsystem integration --- biocompatible packaging --- implantable --- reliability --- Finite element method (FEM) --- simulation --- multilayer reactive bonding --- integrated nanostructure-multilayer reactive system --- spontaneous self-ignition --- self-propagating exothermic reaction --- Pd/Al reactive multilayer system --- Ni/Al reactive multilayer system --- low-temperature MEMS packaging --- crack propagation --- microbump --- deflection angle --- stress intensity factor (SIF) --- polymer packaging --- neural interface --- chronic implantation --- heterogeneous integration --- wafer bonding --- wafer sealing --- room-temperature bonding --- Au-Au bonding --- surface activated bonding --- Au film thickness --- surface roughness --- microelectromechanical systems (MEMS) packaging --- inkjet printing --- redistribution layers --- capacitive micromachined ultrasound transducers (CMUT) --- fan-out wafer-level packaging (FOWLP) --- adhesion --- thin film metal --- parylene --- neural probe --- scotch tape test --- FEM --- MEMS resonator --- temperature coefficient --- thermal stress --- millimeter-wave --- redundant TSV --- equivalent circuit model --- S-parameters extraction --- technology evaluation --- MEMS and IC integration --- MCDM --- fuzzy AHP --- fuzzy VIKOR --- fan-out wafer-level package --- finite element --- glass substrate --- reliability life --- packaging-on-packaging --- thermal sensors --- TMOS sensor --- finite difference time domain --- optical and electromagnetics simulations --- finite element analysis --- ultrasonic bonding --- metal direct bonding --- microsystem integration --- biocompatible packaging --- implantable --- reliability --- Finite element method (FEM) --- simulation --- multilayer reactive bonding --- integrated nanostructure-multilayer reactive system --- spontaneous self-ignition --- self-propagating exothermic reaction --- Pd/Al reactive multilayer system --- Ni/Al reactive multilayer system --- low-temperature MEMS packaging --- crack propagation --- microbump --- deflection angle --- stress intensity factor (SIF) --- polymer packaging --- neural interface --- chronic implantation