Search
Feedback
About UniCat 
Help
News
| Listing 1 - 6 of 6 |
Sort by
|
Book
Year: 2021 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute
Abstract | Keywords | Export | Availability | Bookmark
Loading...Choose an application
- Reference Manager
- EndNote
- RefWorks (Direct export to RefWorks)
This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.
History of engineering & technology --- Dual-Phase-Lag heat transfer model --- thermal simulation algorithm --- thermal measurements --- Finite Difference Method scheme --- Grünwald–Letnikov fractional derivative --- Krylov subspace-based model order reduction --- algorithm efficiency analysis --- relative error analysis --- algorithm convergence analysis --- computational complexity analysis --- finite difference method scheme --- BJT --- modelling --- self-heating --- silicon carbide --- SPICE --- IGBT --- DC–DC converter --- electrothermal model --- averaged model --- thermal phenomena --- diode–transistor switch --- power electronics --- multi-LED lighting modules --- device thermal coupling --- compact thermal models --- temperature sensors --- microprocessor --- throughput improvement --- inductors --- ferromagnetic cores --- thermal model --- transient thermal impedance --- thermal resistance --- electrothermal (ET) simulation --- finite-element method (FEM) --- model-order reduction (MOR) --- multicellular power MOSFET --- silicon carbide (SiC)
Book
Year: 2021 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute
Abstract | Keywords | Export | Availability | Bookmark
Loading...Choose an application
- Reference Manager
- EndNote
- RefWorks (Direct export to RefWorks)
In this book, nine papers focusing on different fields of power electronics are gathered, all of which are in line with the present trends in research and industry. Given the generality of the Special Issue, the covered topics range from electrothermal models and losses models in semiconductors and magnetics to converters used in high-power applications. In this last case, the papers address specific problems such as the distortion due to zero-current detection or fault investigation using the fast Fourier transform, all being focused on analyzing the topologies of high-power high-density applications, such as the dual active bridge or the H-bridge multilevel inverter. All the papers provide enough insight in the analyzed issues to be used as the starting point of any research. Experimental or simulation results are presented to validate and help with the understanding of the proposed ideas. To summarize, this book will help the reader to solve specific problems in industrial equipment or to increase their knowledge in specific fields.
soft-switching --- Superjunction MOSFET --- LLC resonant converter --- zero voltage switching --- COSS hysteresis --- COSS intrinsic energy losses --- SiC devices --- antiparallel diode --- dual active bridge --- power electronic transformer --- high-frequency transformer --- Artificial Neural Networks (ANN) --- fault diagnosis --- Fast Fourier Transform (FFT) --- Multilevel Inverter (MLI) --- LabVIEW --- magnetics modeling --- variable inductor --- hysteresis --- eddy currents --- saturable core --- AC/AC conversion --- decoupling control --- modulation --- DC–DC converter --- phase shift PWM --- ZVS --- inrush current --- MOSFET --- telecom server --- modular multilevel converter (MMC) --- total harmonic distortion (THD) --- universal mathematical model (UMM) --- switching state --- nearest level modulation (NLM) --- DC-DC converter --- IGBT --- averaged model --- electrothermal model --- SPICE --- power electronics --- converter control --- power factor correction --- total harmonic distortion --- flyback --- solid-state lighting
Book
Year: 2021 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute
Abstract | Keywords | Export | Availability | Bookmark
Loading...Choose an application
- Reference Manager
- EndNote
- RefWorks (Direct export to RefWorks)
This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.
Dual-Phase-Lag heat transfer model --- thermal simulation algorithm --- thermal measurements --- Finite Difference Method scheme --- Grünwald–Letnikov fractional derivative --- Krylov subspace-based model order reduction --- algorithm efficiency analysis --- relative error analysis --- algorithm convergence analysis --- computational complexity analysis --- finite difference method scheme --- BJT --- modelling --- self-heating --- silicon carbide --- SPICE --- IGBT --- DC–DC converter --- electrothermal model --- averaged model --- thermal phenomena --- diode–transistor switch --- power electronics --- multi-LED lighting modules --- device thermal coupling --- compact thermal models --- temperature sensors --- microprocessor --- throughput improvement --- inductors --- ferromagnetic cores --- thermal model --- transient thermal impedance --- thermal resistance --- electrothermal (ET) simulation --- finite-element method (FEM) --- model-order reduction (MOR) --- multicellular power MOSFET --- silicon carbide (SiC)
Book
Year: 2021 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute
Abstract | Keywords | Export | Availability | Bookmark
Loading...Choose an application
- Reference Manager
- EndNote
- RefWorks (Direct export to RefWorks)
In this book, nine papers focusing on different fields of power electronics are gathered, all of which are in line with the present trends in research and industry. Given the generality of the Special Issue, the covered topics range from electrothermal models and losses models in semiconductors and magnetics to converters used in high-power applications. In this last case, the papers address specific problems such as the distortion due to zero-current detection or fault investigation using the fast Fourier transform, all being focused on analyzing the topologies of high-power high-density applications, such as the dual active bridge or the H-bridge multilevel inverter. All the papers provide enough insight in the analyzed issues to be used as the starting point of any research. Experimental or simulation results are presented to validate and help with the understanding of the proposed ideas. To summarize, this book will help the reader to solve specific problems in industrial equipment or to increase their knowledge in specific fields.
Technology: general issues --- soft-switching --- Superjunction MOSFET --- LLC resonant converter --- zero voltage switching --- COSS hysteresis --- COSS intrinsic energy losses --- SiC devices --- antiparallel diode --- dual active bridge --- power electronic transformer --- high-frequency transformer --- Artificial Neural Networks (ANN) --- fault diagnosis --- Fast Fourier Transform (FFT) --- Multilevel Inverter (MLI) --- LabVIEW --- magnetics modeling --- variable inductor --- hysteresis --- eddy currents --- saturable core --- AC/AC conversion --- decoupling control --- modulation --- DC–DC converter --- phase shift PWM --- ZVS --- inrush current --- MOSFET --- telecom server --- modular multilevel converter (MMC) --- total harmonic distortion (THD) --- universal mathematical model (UMM) --- switching state --- nearest level modulation (NLM) --- DC-DC converter --- IGBT --- averaged model --- electrothermal model --- SPICE --- power electronics --- converter control --- power factor correction --- total harmonic distortion --- flyback --- solid-state lighting --- soft-switching --- Superjunction MOSFET --- LLC resonant converter --- zero voltage switching --- COSS hysteresis --- COSS intrinsic energy losses --- SiC devices --- antiparallel diode --- dual active bridge --- power electronic transformer --- high-frequency transformer --- Artificial Neural Networks (ANN) --- fault diagnosis --- Fast Fourier Transform (FFT) --- Multilevel Inverter (MLI) --- LabVIEW --- magnetics modeling --- variable inductor --- hysteresis --- eddy currents --- saturable core --- AC/AC conversion --- decoupling control --- modulation --- DC–DC converter --- phase shift PWM --- ZVS --- inrush current --- MOSFET --- telecom server --- modular multilevel converter (MMC) --- total harmonic distortion (THD) --- universal mathematical model (UMM) --- switching state --- nearest level modulation (NLM) --- DC-DC converter --- IGBT --- averaged model --- electrothermal model --- SPICE --- power electronics --- converter control --- power factor correction --- total harmonic distortion --- flyback --- solid-state lighting
Book
Year: 2021 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute
Abstract | Keywords | Export | Availability | Bookmark
Loading...Choose an application
- Reference Manager
- EndNote
- RefWorks (Direct export to RefWorks)
This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.
History of engineering & technology --- Dual-Phase-Lag heat transfer model --- thermal simulation algorithm --- thermal measurements --- Finite Difference Method scheme --- Grünwald–Letnikov fractional derivative --- Krylov subspace-based model order reduction --- algorithm efficiency analysis --- relative error analysis --- algorithm convergence analysis --- computational complexity analysis --- finite difference method scheme --- BJT --- modelling --- self-heating --- silicon carbide --- SPICE --- IGBT --- DC–DC converter --- electrothermal model --- averaged model --- thermal phenomena --- diode–transistor switch --- power electronics --- multi-LED lighting modules --- device thermal coupling --- compact thermal models --- temperature sensors --- microprocessor --- throughput improvement --- inductors --- ferromagnetic cores --- thermal model --- transient thermal impedance --- thermal resistance --- electrothermal (ET) simulation --- finite-element method (FEM) --- model-order reduction (MOR) --- multicellular power MOSFET --- silicon carbide (SiC) --- Dual-Phase-Lag heat transfer model --- thermal simulation algorithm --- thermal measurements --- Finite Difference Method scheme --- Grünwald–Letnikov fractional derivative --- Krylov subspace-based model order reduction --- algorithm efficiency analysis --- relative error analysis --- algorithm convergence analysis --- computational complexity analysis --- finite difference method scheme --- BJT --- modelling --- self-heating --- silicon carbide --- SPICE --- IGBT --- DC–DC converter --- electrothermal model --- averaged model --- thermal phenomena --- diode–transistor switch --- power electronics --- multi-LED lighting modules --- device thermal coupling --- compact thermal models --- temperature sensors --- microprocessor --- throughput improvement --- inductors --- ferromagnetic cores --- thermal model --- transient thermal impedance --- thermal resistance --- electrothermal (ET) simulation --- finite-element method (FEM) --- model-order reduction (MOR) --- multicellular power MOSFET --- silicon carbide (SiC)
Book
Year: 2021 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute
Abstract | Keywords | Export | Availability | Bookmark
Loading...Choose an application
- Reference Manager
- EndNote
- RefWorks (Direct export to RefWorks)
In this book, nine papers focusing on different fields of power electronics are gathered, all of which are in line with the present trends in research and industry. Given the generality of the Special Issue, the covered topics range from electrothermal models and losses models in semiconductors and magnetics to converters used in high-power applications. In this last case, the papers address specific problems such as the distortion due to zero-current detection or fault investigation using the fast Fourier transform, all being focused on analyzing the topologies of high-power high-density applications, such as the dual active bridge or the H-bridge multilevel inverter. All the papers provide enough insight in the analyzed issues to be used as the starting point of any research. Experimental or simulation results are presented to validate and help with the understanding of the proposed ideas. To summarize, this book will help the reader to solve specific problems in industrial equipment or to increase their knowledge in specific fields.
Technology: general issues --- soft-switching --- Superjunction MOSFET --- LLC resonant converter --- zero voltage switching --- COSS hysteresis --- COSS intrinsic energy losses --- SiC devices --- antiparallel diode --- dual active bridge --- power electronic transformer --- high-frequency transformer --- Artificial Neural Networks (ANN) --- fault diagnosis --- Fast Fourier Transform (FFT) --- Multilevel Inverter (MLI) --- LabVIEW --- magnetics modeling --- variable inductor --- hysteresis --- eddy currents --- saturable core --- AC/AC conversion --- decoupling control --- modulation --- DC–DC converter --- phase shift PWM --- ZVS --- inrush current --- MOSFET --- telecom server --- modular multilevel converter (MMC) --- total harmonic distortion (THD) --- universal mathematical model (UMM) --- switching state --- nearest level modulation (NLM) --- DC-DC converter --- IGBT --- averaged model --- electrothermal model --- SPICE --- power electronics --- converter control --- power factor correction --- total harmonic distortion --- flyback --- solid-state lighting
| Listing 1 - 6 of 6 |
Sort by
|