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MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Microelectronic packaging --- Congresses --- Mechanical Engineering --- Engineering & Applied Sciences --- Mechanical Engineering - General --- Electrical & Computer Engineering --- Electrical Engineering --- Manufactures. --- Metals. --- Optical materials. --- Electronic materials. --- Materials science. --- Electrical engineering. --- Manufacturing, Machines, Tools, Processes. --- Metallic Materials. --- Optical and Electronic Materials. --- Characterization and Evaluation of Materials. --- Electrical Engineering. --- Electric engineering --- Engineering --- Material science --- Physical sciences --- Electronic materials --- Optics --- Materials --- Metallic elements --- Chemical elements --- Ores --- Metallurgy --- Manufactured goods --- Manufactured products --- Products --- Products, Manufactured --- Commercial products --- Manufacturing industries --- Microelectronic packaging - Congresses --- Adhesive bonding --- Electronic packages --- Films --- Microelectronics --- Soldering
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With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.
thermal interface material --- thermal aging --- modeling --- LED compact thermal models --- niobium pentoxide --- model-order reduction --- ferromagnetic cores --- LED digital twin --- Cauer RC ladder --- in-situ characterization --- electronic packages --- time domain thermoreflectance --- multi-domain compact model --- power LEDs --- DC–DC converters --- structure function --- boundary condition independent --- electric aircraft --- multi-LED --- modelling --- light emitting diodes --- thin film --- JEDEC metrics --- tool agnostic --- power losses --- switching --- dynamic thermal compact model --- thermal transient testing --- reliability --- thermal transient analysis --- thermal simulation --- non-destructive testing --- IGBT --- carbon nanotubes --- compact thermal model --- power semiconductor devices --- SPICE --- phosphor light conversion --- thermal management --- LED luminaire design --- design flow --- thermal characterization --- motor cooling --- thermal phenomena --- silicone dome --- LED --- secondary heat path --- multi-domain modelling --- heating and optical power --- transient analysis --- thermal testability --- thermal conductivity --- multiple heat source
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This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
History of engineering & technology --- lithium-ion battery --- thermal modelling --- electro-thermal model --- heat generation --- experimental validation --- thermal transient testing --- non-destructive testing --- thermal testability --- accuracy repeatability and reproducibility of thermal measurements --- thermal testing standards --- 3D IC --- microchannels --- liquid cooling --- compact thermal model --- thermal simulation --- hotspot --- thermal-aware task scheduling --- DVFS --- statistical analysis --- electronic packages --- detailed thermal model --- Joint Electron Device Engineering Council (JEDEC) metrics --- thermal impedance --- AlGaN-GaN HEMT --- TDTR --- thermal conductivity --- thermal interface resistance --- size effect --- phonon transport mechanisms --- nonlinear thermal model --- SPICE --- pulse transformer --- thermal phenomena --- self-heating --- modelling --- measurements --- BCI-DCTM --- ROM --- modal approach --- BGA --- module temperature --- solar energy --- heat transfer mechanisms --- power LED measurement and simulation --- life testing --- reliability testing --- LM-80 --- TM-21 --- LED lifetime modelling --- LED multi-domain modelling --- Spice-like modelling of LEDs --- lifetime extrapolation and modelling of LEDs --- beyond CMOS --- VO2 --- thermal-electronic circuits --- electro-thermal simulation --- vertical structure --- power LEDs --- thermal pads --- thermal resistance --- optical efficiency --- electronics cooling --- Light-emitting diodes --- CoB LEDs --- multi-domain modeling --- finite volume method --- phosphor modeling --- magnetic nanoparticle --- microfluidics --- CFD --- OpenFOAM --- two-phase solver --- rheology --- LED --- Delphi4LED --- digital twin --- digital luminaire design --- computation time --- Industry 4.0 --- lithium-ion battery --- thermal modelling --- electro-thermal model --- heat generation --- experimental validation --- thermal transient testing --- non-destructive testing --- thermal testability --- accuracy repeatability and reproducibility of thermal measurements --- thermal testing standards --- 3D IC --- microchannels --- liquid cooling --- compact thermal model --- thermal simulation --- hotspot --- thermal-aware task scheduling --- DVFS --- statistical analysis --- electronic packages --- detailed thermal model --- Joint Electron Device Engineering Council (JEDEC) metrics --- thermal impedance --- AlGaN-GaN HEMT --- TDTR --- thermal conductivity --- thermal interface resistance --- size effect --- phonon transport mechanisms --- nonlinear thermal model --- SPICE --- pulse transformer --- thermal phenomena --- self-heating --- modelling --- measurements --- BCI-DCTM --- ROM --- modal approach --- BGA --- module temperature --- solar energy --- heat transfer mechanisms --- power LED measurement and simulation --- life testing --- reliability testing --- LM-80 --- TM-21 --- LED lifetime modelling --- LED multi-domain modelling --- Spice-like modelling of LEDs --- lifetime extrapolation and modelling of LEDs --- beyond CMOS --- VO2 --- thermal-electronic circuits --- electro-thermal simulation --- vertical structure --- power LEDs --- thermal pads --- thermal resistance --- optical efficiency --- electronics cooling --- Light-emitting diodes --- CoB LEDs --- multi-domain modeling --- finite volume method --- phosphor modeling --- magnetic nanoparticle --- microfluidics --- CFD --- OpenFOAM --- two-phase solver --- rheology --- LED --- Delphi4LED --- digital twin --- digital luminaire design --- computation time --- Industry 4.0
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This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
History of engineering & technology --- lithium-ion battery --- thermal modelling --- electro-thermal model --- heat generation --- experimental validation --- thermal transient testing --- non-destructive testing --- thermal testability --- accuracy repeatability and reproducibility of thermal measurements --- thermal testing standards --- 3D IC --- microchannels --- liquid cooling --- compact thermal model --- thermal simulation --- hotspot --- thermal-aware task scheduling --- DVFS --- statistical analysis --- electronic packages --- detailed thermal model --- Joint Electron Device Engineering Council (JEDEC) metrics --- thermal impedance --- AlGaN-GaN HEMT --- TDTR --- thermal conductivity --- thermal interface resistance --- size effect --- phonon transport mechanisms --- nonlinear thermal model --- SPICE --- pulse transformer --- thermal phenomena --- self-heating --- modelling --- measurements --- BCI-DCTM --- ROM --- modal approach --- BGA --- module temperature --- solar energy --- heat transfer mechanisms --- power LED measurement and simulation --- life testing --- reliability testing --- LM-80 --- TM-21 --- LED lifetime modelling --- LED multi-domain modelling --- Spice-like modelling of LEDs --- lifetime extrapolation and modelling of LEDs --- beyond CMOS --- VO2 --- thermal-electronic circuits --- electro-thermal simulation --- vertical structure --- power LEDs --- thermal pads --- thermal resistance --- optical efficiency --- electronics cooling --- Light-emitting diodes --- CoB LEDs --- multi-domain modeling --- finite volume method --- phosphor modeling --- magnetic nanoparticle --- microfluidics --- CFD --- OpenFOAM --- two-phase solver --- rheology --- LED --- Delphi4LED --- digital twin --- digital luminaire design --- computation time --- Industry 4.0
Choose an application
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
lithium-ion battery --- thermal modelling --- electro-thermal model --- heat generation --- experimental validation --- thermal transient testing --- non-destructive testing --- thermal testability --- accuracy repeatability and reproducibility of thermal measurements --- thermal testing standards --- 3D IC --- microchannels --- liquid cooling --- compact thermal model --- thermal simulation --- hotspot --- thermal-aware task scheduling --- DVFS --- statistical analysis --- electronic packages --- detailed thermal model --- Joint Electron Device Engineering Council (JEDEC) metrics --- thermal impedance --- AlGaN-GaN HEMT --- TDTR --- thermal conductivity --- thermal interface resistance --- size effect --- phonon transport mechanisms --- nonlinear thermal model --- SPICE --- pulse transformer --- thermal phenomena --- self-heating --- modelling --- measurements --- BCI-DCTM --- ROM --- modal approach --- BGA --- module temperature --- solar energy --- heat transfer mechanisms --- power LED measurement and simulation --- life testing --- reliability testing --- LM-80 --- TM-21 --- LED lifetime modelling --- LED multi-domain modelling --- Spice-like modelling of LEDs --- lifetime extrapolation and modelling of LEDs --- beyond CMOS --- VO2 --- thermal-electronic circuits --- electro-thermal simulation --- vertical structure --- power LEDs --- thermal pads --- thermal resistance --- optical efficiency --- electronics cooling --- Light-emitting diodes --- CoB LEDs --- multi-domain modeling --- finite volume method --- phosphor modeling --- magnetic nanoparticle --- microfluidics --- CFD --- OpenFOAM --- two-phase solver --- rheology --- LED --- Delphi4LED --- digital twin --- digital luminaire design --- computation time --- Industry 4.0
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