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This workshop will focus on low temperature bonding technologies which will ultimately lead to entirely new manufacturing approaches to 3D and heterogeneous integration of semiconductor devices and microsystems, as well as photonic systems The workshop invites papers that document new developments in low temperature bonding technologies, new device applications, facilities and technologies for mass production, and basic science relating to these technologies Their impact on the paradigm shift in the semiconductor industry along with 3D integration technologies is also of interest.

Sealing (Technology) --- Three-dimensional integrated circuits

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Three-dimensional imaging --- Three-dimensional integrated circuits

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Photonics --- Three-dimensional integrated circuits. --- Sealing (Technology) --- Materials --- 3D ICs (Three-dimensional integrated circuits) --- Integrated circuits

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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Three-dimensional integrated circuits --- Design and construction. --- 3D ICs (Three-dimensional integrated circuits) --- Integrated circuits

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Three-dimensional integrated circuits --- Power electronics --- 3D ICs (Three-dimensional integrated circuits) --- Integrated circuits