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This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of timing, power, signal integrity, and thermo-mechanical reliability for 3D IC designs. Coverage also includes various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the 3D IC design process. Describes design issues and solutions for high performance and low power 3D ICs, such as the pros/cons of regular and irregular placement of TSVs, Steiner routing, buffer insertion, low power 3D clock routing, power delivery network design and clock design for pre-bond testability. Discusses topics in design-for-electrical-reliability for 3D ICs, such as TSV-to-TSV coupling, current crowding at the wire-to-TSV junction and the electro-migration failure mechanisms in TSVs. Covers design-for-thermal-reliability in 3D ICs, including thermal-aware architectural floorplanning, gate-level placement techniques to alleviate thermal problems, and co-design and co-analysis of thermal, power delivery, and performance. Includes issues affecting design-for-mechanical-reliability in 3D ICs, such as the co-efficient of thermal expansion (CTE) mismatch between TSV and silicon substrate, device mobility and full-chip timing variations, and the impact of package elements.
Computer algorithms. --- Three-dimensional integrated circuits -- Design and construction. --- Three-dimensional integrated circuits. --- Three-dimensional integrated circuits --- Computer algorithms --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Design and construction --- Design and construction. --- 3D ICs (Three-dimensional integrated circuits) --- Engineering. --- Microprocessors. --- Nanotechnology. --- Electronic circuits. --- Circuits and Systems. --- Nanotechnology and Microengineering. --- Processor Architectures. --- Algorithms --- Integrated circuits --- Systems engineering. --- Computer science. --- Informatics --- Science --- Construction --- Industrial arts --- Technology --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Minicomputers --- Molecular technology --- Nanoscale technology --- High technology --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics --- Algorism --- Algebra --- Arithmetic --- Foundations
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This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.
Circuits and systems. --- Electronics. --- Engineering. --- Three-dimensional integrated circuits -- Design. --- Three-dimensional integrated circuits --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Three-dimensional integrated circuits. --- Integrated circuits. --- Chips (Electronics) --- Circuits, Integrated --- Computer chips --- Microchips --- 3D ICs (Three-dimensional integrated circuits) --- Microprocessors. --- Microelectronics. --- Electronic circuits. --- Circuits and Systems. --- Processor Architectures. --- Electronics and Microelectronics, Instrumentation. --- Electronic circuits --- Microelectronics --- Integrated circuits --- Systems engineering. --- Computer science. --- Electrical engineering --- Physical sciences --- Informatics --- Science --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Design and construction --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Minicomputers --- Electron-tube circuits --- Electric circuits --- Electron tubes
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