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Electronics --- Microelectronic packaging --- Multichip modules (Microelectronics) --- Solder and soldering --- Alloys --- Filler metal --- Metal-work --- Sealing (Technology) --- Brazing --- MCM (Microelectronics) --- Multi-chip modules (Microelectronics) --- Multichip integrated circuits --- Multichip microcircuits --- Multichip packages (Microelectronics) --- Multichip units (Microelectronics) --- Packaging (Microelectronics) --- Electronic packaging --- Microelectronics --- Reliability --- Testing
Book
ISBN: 9781493921638 1493921622 9781493921621 1493921630 Year: 2015 Publisher: New York, NY : Springer New York : Imprint: Springer,
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This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.
Engineering. --- Circuits and Systems. --- Electronics and Microelectronics, Instrumentation. --- Processor Architectures. --- Computer science. --- Electronics. --- Systems engineering. --- Ingénierie --- Informatique --- Electronique --- Ingénierie des systèmes --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Three-dimensional integrated circuits --- Integrated circuits --- Photonics. --- Nanotechnology. --- Multichip modules (Microelectronics) --- Computer engineering. --- Design and construction. --- Computers --- MCM (Microelectronics) --- Multi-chip modules (Microelectronics) --- Multichip integrated circuits --- Multichip microcircuits --- Multichip packages (Microelectronics) --- Multichip units (Microelectronics) --- Molecular technology --- Nanoscale technology --- New optics --- 3D ICs (Three-dimensional integrated circuits) --- Design and construction --- Microprocessors. --- Microelectronics. --- Electronic circuits. --- Microelectronic packaging --- High technology --- Optics --- Informatics --- Science --- Electrical engineering --- Physical sciences --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Minicomputers --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Electron-tube circuits --- Electric circuits --- Electron tubes
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ISBN: 0780304055 9780780304055 Year: 1994 Publisher: New York: IEEE press,
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Microelectronic packaging --- Optical fibers --- Multichip modules (Microelectronics) --- Integrated circuits --- Semiconductors --- Mathematical models --- Joints --- Very large scale integration --- Junctions --- Computer simulation --- -Multichip modules (Microelectronics) --- -Optical fibers --- -Semiconductors --- -Crystalline semiconductors --- Semi-conductors --- Semiconducting materials --- Semiconductor devices --- Crystals --- Electrical engineering --- Electronics --- Solid state electronics --- Light guides (Optical fibers) --- Fiber optics --- Fibers --- Optical materials --- Optical wave guides --- MCM (Microelectronics) --- Multi-chip modules (Microelectronics) --- Multichip integrated circuits --- Multichip microcircuits --- Multichip packages (Microelectronics) --- Multichip units (Microelectronics) --- Packaging (Microelectronics) --- Electronic packaging --- Microelectronics --- Very large scale integration of circuits --- VLSI circuits --- Very large scale integration. --- -Mathematical models --- -Computer simulation --- Materials --- -Very large scale integration. --- Chips (Electronics) --- Circuits, Integrated --- Computer chips --- Microchips --- Electronic circuits --- Crystalline semiconductors --- Very large scale integration&delete& --- Joints&delete& --- Junctions&delete& --- Microelectronic packaging - Mathematical models --- Optical fibers - Joints - Mathematical models --- Multichip modules (Microelectronics) - Mathematical models --- Integrated circuits - Very large scale integration - Mathematical models --- Semiconductors - Junctions - Computer simulation
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