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Annotation Due to a direct application of conductor tracks and functional structures on randomly shaped substrates, the technology MID (Molded Interconnect Devices Mechatronic Integrated Devices) enables the production of highly integrated mechatronic products. Since 1994, the Research Association 3 D MID biennially organizes the International Congress Molded Interconnect Devices in Germany in order to support the further development of the technology by offering a platform for the global transfer of knowledge and information. With about 300 participants from all over the world this international recognized conference is the worlds leading event in the field of MID Further information http://www.3dmid.de/technology.html.

Three-dimensional display systems --- Molded interconnect devices

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Collection of selected, peer reviewed papers from the 11 th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability.

Molded interconnect devices. --- Three-dimensional display systems --- Interconnect devices, Molded --- MIDs (Molded interconnect devices) --- Electronic circuits

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This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions.

Integrated circuits --- Plasma etching. --- Molded interconnect devices. --- Very large scale integration.