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Book
2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)
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ISBN: 166540230X 1665402318 Year: 2021 Publisher: Piscataway, New Jersey : IEEE,

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"2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)"
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ISBN: 1728198518 9781728198514 1728198526 Year: 2020 Publisher: IEEE

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Book
Microelectronics packaging handbook.. 3, Subsystem packaging
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Year: 2001 Publisher: Boston (Mass.): Kluwer,

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Book
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei
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ISBN: 1424436230 1424436249 1424436222 1509080600 Year: 2008 Publisher: Piscataway, New Jersey : Institute of Electrical and Electronics Engineers,

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2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
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ISBN: 1509013911 1509014578 Year: 2016 Publisher: Piscataway, NJ : IEEE,

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Annotation This unique single meeting event brings together participants interested in MEMS MOEMS processing and those interested in design tools and methods to facilitate the design of MEMS MOEMS All aspects including design, modeling, testing, micro machining, integration and packaging of structures, devices and systems are addressed in two main Conferences, Special Sessions and Invited Talks.


Book
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) : proceedings : October 26 (Wed) - 28 (Fri), 2016, Taipei Nangang Exhibition Center
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ISBN: 1509047697 1509047700 Year: 2016 Publisher: Piscataway, NJ : IEEE,

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Annotation The Internet of Things, including wearable devices and smart home products, will again be a big theme To cater for the technology trends, the theme of IMPACT IAAC 2016 highlights IMPACT on the Next Big Things and will arrange panel sessions, invited talks, industrial sessions and outstanding paper presentations.


Book
EDAPS : 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium : 14-16 December 2017.
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ISBN: 1538612380 1538612399 Year: 2018 Publisher: New York : IEEE,

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IMPACT : 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference : 25-27 October 2017.
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ISBN: 1538647192 1538647206 Year: 2018 Publisher: New York : IEEE,

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Book
DTIP 2018 : collection of papers presented at the Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS : Roma, Italy, May 22nd-25th, 2018
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ISBN: 1538661993 1538662000 Year: 2018 Publisher: Piscataway, New Jersey : Institute of Electrical and Electronics Engineers,

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Microelectronic interconnects and packages : optical and electrical technologies
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ISBN: 081940456X Year: 1991 Publisher: Bellingham (Wash.) : SPIE,

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