Listing 1 - 3 of 3 |
Sort by
|
Choose an application
Gold alloys. --- Eutectic alloys. --- Flip chip technology. --- Flip chip devices --- Electronic packaging --- Alloys
Choose an application
This book provides a unified treatment of Flip-Flop design and selection in nanometer CMOS VLSI systems. The design aspects related to the energy-delay tradeoff in Flip-Flops are discussed, including their energy-optimal selection according to the targeted application, and the detailed circuit design in nanometer CMOS VLSI systems. Design strategies are derived in a coherent framework that includes explicitly nanometer effects, including leakage, layout parasitics and process/voltage/temperature variations, as main advances over the existing body of work in the field. The related design tradeoffs are explored in a wide range of applications and the related energy-performance targets. A wide range of existing and recently proposed Flip-Flop topologies are discussed. Theoretical foundations are provided to set the stage for the derivation of design guidelines, and emphasis is given on practical aspects and consequences of the presented results. Analytical models and derivations are introduced when needed to gain an insight into the inter-dependence of design parameters under practical constraints. This book serves as a valuable reference for practicing engineers working in the VLSI design area, and as text book for senior undergraduate, graduate and postgraduate students (already familiar with digital circuits and timing). • Provides a unified treatment of Flip-Flop design and energy/variation-aware selection in nanometer CMOS VLSI systems • Offers in-depth analysis of the impact of nanometer effects on design tradeoffs • Presents a comprehensive analysis, by considering more than 20 topologies covering all relevant classes of circuits • Uses a rigorous framework based on novel methodologies to include layout parasitics within the circuit design loop .
Engineering. --- Circuits and Systems. --- Electronic Circuits and Devices. --- Processor Architectures. --- Nanotechnology and Microengineering. --- Computer science. --- Systems engineering. --- Ingénierie --- Informatique --- Ingénierie des systèmes --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Metal oxide semiconductors, Complementary --- Flip chip technology. --- Integrated circuits --- Design and construction. --- Very large scale integration --- Flip chip devices --- Microprocessors. --- Electronic circuits. --- Nanotechnology. --- Electronic packaging --- Construction --- Industrial arts --- Technology --- Informatics --- Science --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Design and construction --- Molecular technology --- Nanoscale technology --- High technology --- Minicomputers --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics
Choose an application
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.
Flip chip technology. --- Flip chip technology --- Electronic packaging --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Electronic packaging. --- Flip chip devices --- Packaging (Electronics) --- Engineering. --- Electronics. --- Microelectronics. --- Electronic circuits. --- Optical materials. --- Electronic materials. --- Electronics and Microelectronics, Instrumentation. --- Circuits and Systems. --- Optical and Electronic Materials. --- Electronic apparatus and appliances --- Electronics --- Systems engineering. --- Optics --- Materials --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Electrical engineering --- Physical sciences --- Design and construction --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Electronic materials
Listing 1 - 3 of 3 |
Sort by
|