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Development of sub-mm wave flip-chip interconnect
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ISBN: 3736984103 9783736984103 9783736994102 Year: 2016 Publisher: Gottingen, Germany : Cuvillier Verlag,

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Book
Flip-Flop Design in Nanometer CMOS : From High Speed to Low Energy
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ISBN: 9783319019970 3319019961 9783319019963 331901997X Year: 2015 Publisher: Cham : Springer International Publishing : Imprint: Springer,

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This book provides a unified treatment of Flip-Flop design and selection in nanometer CMOS VLSI systems. The design aspects related to the energy-delay tradeoff in Flip-Flops are discussed, including their energy-optimal selection according to the targeted application, and the detailed circuit design in nanometer CMOS VLSI systems. Design strategies are derived in a coherent framework that includes explicitly nanometer effects, including leakage, layout parasitics and process/voltage/temperature variations, as main advances over the existing body of work in the field. The related design tradeoffs are explored in a wide range of applications and the related energy-performance targets. A wide range of existing and recently proposed Flip-Flop topologies are discussed. Theoretical foundations are provided to set the stage for the derivation of design guidelines, and emphasis is given on practical aspects and consequences of the presented results. Analytical models and derivations are introduced when needed to gain an insight into the inter-dependence of design parameters under practical constraints. This book serves as a valuable reference for practicing engineers working in the VLSI design area, and as text book for senior undergraduate, graduate  and postgraduate students (already familiar with digital circuits and timing). • Provides a unified treatment of Flip-Flop design and energy/variation-aware selection in nanometer CMOS VLSI systems • Offers in-depth analysis of the impact of nanometer effects on  design tradeoffs • Presents a comprehensive analysis, by considering more than 20 topologies covering all relevant classes of circuits • Uses a rigorous framework based on novel methodologies to include layout parasitics within the circuit design loop  .


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Advanced flip chip packaging
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ISBN: 1441957677 1441957685 Year: 2013 Publisher: New York : Springer,

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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

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