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Heat sinks (Electronics) --- Dissipators (Electronics) --- Electronic apparatus and appliances --- Heat --- Semiconductors --- Cooling --- Transmission
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ITherm 2017 is the leading international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages, and systems.
Electronic apparatus and appliances --- Heat sinks (Electronics) --- Thermal properties --- Dissipators (Electronics) --- Heat --- Semiconductors --- Electronic devices --- Electronics --- Physical instruments --- Scientific apparatus and instruments --- Electronic instruments --- Cooling --- Transmission --- Apparatus and appliances
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Electronic apparatus and appliances --- Heat sinks (Electronics) --- Thermal properties --- Dissipators (Electronics) --- Heat --- Semiconductors --- Electronic devices --- Electronics --- Physical instruments --- Scientific apparatus and instruments --- Electronic instruments --- Cooling --- Transmission --- Apparatus and appliances
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Electronic apparatus and appliances --- Heat sinks (Electronics) --- Ball grid array technology --- BGA (Printed circuits) --- Electronic packaging --- Solder and soldering --- Dissipators (Electronics) --- Heat --- Semiconductors --- Electronic devices --- Electronics --- Physical instruments --- Scientific apparatus and instruments --- Electronic instruments --- Thermal properties --- Cooling --- Transmission --- Apparatus and appliances
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Flow Boiling in Microgap Channels: Experiment, Visualization and Analysis presents an up-to-date summary of the details of the confined to unconfined flow boiling transition criteria, flow boiling heat transfer and pressure drop characteristics, instability characteristics, two phase flow pattern and flow regime map and the parametric study of microgap dimension. Advantages of flow boiling in microgaps over microchannels are also highlighted. The objective of this Brief is to obtain a better fundamental understanding of the flow boiling processes, compare the performance between microgap and conventional microchannel heat sinks, and evaluate the microgap heat sink for instabilities and hotspot mitigation.
Electronic apparatus and appliances --- Heat sinks (Electronics) --- Electronic packaging. --- System failures (Engineering) --- Thermal properties. --- Protection. --- Prevention. --- Failure of engineering systems --- Packaging (Electronics) --- Dissipators (Electronics) --- Engineering. --- Energy systems. --- Electric power production. --- Thermodynamics. --- Heat engineering. --- Heat transfer. --- Mass transfer. --- Engineering Thermodynamics, Heat and Mass Transfer. --- Energy Technology. --- Energy Systems. --- Reliability (Engineering) --- Systems engineering --- Electronics --- Heat --- Semiconductors --- Electronic packaging --- Cooling --- Transmission --- Construction --- Industrial arts --- Technology --- Mass transport (Physics) --- Thermodynamics --- Transport theory --- Heat transfer --- Thermal transfer --- Transmission of heat --- Energy transfer --- Mechanical engineering --- Chemistry, Physical and theoretical --- Dynamics --- Mechanics --- Physics --- Heat-engines --- Quantum theory --- Ebullition. --- Transmission.
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