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Computing and communication capabilities are increasingly embedded in diverse objects and structures in the physical environment. They will link the ‘cyberworld’ of computing and communications with the physical world. These applications are called cyber physical systems (CPS). Obviously, the increased involvement of real-world entities leads to a greater demand for trustworthy systems. Hence, we use "system trustworthiness" here, which can guarantee continuous service in the presence of internal errors or external attacks. Mobile CPS (MCPS) is a prominent subcategory of CPS in which the physical component has no permanent location. Mobile Internet devices already provide ubiquitous platforms for building novel MCPS applications. The objective of this Special Issue is to contribute to research in modern/future trustworthy MCPS, including design, modeling, simulation, dependability, and so on. It is imperative to address the issues which are critical to their mobility, report significant advances in the underlying science, and discuss the challenges of development and implementation in various applications of MCPS.
AUTOSAR --- DAG --- runnable scheduling --- control-scheduling codesign --- lagrange multiplier --- Mobile Cyber-Physical Systems (MCPS) --- industry --- Mobile Sink Groups (MSG) --- group mobility --- real-time data delivery --- Intelligent Transportation System (ITS) --- deep neural network --- Red Light Runner (RLR) --- dynamic signal control --- intersection safety --- mixed-criticality --- power-aware --- real-time scheduling --- DVFS --- security taxonomies --- event-based systems --- mobile cyber physical systems --- security flaws --- searchable encryption --- PEKS --- forward privacy --- trusted execution environment --- SGX --- data quality --- large-scale --- high-dimensionality --- linear discriminant analysis --- random projection --- bootstrapping --- controller area network bus --- authentication --- authenticity --- resiliency --- sustainability --- formal verification --- model checking --- in-vehicle network --- model compression --- adversarial robustness --- weight pruning --- adversarial training --- distillation --- embedded system --- secure AI --- n/a
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Computing and communication capabilities are increasingly embedded in diverse objects and structures in the physical environment. They will link the ‘cyberworld’ of computing and communications with the physical world. These applications are called cyber physical systems (CPS). Obviously, the increased involvement of real-world entities leads to a greater demand for trustworthy systems. Hence, we use "system trustworthiness" here, which can guarantee continuous service in the presence of internal errors or external attacks. Mobile CPS (MCPS) is a prominent subcategory of CPS in which the physical component has no permanent location. Mobile Internet devices already provide ubiquitous platforms for building novel MCPS applications. The objective of this Special Issue is to contribute to research in modern/future trustworthy MCPS, including design, modeling, simulation, dependability, and so on. It is imperative to address the issues which are critical to their mobility, report significant advances in the underlying science, and discuss the challenges of development and implementation in various applications of MCPS.
Technology: general issues --- AUTOSAR --- DAG --- runnable scheduling --- control-scheduling codesign --- lagrange multiplier --- Mobile Cyber-Physical Systems (MCPS) --- industry --- Mobile Sink Groups (MSG) --- group mobility --- real-time data delivery --- Intelligent Transportation System (ITS) --- deep neural network --- Red Light Runner (RLR) --- dynamic signal control --- intersection safety --- mixed-criticality --- power-aware --- real-time scheduling --- DVFS --- security taxonomies --- event-based systems --- mobile cyber physical systems --- security flaws --- searchable encryption --- PEKS --- forward privacy --- trusted execution environment --- SGX --- data quality --- large-scale --- high-dimensionality --- linear discriminant analysis --- random projection --- bootstrapping --- controller area network bus --- authentication --- authenticity --- resiliency --- sustainability --- formal verification --- model checking --- in-vehicle network --- model compression --- adversarial robustness --- weight pruning --- adversarial training --- distillation --- embedded system --- secure AI --- AUTOSAR --- DAG --- runnable scheduling --- control-scheduling codesign --- lagrange multiplier --- Mobile Cyber-Physical Systems (MCPS) --- industry --- Mobile Sink Groups (MSG) --- group mobility --- real-time data delivery --- Intelligent Transportation System (ITS) --- deep neural network --- Red Light Runner (RLR) --- dynamic signal control --- intersection safety --- mixed-criticality --- power-aware --- real-time scheduling --- DVFS --- security taxonomies --- event-based systems --- mobile cyber physical systems --- security flaws --- searchable encryption --- PEKS --- forward privacy --- trusted execution environment --- SGX --- data quality --- large-scale --- high-dimensionality --- linear discriminant analysis --- random projection --- bootstrapping --- controller area network bus --- authentication --- authenticity --- resiliency --- sustainability --- formal verification --- model checking --- in-vehicle network --- model compression --- adversarial robustness --- weight pruning --- adversarial training --- distillation --- embedded system --- secure AI
Choose an application
Computing and communication capabilities are increasingly embedded in diverse objects and structures in the physical environment. They will link the ‘cyberworld’ of computing and communications with the physical world. These applications are called cyber physical systems (CPS). Obviously, the increased involvement of real-world entities leads to a greater demand for trustworthy systems. Hence, we use "system trustworthiness" here, which can guarantee continuous service in the presence of internal errors or external attacks. Mobile CPS (MCPS) is a prominent subcategory of CPS in which the physical component has no permanent location. Mobile Internet devices already provide ubiquitous platforms for building novel MCPS applications. The objective of this Special Issue is to contribute to research in modern/future trustworthy MCPS, including design, modeling, simulation, dependability, and so on. It is imperative to address the issues which are critical to their mobility, report significant advances in the underlying science, and discuss the challenges of development and implementation in various applications of MCPS.
Technology: general issues --- AUTOSAR --- DAG --- runnable scheduling --- control-scheduling codesign --- lagrange multiplier --- Mobile Cyber-Physical Systems (MCPS) --- industry --- Mobile Sink Groups (MSG) --- group mobility --- real-time data delivery --- Intelligent Transportation System (ITS) --- deep neural network --- Red Light Runner (RLR) --- dynamic signal control --- intersection safety --- mixed-criticality --- power-aware --- real-time scheduling --- DVFS --- security taxonomies --- event-based systems --- mobile cyber physical systems --- security flaws --- searchable encryption --- PEKS --- forward privacy --- trusted execution environment --- SGX --- data quality --- large-scale --- high-dimensionality --- linear discriminant analysis --- random projection --- bootstrapping --- controller area network bus --- authentication --- authenticity --- resiliency --- sustainability --- formal verification --- model checking --- in-vehicle network --- model compression --- adversarial robustness --- weight pruning --- adversarial training --- distillation --- embedded system --- secure AI --- n/a
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This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
History of engineering & technology --- lithium-ion battery --- thermal modelling --- electro-thermal model --- heat generation --- experimental validation --- thermal transient testing --- non-destructive testing --- thermal testability --- accuracy repeatability and reproducibility of thermal measurements --- thermal testing standards --- 3D IC --- microchannels --- liquid cooling --- compact thermal model --- thermal simulation --- hotspot --- thermal-aware task scheduling --- DVFS --- statistical analysis --- electronic packages --- detailed thermal model --- Joint Electron Device Engineering Council (JEDEC) metrics --- thermal impedance --- AlGaN-GaN HEMT --- TDTR --- thermal conductivity --- thermal interface resistance --- size effect --- phonon transport mechanisms --- nonlinear thermal model --- SPICE --- pulse transformer --- thermal phenomena --- self-heating --- modelling --- measurements --- BCI-DCTM --- ROM --- modal approach --- BGA --- module temperature --- solar energy --- heat transfer mechanisms --- power LED measurement and simulation --- life testing --- reliability testing --- LM-80 --- TM-21 --- LED lifetime modelling --- LED multi-domain modelling --- Spice-like modelling of LEDs --- lifetime extrapolation and modelling of LEDs --- beyond CMOS --- VO2 --- thermal-electronic circuits --- electro-thermal simulation --- vertical structure --- power LEDs --- thermal pads --- thermal resistance --- optical efficiency --- electronics cooling --- Light-emitting diodes --- CoB LEDs --- multi-domain modeling --- finite volume method --- phosphor modeling --- magnetic nanoparticle --- microfluidics --- CFD --- OpenFOAM --- two-phase solver --- rheology --- LED --- Delphi4LED --- digital twin --- digital luminaire design --- computation time --- Industry 4.0 --- lithium-ion battery --- thermal modelling --- electro-thermal model --- heat generation --- experimental validation --- thermal transient testing --- non-destructive testing --- thermal testability --- accuracy repeatability and reproducibility of thermal measurements --- thermal testing standards --- 3D IC --- microchannels --- liquid cooling --- compact thermal model --- thermal simulation --- hotspot --- thermal-aware task scheduling --- DVFS --- statistical analysis --- electronic packages --- detailed thermal model --- Joint Electron Device Engineering Council (JEDEC) metrics --- thermal impedance --- AlGaN-GaN HEMT --- TDTR --- thermal conductivity --- thermal interface resistance --- size effect --- phonon transport mechanisms --- nonlinear thermal model --- SPICE --- pulse transformer --- thermal phenomena --- self-heating --- modelling --- measurements --- BCI-DCTM --- ROM --- modal approach --- BGA --- module temperature --- solar energy --- heat transfer mechanisms --- power LED measurement and simulation --- life testing --- reliability testing --- LM-80 --- TM-21 --- LED lifetime modelling --- LED multi-domain modelling --- Spice-like modelling of LEDs --- lifetime extrapolation and modelling of LEDs --- beyond CMOS --- VO2 --- thermal-electronic circuits --- electro-thermal simulation --- vertical structure --- power LEDs --- thermal pads --- thermal resistance --- optical efficiency --- electronics cooling --- Light-emitting diodes --- CoB LEDs --- multi-domain modeling --- finite volume method --- phosphor modeling --- magnetic nanoparticle --- microfluidics --- CFD --- OpenFOAM --- two-phase solver --- rheology --- LED --- Delphi4LED --- digital twin --- digital luminaire design --- computation time --- Industry 4.0
Choose an application
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
History of engineering & technology --- lithium-ion battery --- thermal modelling --- electro-thermal model --- heat generation --- experimental validation --- thermal transient testing --- non-destructive testing --- thermal testability --- accuracy repeatability and reproducibility of thermal measurements --- thermal testing standards --- 3D IC --- microchannels --- liquid cooling --- compact thermal model --- thermal simulation --- hotspot --- thermal-aware task scheduling --- DVFS --- statistical analysis --- electronic packages --- detailed thermal model --- Joint Electron Device Engineering Council (JEDEC) metrics --- thermal impedance --- AlGaN-GaN HEMT --- TDTR --- thermal conductivity --- thermal interface resistance --- size effect --- phonon transport mechanisms --- nonlinear thermal model --- SPICE --- pulse transformer --- thermal phenomena --- self-heating --- modelling --- measurements --- BCI-DCTM --- ROM --- modal approach --- BGA --- module temperature --- solar energy --- heat transfer mechanisms --- power LED measurement and simulation --- life testing --- reliability testing --- LM-80 --- TM-21 --- LED lifetime modelling --- LED multi-domain modelling --- Spice-like modelling of LEDs --- lifetime extrapolation and modelling of LEDs --- beyond CMOS --- VO2 --- thermal-electronic circuits --- electro-thermal simulation --- vertical structure --- power LEDs --- thermal pads --- thermal resistance --- optical efficiency --- electronics cooling --- Light-emitting diodes --- CoB LEDs --- multi-domain modeling --- finite volume method --- phosphor modeling --- magnetic nanoparticle --- microfluidics --- CFD --- OpenFOAM --- two-phase solver --- rheology --- LED --- Delphi4LED --- digital twin --- digital luminaire design --- computation time --- Industry 4.0
Choose an application
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
lithium-ion battery --- thermal modelling --- electro-thermal model --- heat generation --- experimental validation --- thermal transient testing --- non-destructive testing --- thermal testability --- accuracy repeatability and reproducibility of thermal measurements --- thermal testing standards --- 3D IC --- microchannels --- liquid cooling --- compact thermal model --- thermal simulation --- hotspot --- thermal-aware task scheduling --- DVFS --- statistical analysis --- electronic packages --- detailed thermal model --- Joint Electron Device Engineering Council (JEDEC) metrics --- thermal impedance --- AlGaN-GaN HEMT --- TDTR --- thermal conductivity --- thermal interface resistance --- size effect --- phonon transport mechanisms --- nonlinear thermal model --- SPICE --- pulse transformer --- thermal phenomena --- self-heating --- modelling --- measurements --- BCI-DCTM --- ROM --- modal approach --- BGA --- module temperature --- solar energy --- heat transfer mechanisms --- power LED measurement and simulation --- life testing --- reliability testing --- LM-80 --- TM-21 --- LED lifetime modelling --- LED multi-domain modelling --- Spice-like modelling of LEDs --- lifetime extrapolation and modelling of LEDs --- beyond CMOS --- VO2 --- thermal-electronic circuits --- electro-thermal simulation --- vertical structure --- power LEDs --- thermal pads --- thermal resistance --- optical efficiency --- electronics cooling --- Light-emitting diodes --- CoB LEDs --- multi-domain modeling --- finite volume method --- phosphor modeling --- magnetic nanoparticle --- microfluidics --- CFD --- OpenFOAM --- two-phase solver --- rheology --- LED --- Delphi4LED --- digital twin --- digital luminaire design --- computation time --- Industry 4.0
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