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This book is composed of 6 papers. The first paper reports a novel technique for the selective emitter formation by controlling the surface morphology of Si wafers. Selective emitter (SE) technology has attracted renewed attention in the Si solar cell industry to achieve an improved conversion efficiency of passivated-emitter rear-contact (PERC) cells. In the second paper, the temperature dependence of the parameters was compared through the PERC of the industrial-scale solar cells. As a result of their analysis, PERC cells showed different temperature dependence for the fill factor loss as temperatures rose. The third paper reports the effects of carrier selective front contact layer and defect state of hydrogenated amorphous silicon passivation layer/n-type crystalline silicon interface. The results demonstrated the effects of band offset determined by band bending at the interface of the passivation layer and carrier selective front contact layer. In addition, the nc-SiOx: H CSFC layer not only reduces parasitic absorption loss but also has a tunneling effect and field-effect passivation. The fourth paper reports excimer laser annealing of hydrogenated amorphous silicon film for TOPCon solar cell application. This paper analyzes the crystallization of a-Si:H via excimer laser annealing (ELA) and compared this process with conventional thermal annealing. The fifth paper reports the contact mechanism between Ag–Al and Si and the change in contact resistance (Rc) by varying the firing profile. Rc was measured by varying the belt speed and peak temperature of the fast-firing furnace. The sixth paper reports a silicon tandem heterojunction solar cell based on a ZnO/Cu2O subcell and a c-Si bottom subcell using electro-optical numerical modeling. The buffer layer affinity and mobility together with a low conduction band offset for the heterojunction are discussed, as well as spectral properties of the device model.

History of engineering & technology --- fill factor loss analysis --- double-diode model --- PERC --- temperature dependence --- recombination current density --- parasitic resistance --- carrier selective contact --- rear emitter heterojunction --- passivation --- crystallinity --- thermal annealing --- excimer laser annealing --- amorphous hydrogenated silicon film --- metallization --- contact formation --- Ag/Al paste --- p+ emitter --- N-type bifacial solar cells --- silicon tandem heterojunction solar cell --- N-doped Cu2O absorber layer --- Al:ZnO (AZO) --- numerical electro-optical modeling --- scanning electron microscopy (SEM) --- atomic force microscopy (AFM) --- X-ray diffraction (XRD) --- spectroscopic ellipsometry (SE) --- Fourier-transform infrared (FTIR) spectroscopy --- degradation degree --- failure rate --- selective emitter --- surface morphology --- doping process --- solar cell

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This book is composed of 6 papers. The first paper reports a novel technique for the selective emitter formation by controlling the surface morphology of Si wafers. Selective emitter (SE) technology has attracted renewed attention in the Si solar cell industry to achieve an improved conversion efficiency of passivated-emitter rear-contact (PERC) cells. In the second paper, the temperature dependence of the parameters was compared through the PERC of the industrial-scale solar cells. As a result of their analysis, PERC cells showed different temperature dependence for the fill factor loss as temperatures rose. The third paper reports the effects of carrier selective front contact layer and defect state of hydrogenated amorphous silicon passivation layer/n-type crystalline silicon interface. The results demonstrated the effects of band offset determined by band bending at the interface of the passivation layer and carrier selective front contact layer. In addition, the nc-SiOx: H CSFC layer not only reduces parasitic absorption loss but also has a tunneling effect and field-effect passivation. The fourth paper reports excimer laser annealing of hydrogenated amorphous silicon film for TOPCon solar cell application. This paper analyzes the crystallization of a-Si:H via excimer laser annealing (ELA) and compared this process with conventional thermal annealing. The fifth paper reports the contact mechanism between Ag–Al and Si and the change in contact resistance (Rc) by varying the firing profile. Rc was measured by varying the belt speed and peak temperature of the fast-firing furnace. The sixth paper reports a silicon tandem heterojunction solar cell based on a ZnO/Cu2O subcell and a c-Si bottom subcell using electro-optical numerical modeling. The buffer layer affinity and mobility together with a low conduction band offset for the heterojunction are discussed, as well as spectral properties of the device model.

History of engineering & technology --- fill factor loss analysis --- double-diode model --- PERC --- temperature dependence --- recombination current density --- parasitic resistance --- carrier selective contact --- rear emitter heterojunction --- passivation --- crystallinity --- thermal annealing --- excimer laser annealing --- amorphous hydrogenated silicon film --- metallization --- contact formation --- Ag/Al paste --- p+ emitter --- N-type bifacial solar cells --- silicon tandem heterojunction solar cell --- N-doped Cu2O absorber layer --- Al:ZnO (AZO) --- numerical electro-optical modeling --- scanning electron microscopy (SEM) --- atomic force microscopy (AFM) --- X-ray diffraction (XRD) --- spectroscopic ellipsometry (SE) --- Fourier-transform infrared (FTIR) spectroscopy --- degradation degree --- failure rate --- selective emitter --- surface morphology --- doping process --- solar cell --- fill factor loss analysis --- double-diode model --- PERC --- temperature dependence --- recombination current density --- parasitic resistance --- carrier selective contact --- rear emitter heterojunction --- passivation --- crystallinity --- thermal annealing --- excimer laser annealing --- amorphous hydrogenated silicon film --- metallization --- contact formation --- Ag/Al paste --- p+ emitter --- N-type bifacial solar cells --- silicon tandem heterojunction solar cell --- N-doped Cu2O absorber layer --- Al:ZnO (AZO) --- numerical electro-optical modeling --- scanning electron microscopy (SEM) --- atomic force microscopy (AFM) --- X-ray diffraction (XRD) --- spectroscopic ellipsometry (SE) --- Fourier-transform infrared (FTIR) spectroscopy --- degradation degree --- failure rate --- selective emitter --- surface morphology --- doping process --- solar cell

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Introduction and Scope—During the last few decades, an enormous effort has been made to understand corrosion phenomena and their mechanisms, and to elucidate the causes that dramatically influence the service lifetime of metal materials. The performance of metal materials in aggressive environments is critical for a sustainable society. The failure of the material in service impacts the economy, the environment, health, and society. In this regard, corrosion-based economic losses due to maintenance, repair, and the replacement of existing structures and infrastructure account for up to 4% of gross domestic product (GDP) in well developed countries. One of the biggest issues in corrosion engineering is estimating service lifetime. Corrosion prediction has become very difficult, as there is no direct correlation with service lifetime and experimental lab results, usually as a result of discrepancies between accelerated testing and real corrosion processes. It is of major interest to forecast the impact of corrosion-based losses on society and the global economy, since existing structures and infrastructure are becoming old, and crucial decisions now need to be made to replace them. On the other hand, environmental protocols seek to reduce greenhouse effects. Therefore, low emission policies, in force, establish regulations for the next generation of materials and technologies. Advanced technologies and emergent materials will enable us to get through the next century. Great advances are currently in progress for the development of corrosion-resistant metal materials for different sectors, such as energy, transport, construction, and health. This Special Issue on the corrosion and protection of metals is focused on current trends in corrosion science, engineering, and technology, ranging from fundamental to applied research, thus covering subjects related to corrosion mechanisms and modelling, protection and inhibition processes, and mitigation strategies.

high interstitial alloy --- molybdenum --- pitting corrosion --- passive film --- Cu-Mg alloy --- conform --- surface nanocrystallization --- corrosion resistance --- corrosion --- spring steel --- shot peening --- Mott–Schottky analysis --- point defect --- alloy --- magnesium --- SEM-EDS --- EIS --- mass loss --- corrosion layers --- duplex stainless steel --- intergranular corrosion --- stress corrosion cracking --- CPT --- DL-EPR --- aluminum --- heat exchanger --- galvanic corrosion --- simulation --- polarization --- electrochemical impedance spectroscopy --- high velocity oxy fuel coatings --- iron aluminide --- titanium carbide --- atmospheric corrosion --- strain measurement --- mild steel --- corrosion product --- residual stress --- AC current density --- crystallographic texture --- intergranular and transgranular cracks --- brass --- CuZn36Pb2As --- CuZn21Si3P --- dezincification --- simulated drinking water --- long immersion --- mortar --- reinforcement --- lean duplex --- stainless steel --- chloride --- alkalinity --- microstructure --- anodic polarization --- ISO 9223 --- corrosivity categories --- predictive models --- archipelagic regions --- Canary Islands --- X70 steel --- stress corrosion cracking (SCC) --- slow strain rate tests (SSRT) --- electrochemical impedance spectroscopy (EIS) --- cathodic potentials --- Atmospheric corrosion --- corrosion rates --- exposure angle --- orientation angle --- carbon steel --- double loop electrochemical potentiokinetic reactivation (DL−EPR) --- sensitization --- ultrasonic nanocrystal surface modification (UNSM) --- Inconel 718 --- n/a --- Mott-Schottky analysis

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Product miniaturization is a trend for facilitating product usage, enabling product functions to be implemented in microscale geometries, and aimed at reducing product weight, volume, cost and pollution. Driven by ongoing miniaturization in diverse areas, including medical devices, precision equipment, communication devices, micro-electromechanical systems and microsystems technology, the demands for micro metallic products have been tremendously increased. Such a trend requires the development of advanced technology for the micromanufacturing of metallic materials, with regard to producing high-quality micro metallic products that possess excellent dimensional tolerances, the required mechanical properties and improved surface quality. Micromanufacturing differs from conventional manufacturing technology in terms of materials, processes, tools, and machines and equipment, due to the miniaturization nature of the whole micromanufacturing system, which challenges the rapid development of micromanufacturing technology. Such a background has prompted and encouraged us to publish a scholarly book on the topic of the micromanufacturing of metallic materials, with the purpose of providing readers with a valuable document that can be used in the research and development of micromanufacturing technology. This book will be useful for both theoretical and applied research aimed at micromanufacturing technology, and will serve as an important research tool, providing knowledge to be returned to the community not only as valuable scientific literature, but also as technology, processes and productivities.

magnesium alloy --- equal channel angular pressing --- processing route --- miniaturized tensile tests --- slip systems --- twinning --- slow tool servo --- ultra-precision diamond turning --- micro lens arrays (MLAs) --- chatter mark --- forming method --- metallic glasses --- thermoplastic microforming --- ultrasonic vibration --- formability --- freeform optics --- tool path generation --- large aperture optics --- ultra-thin foil --- slip system evolution --- tensile process --- crystal plasticity --- numerical simulation --- grain orientation --- fine blanking --- metallic microgear --- finite element analysis --- electron backscatter diffraction --- critical fracture value --- packaging --- copper substrate --- micro-embossing --- micro-textures --- plasma printing --- micro-punch array --- screen printing --- AISI316 --- surface microstructure --- electrically-assisted rolling --- current density --- T2 copper foil --- additive manufacturing --- residual stress --- thermal stress --- distortion --- prevention --- modeling --- computation --- electrically assisted --- bio-inspired functional surface --- bulk metallic glass --- photolithography --- acoustic softening --- residual effect --- microthin sheet --- forming limit --- punch load --- cut surface quality --- optimum clearance --- blanking experimental --- finite element method analysis --- EDM --- surface --- optimization --- machining --- titanium --- difficult-to-cut material --- Inconel 718 alloy --- micro-drilling --- aspect ratio hole --- deionized water --- micromanufacturing --- metallic materials --- miniaturization --- micro products

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Like all branches of physics and engineering, electromagnetics relies on mathematical methods for modeling, simulation, and design procedures in all of its aspects (radiation, propagation, scattering, imaging, etc.). Originally, rigorous analytical techniques were the only machinery available to produce any useful results. In the 1960s and 1970s, emphasis was placed on asymptotic techniques, which produced approximations of the fields for very high frequencies when closed-form solutions were not feasible. Later, when computers demonstrated explosive progress, numerical techniques were utilized to develop approximate results of controllable accuracy for arbitrary geometries. In this Special Issue, the most recent advances in the aforementioned approaches are presented to illustrate the state-of-the-art mathematical techniques in electromagnetics.

History of engineering & technology --- cubic-quartic Schrödinger equation --- cubic-quartic resonant Schrödinger equation --- parabolic law --- wave field transformation --- finite difference method --- Cole-Cole model --- Monte Carlo simulations --- percolation --- conductivity --- carbon nanotubes composite --- optical parametric amplification --- non-linear wave mixing --- micro-resonator --- optimization --- MRI system --- birdcage coil --- birdcage configurations --- coil capacitance --- analytical solution --- equivalent circuit modelling --- T-matrix theory --- 3D-EM simulation --- small volume RF coil --- method of auxiliary sources (MAS) --- electromagnetic scattering --- wedge --- numerical methods --- accuracy --- coil gun --- reluctance --- electromagnetic launcher --- mechatronics --- electronics --- mechanics --- simulation --- RoboCup --- magnetic field strength --- magnetic flux density --- magnetic potential --- current density --- power transmission line --- electromagnetic modelling --- integral formulation --- skin effect --- thin shell approach --- mutual inductance --- finite element method --- partial element equivalent circuit method --- magnetite nanoparticles --- Mie scattering theory --- near infrared laser --- photothermal therapy --- bioheat transfer --- diffusion approximation --- Arrhenius integral --- breast cancer --- air-core pulsed alternator --- electromagnetic rail launcher --- coupled analysis --- computational electromagnetics --- integral formulations --- cubic-quartic Schrödinger equation --- cubic-quartic resonant Schrödinger equation --- parabolic law --- wave field transformation --- finite difference method --- Cole-Cole model --- Monte Carlo simulations --- percolation --- conductivity --- carbon nanotubes composite --- optical parametric amplification --- non-linear wave mixing --- micro-resonator --- optimization --- MRI system --- birdcage coil --- birdcage configurations --- coil capacitance --- analytical solution --- equivalent circuit modelling --- T-matrix theory --- 3D-EM simulation --- small volume RF coil --- method of auxiliary sources (MAS) --- electromagnetic scattering --- wedge --- numerical methods --- accuracy --- coil gun --- reluctance --- electromagnetic launcher --- mechatronics --- electronics --- mechanics --- simulation --- RoboCup --- magnetic field strength --- magnetic flux density --- magnetic potential --- current density --- power transmission line --- electromagnetic modelling --- integral formulation --- skin effect --- thin shell approach --- mutual inductance --- finite element method --- partial element equivalent circuit method --- magnetite nanoparticles --- Mie scattering theory --- near infrared laser --- photothermal therapy --- bioheat transfer --- diffusion approximation --- Arrhenius integral --- breast cancer --- air-core pulsed alternator --- electromagnetic rail launcher --- coupled analysis --- computational electromagnetics --- integral formulations