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Annotation SISPAD provides an international forum for the presentation of leading edge research, development, and application in all areas of process and device simulation SISPAD is one of the longest running conferences devoted exclusively to TCAD and advanced modeling of novel semiconductor devices and nano electronic structures Topics for original contributions to SISPAD include just about every conceivable aspect of modelling & simulation of nanoelectronics.
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FMCAD is the thirteen in a series of international conferences on the theory and applications of formal methods in hardware and system verification.
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Process & Device Technologies 1 VLSI Design & Circuits 2 Analog, Mixed Signal and RF Circuits 3 Application Specific SOCs 4 Circuits and Systems for Wireless Communications 5 Testing, Reliability, Fault Tolerance 6 Advanced Memory 7 FPGA 8 Circuits Simulation, Synthesis, Verification and Physical Design 9 CAD for System, DFM & Testing 10 MEMS Techniques 11 Nanoelectronics and Gigascale Systems 12 New Devices Hetrojunction Devices, Fin FET, CNT MTJ Devices, 3D Integration, etc 13 Advanced Interconnection Technology, High K Metal gate technology and other VLSI New Processing, New technologies 14 VLSI application for energy generation, conservation and control 15 Processing, Devices Modeling & Simulation 16 Other VLSI Devices and Design related topics.
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The 2015 IEEE International Circuits and Systems Symposium (ICSyS2015) which previously known as ICCAS is the foremost global forum for specialist presentations and interactions in the current and emerging areas of electronic circuits and systems The meeting will provide opportunities of dissemination of information about latest technology to users, manufacturers, academics, and students working in the key area of circuits and systems The conference offers 3 days of technical papers and educational events related to integrated circuits, including analog, digital, mixed signals, systems on a chip, data converters, memory, RF, communications, imagers, medical MEMS, and NEMS ICs.
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Annotation As IC products advance toward higher performance and energy efficiency while the time to market continues to accelerate, future IC engineers will require a deep understanding of the interdependencies between design and technology to expand the product optimization window ICICDT is the forum for engineers, researchers, professors, and graduate students to cross the design technology boundary through interactions with design, technology, and process experts to develop the skills for future IC research and development The unique workshop style of the conference fosters an environment for exchanging breakthrough ideas and collaborating effectively.
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Annotation The aim of the APCASE conference is to provide a highly prestigious venue for academics, system engineering and applied science researchers as well as practitioners in the Asia Pacific region The conference covers both theoretical and practical issues of modern computer aided system and network engineering, as well as topics related to intelligent ubiquitous computation, modern system design methods, software intensive and simulation systems, informatics, cloud computing, security system, case studies of system engineering set in the industrial application context.
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Advanced materials and processing technologies Advanced transistor and interconnect structures Three dimensional (3D) integration Variation tolerant designs Process and design techniques for soft errors, plasma induced damage, and reliability Advanced memory devices and circuits RF, analog, mixed signal, and I O circuits for future technology generations Simulation and modeling of advanced processes, devices, and circuits EDA and design optimizations across system, circuit, and or device levels for high performance, energy efficiency, yield, and or reliability Design for manufacturing, yield, and test System on Chip (SoC) and system in package (SiP) design integration Power semiconductor technologies and circuits Emerging technologies and circuits.
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