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This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards.

Technology: general issues --- History of engineering & technology --- 3D-IC (three-dimensional integrated circuit) --- electromagnetic interference --- near field measurement --- SAC305 --- BGA --- low temperature --- fracture failure --- factorial design of experiment --- genetic algorithm optimization --- return loss --- multiple-input multiple-output (MIMO) --- single event effects --- linear energy transfer --- Monte Carlo simulation --- radiation hardness --- pressureless sintered micron silver joints --- deep space environment --- extreme thermal shocks --- reconstruction --- simulation --- elastic mechanical properties --- state of health --- remaining useful life --- electrochemistry based electrical model --- semi-empirical capacity fading model --- useful life distribution --- quality and reliability assurance --- single event effect --- microdosimetry --- lineal energy --- deconvolution --- gamma process --- lifetime --- measurement system analysis --- reliability estimation --- GaN --- operational amplifier --- proton therapy --- prompt gamma imaging --- 3D X-ray --- bias temperature-humidity reliability test --- conductive anodic filament (CAF) --- de-penalization --- finite element analysis --- n/a

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This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.

History of engineering & technology --- lithium-ion battery --- thermal modelling --- electro-thermal model --- heat generation --- experimental validation --- thermal transient testing --- non-destructive testing --- thermal testability --- accuracy repeatability and reproducibility of thermal measurements --- thermal testing standards --- 3D IC --- microchannels --- liquid cooling --- compact thermal model --- thermal simulation --- hotspot --- thermal-aware task scheduling --- DVFS --- statistical analysis --- electronic packages --- detailed thermal model --- Joint Electron Device Engineering Council (JEDEC) metrics --- thermal impedance --- AlGaN-GaN HEMT --- TDTR --- thermal conductivity --- thermal interface resistance --- size effect --- phonon transport mechanisms --- nonlinear thermal model --- SPICE --- pulse transformer --- thermal phenomena --- self-heating --- modelling --- measurements --- BCI-DCTM --- ROM --- modal approach --- BGA --- module temperature --- solar energy --- heat transfer mechanisms --- power LED measurement and simulation --- life testing --- reliability testing --- LM-80 --- TM-21 --- LED lifetime modelling --- LED multi-domain modelling --- Spice-like modelling of LEDs --- lifetime extrapolation and modelling of LEDs --- beyond CMOS --- VO2 --- thermal-electronic circuits --- electro-thermal simulation --- vertical structure --- power LEDs --- thermal pads --- thermal resistance --- optical efficiency --- electronics cooling --- Light-emitting diodes --- CoB LEDs --- multi-domain modeling --- finite volume method --- phosphor modeling --- magnetic nanoparticle --- microfluidics --- CFD --- OpenFOAM --- two-phase solver --- rheology --- LED --- Delphi4LED --- digital twin --- digital luminaire design --- computation time --- Industry 4.0 --- lithium-ion battery --- thermal modelling --- electro-thermal model --- heat generation --- experimental validation --- thermal transient testing --- non-destructive testing --- thermal testability --- accuracy repeatability and reproducibility of thermal measurements --- thermal testing standards --- 3D IC --- microchannels --- liquid cooling --- compact thermal model --- thermal simulation --- hotspot --- thermal-aware task scheduling --- DVFS --- statistical analysis --- electronic packages --- detailed thermal model --- Joint Electron Device Engineering Council (JEDEC) metrics --- thermal impedance --- AlGaN-GaN HEMT --- TDTR --- thermal conductivity --- thermal interface resistance --- size effect --- phonon transport mechanisms --- nonlinear thermal model --- SPICE --- pulse transformer --- thermal phenomena --- self-heating --- modelling --- measurements --- BCI-DCTM --- ROM --- modal approach --- BGA --- module temperature --- solar energy --- heat transfer mechanisms --- power LED measurement and simulation --- life testing --- reliability testing --- LM-80 --- TM-21 --- LED lifetime modelling --- LED multi-domain modelling --- Spice-like modelling of LEDs --- lifetime extrapolation and modelling of LEDs --- beyond CMOS --- VO2 --- thermal-electronic circuits --- electro-thermal simulation --- vertical structure --- power LEDs --- thermal pads --- thermal resistance --- optical efficiency --- electronics cooling --- Light-emitting diodes --- CoB LEDs --- multi-domain modeling --- finite volume method --- phosphor modeling --- magnetic nanoparticle --- microfluidics --- CFD --- OpenFOAM --- two-phase solver --- rheology --- LED --- Delphi4LED --- digital twin --- digital luminaire design --- computation time --- Industry 4.0

Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.

lithium-ion battery --- thermal modelling --- electro-thermal model --- heat generation --- experimental validation --- thermal transient testing --- non-destructive testing --- thermal testability --- accuracy repeatability and reproducibility of thermal measurements --- thermal testing standards --- 3D IC --- microchannels --- liquid cooling --- compact thermal model --- thermal simulation --- hotspot --- thermal-aware task scheduling --- DVFS --- statistical analysis --- electronic packages --- detailed thermal model --- Joint Electron Device Engineering Council (JEDEC) metrics --- thermal impedance --- AlGaN-GaN HEMT --- TDTR --- thermal conductivity --- thermal interface resistance --- size effect --- phonon transport mechanisms --- nonlinear thermal model --- SPICE --- pulse transformer --- thermal phenomena --- self-heating --- modelling --- measurements --- BCI-DCTM --- ROM --- modal approach --- BGA --- module temperature --- solar energy --- heat transfer mechanisms --- power LED measurement and simulation --- life testing --- reliability testing --- LM-80 --- TM-21 --- LED lifetime modelling --- LED multi-domain modelling --- Spice-like modelling of LEDs --- lifetime extrapolation and modelling of LEDs --- beyond CMOS --- VO2 --- thermal-electronic circuits --- electro-thermal simulation --- vertical structure --- power LEDs --- thermal pads --- thermal resistance --- optical efficiency --- electronics cooling --- Light-emitting diodes --- CoB LEDs --- multi-domain modeling --- finite volume method --- phosphor modeling --- magnetic nanoparticle --- microfluidics --- CFD --- OpenFOAM --- two-phase solver --- rheology --- LED --- Delphi4LED --- digital twin --- digital luminaire design --- computation time --- Industry 4.0