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Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging, discussing the various electrical adhesive options currently available. The book focuses extensively on Electrically Conductive Adhesives (ECAs), as well as other adhesives such as lead-free soldering, Isotropically Conductive Adhesives (ICAs), Anisotropically Conductive Adhesives/Films (ACA/ACFs) and Nonconductive Adhesives/Films (NCA/NCFs). The authors also present examples of how conductive adhesives can be applied to nano techniques, while making important mentions of recent research and development breakthroughs in the fields. Drawing upon tireless research, years of theoretical development and practical experience, and utilizing numerous visual examples and illustrative applications, authors CP Wong, Yi Li and Daniel Lu cover electrically conductive adhesives in depth, while also describing: The electrical properties, thermal performance, bonding pressure, assembly and reliability of numerous types of electrically conductive adhesives The similarities and differences between lead-free soldering techniques and electrically conductive adhesives, while also discussing the advantages of ECAs. Insights into the future of nano ECAs, as well as projections of future industry trends. Electrical Conductive Adhesives with Nanotechnologies is a must-read for both researchers and active engineers in the electronic packaging field.

Electronic packaging --- Solder and soldering --- Adhesives --- Nanostructured materials --- Electrical Engineering --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electric properties --- Electronic packaging. --- Solder and soldering. --- Nanostructured materials. --- Electric properties. --- Nanomaterials --- Nanometer materials --- Nanophase materials --- Nanostructure controlled materials --- Nanostructure materials --- Ultra-fine microstructure materials --- Agglutinants --- Bonding agents (Adhesives) --- Packaging (Electronics) --- Engineering. --- Electronics. --- Microelectronics. --- Electronic circuits. --- Materials science. --- Optical materials. --- Electronic materials. --- Nanotechnology. --- Circuits and Systems. --- Electronics and Microelectronics, Instrumentation. --- Optical and Electronic Materials. --- Materials Science, general. --- Microstructure --- Nanotechnology --- Binders (Materials) --- Cement --- Cements, Adhesive --- Glue --- Mucilage --- Alloys --- Filler metal --- Metal-work --- Sealing (Technology) --- Brazing --- Electronic apparatus and appliances --- Electronics --- Systems engineering. --- Materials. --- Engineering --- Engineering materials --- Industrial materials --- Engineering design --- Manufacturing processes --- Optics --- Materials --- Molecular technology --- Nanoscale technology --- High technology --- Electrical engineering --- Physical sciences --- Engineering systems --- System engineering --- Industrial engineering --- System analysis --- Design and construction --- Material science --- Electronic materials --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Electron-tube circuits --- Electric circuits --- Electron tubes