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Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

Welded joints. --- Welded joints --- Solder and soldering. --- Metals --- Reliability. --- Weldability. --- Alloys --- Filler metal --- Metal-work --- Sealing (Technology) --- Brazing --- Welding --- Welds --- Joints (Engineering) --- Materials. --- Systems engineering. --- System safety. --- Manufactures. --- Electronics. --- Metallic Materials. --- Circuits and Systems. --- Quality Control, Reliability, Safety and Risk. --- Manufacturing, Machines, Tools, Processes. --- Electronics and Microelectronics, Instrumentation. --- Manufactured goods --- Manufactured products --- Products --- Products, Manufactured --- Commercial products --- Manufacturing industries --- Safety, System --- Safety of systems --- Systems safety --- Accidents --- Industrial safety --- Systems engineering --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Engineering materials --- Industrial materials --- Engineering design --- Manufacturing processes --- Electrical engineering --- Physical sciences --- Prevention --- Design and construction --- Materials --- Metals. --- Electronic circuits. --- Quality control. --- Industrial safety. --- Microelectronics. --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Industrial accidents --- Industries --- Job safety --- Occupational hazards, Prevention of --- Occupational health and safety --- Occupational safety and health --- Prevention of industrial accidents --- Prevention of occupational hazards --- Safety, Industrial --- Safety engineering --- Safety measures --- Safety of workers --- System safety --- Dependability --- Trustworthiness --- Conduct of life --- Factory management --- Reliability (Engineering) --- Sampling (Statistics) --- Standardization --- Quality assurance --- Quality of products --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Metallic elements --- Chemical elements --- Ores --- Metallurgy

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Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.

Thin films --- Reliability (Engineering) --- Electric properties.

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Thin films

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"This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology"--

Electronic packaging.

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Integrated circuits --- Semiconductors --- Large scale integration