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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs has become widespread and continues to lead to a much better understanding of reliability physics. To help readers cope with the increasing sophistication of FEMs’ applications to interconnect reliability, Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections will: introduce the principle of FEMs; review numerical modeling of ULSI interconnect reliability; describe the physical mechanism of ULSI interconnect reliability encountered in the electronics industry; and discuss in detail the use of FEMs to understand and improve ULSI interconnect reliability from both the physical and practical perspective, incorporating the Monte Carlo method. A full-scale review of the numerical modeling methodology used in the study of interconnect reliability highlights useful and noteworthy techniques that have been developed recently. Many illustrations are used throughout the book to improve the reader’s understanding of the methodology and its verification. Actual experimental results and micrographs on ULSI interconnects are also included. Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections is a good reference for researchers who are working on interconnect reliability modeling, as well as for those who want to know more about FEMs for reliability applications. It gives readers a thorough understanding of the applications of FEM to reliability modeling and an appreciation of the strengths and weaknesses of various numerical models for interconnect reliability.

Metal-cutting. --- Integrated circuits --- Finite element method --- Reliability (Engineering) --- Mechanical Engineering --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Chemical & Materials Engineering --- Electrical Engineering --- Technology - General --- Industrial & Management Engineering --- Materials Science --- Ultra large scale integration --- Finite element method. --- Engineering mathematics. --- Engineering --- Engineering analysis --- Reliability of equipment --- Systems reliability --- FEA (Numerical analysis) --- FEM (Numerical analysis) --- Finite element analysis --- Mathematics --- Engineering. --- Partial differential equations. --- Computational intelligence. --- Quality control. --- Reliability. --- Industrial safety. --- Electronics. --- Microelectronics. --- Optical materials. --- Electronic materials. --- Quality Control, Reliability, Safety and Risk. --- Computational Intelligence. --- Electronics and Microelectronics, Instrumentation. --- Optical and Electronic Materials. --- Partial Differential Equations. --- Electronic materials --- Optics --- Materials --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Electrical engineering --- Physical sciences --- Industrial accidents --- Industries --- Job safety --- Occupational hazards, Prevention of --- Occupational health and safety --- Occupational safety and health --- Prevention of industrial accidents --- Prevention of occupational hazards --- Safety, Industrial --- Safety engineering --- Safety measures --- Safety of workers --- Accidents --- System safety --- Dependability --- Trustworthiness --- Conduct of life --- Factory management --- Industrial engineering --- Sampling (Statistics) --- Standardization --- Quality assurance --- Quality of products --- Intelligence, Computational --- Artificial intelligence --- Partial differential equations --- Construction --- Industrial arts --- Technology --- Prevention --- Soft computing --- Mathematical analysis --- Maintainability (Engineering) --- Probabilities --- Systems engineering --- Plant performance --- Safety factor in engineering --- Structural failures --- Numerical analysis --- Isogeometric analysis --- System safety. --- Differential equations, partial. --- Safety, System --- Safety of systems --- Systems safety --- Industrial safety

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This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards.

Technology: general issues --- History of engineering & technology --- 3D-IC (three-dimensional integrated circuit) --- electromagnetic interference --- near field measurement --- SAC305 --- BGA --- low temperature --- fracture failure --- factorial design of experiment --- genetic algorithm optimization --- return loss --- multiple-input multiple-output (MIMO) --- single event effects --- linear energy transfer --- Monte Carlo simulation --- radiation hardness --- pressureless sintered micron silver joints --- deep space environment --- extreme thermal shocks --- reconstruction --- simulation --- elastic mechanical properties --- state of health --- remaining useful life --- electrochemistry based electrical model --- semi-empirical capacity fading model --- useful life distribution --- quality and reliability assurance --- single event effect --- microdosimetry --- lineal energy --- deconvolution --- gamma process --- lifetime --- measurement system analysis --- reliability estimation --- GaN --- operational amplifier --- proton therapy --- prompt gamma imaging --- 3D X-ray --- bias temperature-humidity reliability test --- conductive anodic filament (CAF) --- de-penalization --- finite element analysis --- n/a

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This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards.

3D-IC (three-dimensional integrated circuit) --- electromagnetic interference --- near field measurement --- SAC305 --- BGA --- low temperature --- fracture failure --- factorial design of experiment --- genetic algorithm optimization --- return loss --- multiple-input multiple-output (MIMO) --- single event effects --- linear energy transfer --- Monte Carlo simulation --- radiation hardness --- pressureless sintered micron silver joints --- deep space environment --- extreme thermal shocks --- reconstruction --- simulation --- elastic mechanical properties --- state of health --- remaining useful life --- electrochemistry based electrical model --- semi-empirical capacity fading model --- useful life distribution --- quality and reliability assurance --- single event effect --- microdosimetry --- lineal energy --- deconvolution --- gamma process --- lifetime --- measurement system analysis --- reliability estimation --- GaN --- operational amplifier --- proton therapy --- prompt gamma imaging --- 3D X-ray --- bias temperature-humidity reliability test --- conductive anodic filament (CAF) --- de-penalization --- finite element analysis --- n/a

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Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.  Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level. .

Engineering & Applied Sciences --- Mechanical Engineering --- Chemical & Materials Engineering --- Materials Science --- Technology - General --- Industrial & Management Engineering --- Integrated circuits --- Electrodiffusion --- Reliability. --- Simulation methods. --- Electromigration --- Electrotransport --- Engineering. --- Atoms. --- Physics. --- Electronic circuits. --- Quality control. --- Industrial safety. --- Quality Control, Reliability, Safety and Risk. --- Electronic Circuits and Devices. --- Atomic, Molecular, Optical and Plasma Physics. --- Industrial accidents --- Industries --- Job safety --- Occupational hazards, Prevention of --- Occupational health and safety --- Occupational safety and health --- Prevention of industrial accidents --- Prevention of occupational hazards --- Safety, Industrial --- Safety engineering --- Safety measures --- Safety of workers --- Accidents --- System safety --- Dependability --- Trustworthiness --- Conduct of life --- Factory management --- Industrial engineering --- Reliability (Engineering) --- Sampling (Statistics) --- Standardization --- Quality assurance --- Quality of products --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics --- Natural philosophy --- Philosophy, Natural --- Physical sciences --- Dynamics --- Chemistry, Physical and theoretical --- Matter --- Stereochemistry --- Construction --- Industrial arts --- Technology --- Prevention --- Constitution --- Diffusion --- Physical metallurgy --- Transport theory --- System safety. --- Safety, System --- Safety of systems --- Systems safety --- Industrial safety --- Systems engineering --- Electrodiffusion.

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Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.  Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level. .

Plasma physics --- Matter physics --- Electronics --- Applied physical engineering --- Production management --- molecuulfysica --- plasmafysica --- elektronica --- kwaliteitscontrole --- ingenieurswetenschappen --- atoomfysica --- Integrated circuits --- Electrodiffusion --- Reliability. --- Simulation methods.