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Applications of finite element methods for reliability studies on ULSI interconnections
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ISBN: 0857293095 0857293109 Year: 2011 Publisher: London : Springer,

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Abstract

Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs has become widespread and continues to lead to a much better understanding of reliability physics. To help readers cope with the increasing sophistication of FEMs’ applications to interconnect reliability, Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections will: introduce the principle of FEMs; review numerical modeling of ULSI interconnect reliability; describe the physical mechanism of ULSI interconnect reliability encountered in the electronics industry; and discuss in detail the use of FEMs to understand and improve ULSI interconnect reliability from both the physical and practical perspective, incorporating the Monte Carlo method. A full-scale review of the numerical modeling methodology used in the study of interconnect reliability highlights useful and noteworthy techniques that have been developed recently. Many illustrations are used throughout the book to improve the reader’s understanding of the methodology and its verification. Actual experimental results and micrographs on ULSI interconnects are also included. Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections is a good reference for researchers who are working on interconnect reliability modeling, as well as for those who want to know more about FEMs for reliability applications. It gives readers a thorough understanding of the applications of FEM to reliability modeling and an appreciation of the strengths and weaknesses of various numerical models for interconnect reliability.

Keywords

Metal-cutting. --- Integrated circuits --- Finite element method --- Reliability (Engineering) --- Mechanical Engineering --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Chemical & Materials Engineering --- Electrical Engineering --- Technology - General --- Industrial & Management Engineering --- Materials Science --- Ultra large scale integration --- Finite element method. --- Engineering mathematics. --- Engineering --- Engineering analysis --- Reliability of equipment --- Systems reliability --- FEA (Numerical analysis) --- FEM (Numerical analysis) --- Finite element analysis --- Mathematics --- Engineering. --- Partial differential equations. --- Computational intelligence. --- Quality control. --- Reliability. --- Industrial safety. --- Electronics. --- Microelectronics. --- Optical materials. --- Electronic materials. --- Quality Control, Reliability, Safety and Risk. --- Computational Intelligence. --- Electronics and Microelectronics, Instrumentation. --- Optical and Electronic Materials. --- Partial Differential Equations. --- Electronic materials --- Optics --- Materials --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Electrical engineering --- Physical sciences --- Industrial accidents --- Industries --- Job safety --- Occupational hazards, Prevention of --- Occupational health and safety --- Occupational safety and health --- Prevention of industrial accidents --- Prevention of occupational hazards --- Safety, Industrial --- Safety engineering --- Safety measures --- Safety of workers --- Accidents --- System safety --- Dependability --- Trustworthiness --- Conduct of life --- Factory management --- Industrial engineering --- Sampling (Statistics) --- Standardization --- Quality assurance --- Quality of products --- Intelligence, Computational --- Artificial intelligence --- Partial differential equations --- Construction --- Industrial arts --- Technology --- Prevention --- Soft computing --- Mathematical analysis --- Maintainability (Engineering) --- Probabilities --- Systems engineering --- Plant performance --- Safety factor in engineering --- Structural failures --- Numerical analysis --- Isogeometric analysis --- System safety. --- Differential equations, partial. --- Safety, System --- Safety of systems --- Systems safety --- Industrial safety


Book
Reliability Analysis of Electrotechnical Devices
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ISBN: 3036546537 3036546545 Year: 2022 Publisher: MDPI - Multidisciplinary Digital Publishing Institute

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Book
Reliability Analysis of Electrotechnical Devices
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Year: 2022 Publisher: Basel MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards.


Book
Reliability Analysis of Electrotechnical Devices
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Year: 2022 Publisher: Basel MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards.


Book
Reliability Analysis of Electrotechnical Devices
Author:
Year: 2022 Publisher: Basel MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

This is a book on the practical approaches of reliability to electrotechnical devices and systems. It includes the electromagnetic effect, radiation effect, environmental effect, and the impact of the manufacturing process on electronic materials, devices, and boards.

Keywords

Technology: general issues --- History of engineering & technology --- 3D-IC (three-dimensional integrated circuit) --- electromagnetic interference --- near field measurement --- SAC305 --- BGA --- low temperature --- fracture failure --- factorial design of experiment --- genetic algorithm optimization --- return loss --- multiple-input multiple-output (MIMO) --- single event effects --- linear energy transfer --- Monte Carlo simulation --- radiation hardness --- pressureless sintered micron silver joints --- deep space environment --- extreme thermal shocks --- reconstruction --- simulation --- elastic mechanical properties --- state of health --- remaining useful life --- electrochemistry based electrical model --- semi-empirical capacity fading model --- useful life distribution --- quality and reliability assurance --- single event effect --- microdosimetry --- lineal energy --- deconvolution --- gamma process --- lifetime --- measurement system analysis --- reliability estimation --- GaN --- operational amplifier --- proton therapy --- prompt gamma imaging --- 3D X-ray --- bias temperature-humidity reliability test --- conductive anodic filament (CAF) --- de-penalization --- finite element analysis --- 3D-IC (three-dimensional integrated circuit) --- electromagnetic interference --- near field measurement --- SAC305 --- BGA --- low temperature --- fracture failure --- factorial design of experiment --- genetic algorithm optimization --- return loss --- multiple-input multiple-output (MIMO) --- single event effects --- linear energy transfer --- Monte Carlo simulation --- radiation hardness --- pressureless sintered micron silver joints --- deep space environment --- extreme thermal shocks --- reconstruction --- simulation --- elastic mechanical properties --- state of health --- remaining useful life --- electrochemistry based electrical model --- semi-empirical capacity fading model --- useful life distribution --- quality and reliability assurance --- single event effect --- microdosimetry --- lineal energy --- deconvolution --- gamma process --- lifetime --- measurement system analysis --- reliability estimation --- GaN --- operational amplifier --- proton therapy --- prompt gamma imaging --- 3D X-ray --- bias temperature-humidity reliability test --- conductive anodic filament (CAF) --- de-penalization --- finite element analysis


Book
Electromigration modeling at circuit layout level
Authors: ---
ISBN: 9814451207 9814451215 Year: 2013 Publisher: Singapore ; New York : Springer,

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Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.  Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level. .

Keywords

Engineering & Applied Sciences --- Mechanical Engineering --- Chemical & Materials Engineering --- Materials Science --- Technology - General --- Industrial & Management Engineering --- Integrated circuits --- Electrodiffusion --- Reliability. --- Simulation methods. --- Electromigration --- Electrotransport --- Engineering. --- Atoms. --- Physics. --- Electronic circuits. --- Quality control. --- Industrial safety. --- Quality Control, Reliability, Safety and Risk. --- Electronic Circuits and Devices. --- Atomic, Molecular, Optical and Plasma Physics. --- Industrial accidents --- Industries --- Job safety --- Occupational hazards, Prevention of --- Occupational health and safety --- Occupational safety and health --- Prevention of industrial accidents --- Prevention of occupational hazards --- Safety, Industrial --- Safety engineering --- Safety measures --- Safety of workers --- Accidents --- System safety --- Dependability --- Trustworthiness --- Conduct of life --- Factory management --- Industrial engineering --- Reliability (Engineering) --- Sampling (Statistics) --- Standardization --- Quality assurance --- Quality of products --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics --- Natural philosophy --- Philosophy, Natural --- Physical sciences --- Dynamics --- Chemistry, Physical and theoretical --- Matter --- Stereochemistry --- Construction --- Industrial arts --- Technology --- Prevention --- Constitution --- Diffusion --- Physical metallurgy --- Transport theory --- System safety. --- Safety, System --- Safety of systems --- Systems safety --- Industrial safety --- Systems engineering --- Electrodiffusion.


Book
Reliability and failure analysis of high-power led packaging
Authors: ---
ISBN: 012822407X 9780128224083 0128224088 9780128224076 Year: 2022 Publisher: Cambridge, MA : Woodhead Publishing Limited,


Digital
Electromigration Modeling at Circuit Layout Level
Authors: ---
ISBN: 9789814451215 Year: 2013 Publisher: Singapore Springer Singapore, Imprint: Springer

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Abstract

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.  Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level. .


Book
Simulated Annealing
Authors: ---
ISBN: 9535157469 9537619079 Year: 2008 Publisher: IntechOpen

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This book provides the readers with the knowledge of Simulated Annealing and its vast applications in the various branches of engineering. We encourage readers to explore the application of Simulated Annealing in their work for the task of optimization.


Book
Theory and Practice of Quality and Reliability Engineering in Asia Industry
Authors: ---
ISBN: 9811032904 9811032882 Year: 2017 Publisher: Singapore : Springer Singapore : Imprint: Springer,

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This book discusses the application of quality and reliability engineering in Asian industries, and offers information for multinational companies (MNC) looking to transfer some of their operation and manufacturing capabilities to Asia and at the same time maintain high levels of reliability and quality. It is also provides small and medium enterprises (SME) in Asia with insights into producing high-quality and reliable products. It mainly comprises peer-reviewed papers that were presented at the Asian Network for Quality (ANQ) Congress 2014 held in Singapore (August, 2014), which provides a platform for companies, especially those within Asia where rapid changes and growth in manufacturing are taking place, to present their quality and reliability practices. The book presents practical demonstrations of how quality and reliability methodologies can be modified for the unique Asian market, and as such is a valuable resource for students, academics, professionals and practitioners in the field of quality and reliability.

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