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Book
Scalable Multi-core Architectures : Design Methodologies and Tools
Authors: ---
ISBN: 144196777X 9786613350954 1283350955 1441967788 1489993150 Year: 2012 Publisher: New York, NY : Springer New York : Imprint: Springer,

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As Moore’s law continues to unfold, two important trends have recently emerged. First, the growth of chip capacity is translated into a corresponding increase of number of cores. Second, the parallalization of the computation and 3D integration technologies lead to distributed memory architectures. This book provides a current snapshot of industrial and academic research, conducted as part of the European FP7 MOSART project, addressing urgent challenges in many-core architectures and application mapping.  It addresses the architectural design of many core chips, memory and data management, power management, design and programming methodologies. It also describes how new techniques have been applied in various industrial case studies. Describes trends towards distributed memory architectures and distributed power management; Integrates Network on Chip with distributed, shared memory architectures; Demonstrates novel design methodologies and frameworks for multi-core design space exploration; Shows how midlleware services (dynamic data management) can be integrated into and support by the platform.    .

Fine- and Coarse-Grain Reconfigurable Computing
Authors: ---
ISBN: 1402065043 9400798148 9786611339340 1281339342 1402065051 Year: 2007 Publisher: Dordrecht : Springer Netherlands : Imprint: Springer,

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Fine- and Coarse-Grain Reconfigurable Computing gives the basic concepts and building blocks for the design of Fine- (or FPGA) and Coarse-Grain Reconfigurable Architectures. Recently-developed integrated architecture design and software-supported design flow of FPGA and coarse-grain reconfigurable architecture are also described.  Part I consists of two extensive surveys of FPGA and Coarse-Grain Reconfigurable Architectures: The FPGA technology is defined, which includes architecture, logic block structure, interconnect, and configuration methods and existing fine-grain reconfigurable architectures emerged from both academia and industry. Additionally, the implementation techniques and CAD tools developed to facilitate the implementation of a system in reconfigurable hardware by the industry and academia are provided. In addition the features, the advantages and limitations of the coarse-grain reconfigurable systems, the specific issues that should be addressed during the design phase, as well as representative existing coarse-grain reconfigurable systems are explained. In Part II, case studies, innovative research results about reconfigurable architectures and design frameworks from three projects AMDREL, MOLEN and ADRES&DRESC, and, a new classification according to microcoded architectural criteria are described. Fine- and Coarse-Grain Reconfigurable Computing is an essential reference for researchers and professionals and can be used as a textbook by undergraduate, graduate students and professors. Foreword by Yale Patt, Jim Smith and Mateo Valero.


Book
Harnessing Performance Variability in Embedded and High-performance Many/Multi-core Platforms : A Cross-layer Approach
Authors: ---
ISBN: 3319919628 331991961X Year: 2019 Publisher: Cham : Springer International Publishing : Imprint: Springer,

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This book describes the state-of-the art of industrial and academic research in the architectural design of heterogeneous, multi/many-core processors. The authors describe methods and tools to enable next-generation embedded and high-performance heterogeneous processors to confront cost-effectively the inevitable variations by providing Dependable-Performance: correct functionality and timing guarantees throughout the expected lifetime of a platform under thermal, power, and energy constraints. Various aspects of the reliability problem are discussed, at both the circuit and architecture level, the intelligent selection of knobs and monitors in multicore platforms, and systematic design methodologies. The authors demonstrate how new techniques have been applied in real case studies from different applications domain and report on results and conclusions of those experiments. Enables readers to develop performance-dependable heterogeneous multi/many-core architectures Describes system software designs that support high performance dependability requirements Discusses and analyzes low level methodologies to tradeoff conflicting metrics, i.e. power, performance, reliability and thermal management Includes new application design guidelines to improve performance dependability.


Digital
Fine- and Coarse-Grain Reconfigurable Computing
Authors: ---
ISBN: 9781402065057 Year: 2008 Publisher: Dordrecht Springer


Digital
Scalable Multi-core Architectures : Design Methodologies and Tools
Authors: ---
ISBN: 9781441967787 Year: 2012 Publisher: New York, NY Springer New York

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Digital
Harnessing Performance Variability in Embedded and High-performance Many/Multi-core Platforms : A Cross-layer Approach
Authors: ---
ISBN: 9783319919621 Year: 2019 Publisher: Cham Springer International Publishing

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This book describes the state-of-the art of industrial and academic research in the architectural design of heterogeneous, multi/many-core processors. The authors describe methods and tools to enable next-generation embedded and high-performance heterogeneous processors to confront cost-effectively the inevitable variations by providing Dependable-Performance: correct functionality and timing guarantees throughout the expected lifetime of a platform under thermal, power, and energy constraints. Various aspects of the reliability problem are discussed, at both the circuit and architecture level, the intelligent selection of knobs and monitors in multicore platforms, and systematic design methodologies. The authors demonstrate how new techniques have been applied in real case studies from different applications domain and report on results and conclusions of those experiments. Enables readers to develop performance-dependable heterogeneous multi/many-core architectures Describes system software designs that support high performance dependability requirements Discusses and analyzes low level methodologies to tradeoff conflicting metrics, i.e. power, performance, reliability and thermal management Includes new application design guidelines to improve performance dependability.


Book
Trusted Computing for Embedded Systems
Authors: --- ---
ISBN: 9783319094205 331909419X 9783319094199 3319094203 Year: 2015 Publisher: Cham : Springer International Publishing : Imprint: Springer,

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This book describes the state-of-the-art in trusted computing for embedded systems. It shows how a variety of security and trusted computing problems are addressed currently and what solutions are expected to emerge in the coming years. The discussion focuses on attacks aimed at hardware and software for embedded systems, and the authors describe specific solutions to create security features. Case studies are used to present new techniques designed as industrial security solutions. Coverage includes development of tamper resistant hardware and firmware mechanisms for lightweight embedded devices, as well as those serving as security anchors for embedded platforms required by applications such as smart power grids, smart networked and home appliances, environmental and infrastructure sensor networks, etc. ·         Enables readers to address a variety of security threats to embedded hardware and software; ·         Describes design of secure wireless sensor networks, to address secure authentication of trusted portable devices for embedded systems; ·         Presents secure solutions for the design of smart-grid applications and their deployment in large-scale networked and systems.  .


Book
Three Dimensional System Integration : IC Stacking Process and Design
Authors: --- ---
ISBN: 1441909613 9786613083425 1441909621 1283083426 1489981829 Year: 2011 Publisher: New York, NY : Springer US : Imprint: Springer,

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Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides an overview of the entire trajectory from basic process technology issues to the design at the system level of three dimensionally integrated nano-electronic systems. Physical design and design at the architecture and system level are emphasized in this book, since the technology has matured to the point that these issues have become very important. This book is intended for an audience with a basic grasp of electrical engineering concepts including some familiarity with fabrication of semiconductor devices, Very Large Scale Integration (VLSI) and computer architecture. •Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; •Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems; •First book to offer not only a high-level view of the entire field of 3D integration, but also an understanding of the interactions between the various phases of design and manufacturing.


Book
Hardware Accelerators in Data Centers
Authors: --- ---
ISBN: 3319927922 3319927914 Year: 2019 Publisher: Cham : Springer International Publishing : Imprint: Springer,

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This book provides readers with an overview of the architectures, programming frameworks, and hardware accelerators for typical cloud computing applications in data centers. The authors present the most recent and promising solutions, using hardware accelerators to provide high throughput, reduced latency and higher energy efficiency compared to current servers based on commodity processors. Readers will benefit from state-of-the-art information regarding application requirements in contemporary data centers, computational complexity of typical tasks in cloud computing, and a programming framework for the efficient utilization of the hardware accelerators. Provides a single-source reference to the state of the art for hardware accelerators in data centers; Describes integrated frameworks for the seamless deployment of hardware accelerators; Includes several use-case scenarios of hardware accelerators for typical cloud computing applications, such as machine learning, graph computation, and databases.

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