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This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

Microelectronic packaging. --- Wire bonding (Electronic packaging). --- Microelectronic packaging --- Wire bonding (Electronic packaging) --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Electronic packaging. --- Packaging (Electronics) --- Packaging (Microelectronics) --- Materials science. --- Engineering. --- Quality control. --- Reliability. --- Industrial safety. --- Electronics. --- Microelectronics. --- Optical materials. --- Electronic materials. --- Nanotechnology. --- Materials Science. --- Optical and Electronic Materials. --- Engineering, general. --- Quality Control, Reliability, Safety and Risk. --- Electronics and Microelectronics, Instrumentation. --- Electronic apparatus and appliances --- Electronics --- Electronic packaging --- Microelectronics --- System safety. --- Electrical engineering --- Physical sciences --- Safety, System --- Safety of systems --- Systems safety --- Accidents --- Industrial safety --- Systems engineering --- Construction --- Industrial arts --- Technology --- Optics --- Materials --- Molecular technology --- Nanoscale technology --- High technology --- Prevention --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Industrial accidents --- Industries --- Job safety --- Occupational hazards, Prevention of --- Occupational health and safety --- Occupational safety and health --- Prevention of industrial accidents --- Prevention of occupational hazards --- Safety, Industrial --- Safety engineering --- Safety measures --- Safety of workers --- System safety --- Dependability --- Trustworthiness --- Conduct of life --- Factory management --- Industrial engineering --- Reliability (Engineering) --- Sampling (Statistics) --- Standardization --- Quality assurance --- Quality of products --- Electronic materials