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GLSVLSI 2022 is a collaborative effort of a 10+ member organizing committee with 100+ technical program committee members. The Technical Program Committee Chairs, Himanshu Thapliyal and Ronald F. DeMara, have put together the 2022 installment of the traditionally strong ACM/IEEE GLSVLSI program. The program is structured into seven technical tracks along with the International Conference on Microelectronic Systems Education (MSE) for GLSVLSI attendees (as the eighth track) in 2022.

Integrated circuits --- Machine learning. --- Computer security --- Computer-aided design --- Electronic circuit design --- Very large scale integration

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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Three-dimensional integrated circuits --- Design and construction.