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Encapsulation technologies for electronic applications
Authors: ---
ISBN: 9780815515760 0815515766 9780080947563 0080947565 0815519702 1282381024 9786612381027 Year: 2009 Publisher: Burlington, MA William Andrew

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Abstract

Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and th


Book
Risk-Based Engineering : An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants
Authors: ---
ISBN: 9811300909 9811300887 9789811300905 Year: 2018 Publisher: Singapore : Springer Singapore : Imprint: Springer,

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The book comprehensively covers the various aspects of risk modeling and analysis in technological contexts. It pursues a systems approach to modeling risk and reliability concerns in engineering, and covers the key concepts of risk analysis and mathematical tools used to assess and account for risk in engineering problems. The relevance of incorporating risk-based structures in design and operations is also stressed, with special emphasis on the human factor and behavioral risks. The book uses the nuclear plant, an extremely complex and high-precision engineering environment, as an example to develop the concepts discussed. The core mechanical, electronic and physical aspects of such a complex system offer an excellent platform for analyzing and creating risk-based models. The book also provides real-time case studies in a separate section to demonstrate the use of this approach. There are many limitations when it comes to applications of risk-based approaches to engineering problems. The book is structured and written in a way that addresses these key gap areas to help optimize the overall methodology. This book serves as a textbook for graduate and advanced undergraduate courses on risk and reliability in engineering. It can also be used outside the classroom for professional development courses aimed at practicing engineers or as an introduction to risk-based engineering for professionals, researchers, and students interested in the field.

Keywords

Engineering. --- System theory. --- Mathematical models. --- Manufacturing industries. --- Machines. --- Tools. --- Quality control. --- Reliability. --- Industrial safety. --- Nuclear engineering. --- Quality Control, Reliability, Safety and Risk. --- Mathematical Modeling and Industrial Mathematics. --- Complex Systems. --- Nuclear Engineering. --- Manufacturing, Machines, Tools. --- System safety. --- Manufactures. --- Nuclear Energy. --- Manufacturing, Machines, Tools, Processes. --- Manufactured goods --- Manufactured products --- Products --- Products, Manufactured --- Commercial products --- Manufacturing industries --- Safety, System --- Safety of systems --- Systems safety --- Accidents --- Industrial safety --- Systems engineering --- Prevention --- Risk management. --- Nuclear energy. --- Models, Mathematical --- Simulation methods --- Industrial accidents --- Industries --- Job safety --- Occupational hazards, Prevention of --- Occupational health and safety --- Occupational safety and health --- Prevention of industrial accidents --- Prevention of occupational hazards --- Safety, Industrial --- Safety engineering --- Safety measures --- Safety of workers --- System safety --- Dependability --- Trustworthiness --- Conduct of life --- Factory management --- Industrial engineering --- Reliability (Engineering) --- Sampling (Statistics) --- Standardization --- Quality assurance --- Quality of products --- Atomic energy --- Atomic power --- Energy, Atomic --- Energy, Nuclear --- Nuclear power --- Power, Atomic --- Power, Nuclear --- Force and energy --- Nuclear physics --- Power resources --- Nuclear engineering --- Nuclear facilities --- Nuclear power plants --- Systems, Theory of --- Systems science --- Science --- Philosophy


Multi
Risk-Based Engineering : An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants
Authors: ---
ISBN: 9789811300905 9811300887 9811300909 Year: 2018 Publisher: Singapore Springer Singapore, Imprint: Springer

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Abstract

The book comprehensively covers the various aspects of risk modeling and analysis in technological contexts. It pursues a systems approach to modeling risk and reliability concerns in engineering, and covers the key concepts of risk analysis and mathematical tools used to assess and account for risk in engineering problems. The relevance of incorporating risk-based structures in design and operations is also stressed, with special emphasis on the human factor and behavioral risks. The book uses the nuclear plant, an extremely complex and high-precision engineering environment, as an example to develop the concepts discussed. The core mechanical, electronic and physical aspects of such a complex system offer an excellent platform for analyzing and creating risk-based models. The book also provides real-time case studies in a separate section to demonstrate the use of this approach. There are many limitations when it comes to applications of risk-based approaches to engineering problems. The book is structured and written in a way that addresses these key gap areas to help optimize the overall methodology. This book serves as a textbook for graduate and advanced undergraduate courses on risk and reliability in engineering. It can also be used outside the classroom for professional development courses aimed at practicing engineers or as an introduction to risk-based engineering for professionals, researchers, and students interested in the field.

Influence of temperature on microelectronics and system reliability
Authors: --- ---
ISBN: 0849394503 9780849394508 Year: 1997 Publisher: Boca Raton: CRC,


Book
Copper wire bonding
Authors: --- --- ---
ISBN: 1461457602 1461457610 Year: 2014 Publisher: New York : Springer,

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This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  However, copper wire bonding has several process and reliability concerns due to its material properties.  Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation.  In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry  Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.


Book
Optimum Cooling of Data Centers : Application of Risk Assessment and Mitigation Techniques
Authors: --- --- ---
ISBN: 1461456010 1461456029 Year: 2014 Publisher: New York, NY : Springer New York : Imprint: Springer,

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This book provides data center designers and operators with methods by which to assess and mitigate the risks associated with utilization of optimum cooling solutions. The goal is to provide readers with sufficient knowledge to implement measures such as free air cooling or direct liquid immersion cooling properly, or combination of existing and emerging cooling technologies in data centers, base stations, and server farms. This book also: Discusses various telecommunication infrastructures, with an emphasis on data centers and base stations Covers the most commonly known energy and power management techniques, as well as emerging cooling solutions for data centers Describes the risks to the electronic equipment fitted in these installations and the methods of risk mitigation Devotes  a particular focus to an up-to-date review of the emerging cooling methods (such as free air cooling and direct liquid immersion cooling) and tools and best practices for designers, technology developers, installation operators, and owners Informs installation designers and manufacturers of the benefits and limitations of the most common existing and emerging cooling methods Optimum Cooling of Data Centers: Application of Risk  Assessment and Mitigation Techniques is an ideal book for researchers and engineers interested in design,  manufacturing, and optimum operation  of cooling solutions for telecom and other mission-critical infrastructures.


Digital
Optimum Cooling of Data Centers : Application of Risk Assessment and Mitigation Techniques
Authors: --- --- ---
ISBN: 9781461456025 Year: 2014 Publisher: New York, NY Springer

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Abstract

This book provides data center designers and operators with methods by which to assess and mitigate the risks associated with utilization of optimum cooling solutions. The goal is to provide readers with sufficient knowledge to implement measures such as free air cooling or direct liquid immersion cooling properly, or combination of existing and emerging cooling technologies in data centers, base stations, and server farms. This book also: Discusses various telecommunication infrastructures, with an emphasis on data centers and base stations Covers the most commonly known energy and power management techniques, as well as emerging cooling solutions for data centers Describes the risks to the electronic equipment fitted in these installations and the methods of risk mitigation Devotes  a particular focus to an up-to-date review of the emerging cooling methods (such as free air cooling and direct liquid immersion cooling) and tools and best practices for designers, technology developers, installation operators, and owners Informs installation designers and manufacturers of the benefits and limitations of the most common existing and emerging cooling methods Optimum Cooling of Data Centers: Application of Risk  Assessment and Mitigation Techniques is an ideal book for researchers and engineers interested in design,  manufacturing, and optimum operation  of cooling solutions for telecom and other mission-critical infrastructures.


Digital
Copper Wire Bonding
Authors: --- --- ---
ISBN: 9781461457619 Year: 2014 Publisher: New York, NY Springer

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Abstract

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  However, copper wire bonding has several process and reliability concerns due to its material properties.  Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation.  In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry  Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.

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