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This dissertation by Hama Nadhom explores a novel method for the area-selective chemical vapor deposition (CVD) of metallic films using plasma electrons as reducing agents. The research focuses on depositing metals such as iron, cobalt, and nickel onto substrates with varying electrical resistivities, achieving uniform deposition on complex surfaces at relatively low temperatures. The work demonstrates the potential for this method to simplify the fabrication process of nanoscale electronics and other applications by selectively depositing metallic films only on desired areas. The study includes both phenomenological and quantitative analyses using a modified quartz crystal microbalance system to understand the underlying chemical and physical processes.

Chemical vapor deposition. --- Thin films.