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Nanopackaging : nanotechnologies and electronics packaging
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ISBN: 9780387473260 0387473254 9780387473253 9786611950026 1281950025 0387473262 Year: 2008 Publisher: New York ; London : Springer,

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Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. Nanopackaging: Nanotechnologies and Electronics Packaging is an important reference for Industrial and academic researchers as well as practicing engineers seeking information about the latest techniques, including: The importance of computer modeling in nanopackaging and offers suggestions for implementation Carbon Nanotubes and Nanoparticles, and their role in packaging, including basic properties and fabrication, and applications in solder, thermal management, and EMI control A comprehensive overview of nanoscale electronics and systems packaging Nanopackaging: Nanotechnologies and Electronics Packaging is an ideal reference for researchers, practicing engineers as well as graduate students who are either entering the field of for the first time, or those already conducting research and want to expand their knowledge in the field of nanopackaging.


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Nanopackaging : Nanotechnologies and Electronics Packaging
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ISBN: 3319903624 3319903616 Year: 2018 Publisher: Cham : Springer International Publishing : Imprint: Springer,

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This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. Now in a second edition, Nanopackaging is an important reference for industrial and academic researchers, as well as practicing engineers seeking information about latest techniques. 12 new chapters address carbon nanotubes and nanowires, fabrication and properties of graphene, graphene for thermal cooling of microelectronics and for electrical interconnections, packaging of post-CMOS nanoelectronics, environmental and health effects of nanopackaging technologies, and more. This book is an ideal reference for researchers, practicing engineers, and graduate students who are either entering the field for the first time, or are already conducting research and want to expand their knowledge in the field of nanopackaging.

Electronics packaging forum : Vol 2
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ISBN: 0442004761 Year: 1991 Publisher: New York (N.Y.) : Van Nostrand Reinhold,

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Electronics packaging forum : Vol 1
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ISBN: 0442001789 Year: 1990 Publisher: New York (N.Y.) : Van Nostrand Reinhold,

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Victim aftershock : how to get results from the criminal justice system
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ISBN: 0531099547 Year: 1983 Publisher: New York (N.Y.) : Watts,

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Electronics packaging forum
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Year: 1990 Publisher: New York Van Nostrand Reinhold

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Nanopackaging : Nanotechnologies and Electronics Packaging
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ISBN: 9780387473260 Year: 2009 Publisher: Boston, MA Springer-Verlag US

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Nanopackaging : Nanotechnologies and Electronics Packaging
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ISBN: 9783319903620 Year: 2018 Publisher: Cham Springer International Publishing

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This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. Now in a second edition, Nanopackaging is an important reference for industrial and academic researchers, as well as practicing engineers seeking information about latest techniques. 12 new chapters address carbon nanotubes and nanowires, fabrication and properties of graphene, graphene for thermal cooling of microelectronics and for electrical interconnections, packaging of post-CMOS nanoelectronics, environmental and health effects of nanopackaging technologies, and more. This book is an ideal reference for researchers, practicing engineers, and graduate students who are either entering the field for the first time, or are already conducting research and want to expand their knowledge in the field of nanopackaging.


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Nyctomys sumichrasti (de Saussure, 1860)
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Year: 2004 Publisher: [place of publication not identified] The American Society of Mammalogists

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Reliability of Microtechnology : Interconnects, Devices and Systems
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ISBN: 9781441957603 Year: 2011 Publisher: New York, NY Springer New York

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