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Today's commercial, medical and military electronics are becoming smaller and smaller. At the same time, these devices are packed with more functions and demand more power. This power requirement is currently met almost exclusively by battery power. A fuel cell is like a battery converting chemical energy directly to electricity. The convergence of fuel cell technology and microelectronics is enabling the new design and manufacturing of fuel cells. Fuel Cell Electronics Packaging presents the latest developments in the technology convergence of microelectronics and fuel cells. Using the well established manufacturing methods used in microelectronics packaging, fuel cells can be further fabricated in smaller sizes with higher energy density, at a faster pace and lower cost. This book uniquely addresses this issue. Fuel Cell Electronics Packaging serves as a practical reference guide for engineers, researchers, and manufacturers of microelectronic and fuel cell products who are interested in topics such as: ceramic hybrid separators for micro fuel cells miniature fuel cells built with LTCC technology novel fuel cells fabricated using microelectronics technology fuel cell thermal management Written by a variety of professional and academic sources, Fuel Cell Electronics Packaging is a valuable resource for those interested in the latest advances in fuel cell technology.

Fuel cells. --- Electrical engineering. --- Direct energy conversion --- Electric batteries --- Electric power production from chemical action --- Electrochemistry --- Electric engineering --- Engineering --- Chemistry. --- Renewable energy sources. --- Electrochemistry. --- Renewable and Green Energy. --- Alternate energy sources --- Alternative energy sources --- Energy sources, Renewable --- Sustainable energy sources --- Power resources --- Renewable natural resources --- Agriculture and energy --- Physical sciences --- Renewable energy resources. --- Chemistry, Physical and theoretical

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Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Fluid mechanics --- Spectrometric and optical chemical analysis --- Electronics --- Electrical engineering --- Applied physical engineering --- telecommunicatie --- elektronica --- ingenieurswetenschappen --- elektrische circuits --- versterkers --- spectrometrie

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Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Electronics. --- Microelectronics. --- Microwaves. --- Optical engineering. --- Electronic circuits. --- Electronics and Microelectronics, Instrumentation. --- Microwaves, RF and Optical Engineering. --- Circuits and Systems.

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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices.

Microelectronic packaging. --- Microelectronic packaging --- Electrical & Computer Engineering --- Electrical Engineering --- Engineering & Applied Sciences --- Electronic packaging. --- Packaging (Electronics) --- Packaging (Microelectronics) --- Engineering. --- Microwaves. --- Optical engineering. --- Electronics. --- Microelectronics. --- Electronic circuits. --- Electronics and Microelectronics, Instrumentation. --- Microwaves, RF and Optical Engineering. --- Circuits and Systems. --- Electronic apparatus and appliances --- Electronics --- Electronic packaging --- Microelectronics --- Systems engineering. --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Hertzian waves --- Electric waves --- Electromagnetic waves --- Geomagnetic micropulsations --- Radio waves --- Shortwave radio --- Electrical engineering --- Physical sciences --- Design and construction --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Mechanical engineering --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Microtechnology --- Semiconductors --- Miniature electronic equipment

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Distills more than a decade’s worth of application experience on furnaces into a practical book for engineers; Addresses belt furnace influences on manufacturing, assembly and packaging, efficiency, curing, and more; Focuses on lithium ion batteries, direct bond copper technologies, and solar cells. This practical book is tailored for engineers working in the industry, and condenses more than a decade’s worth of application experience on furnaces. The various topics discussed include conveyor furnaces, belt furnaces, solar cells, brazing furnaces, thick film furnaces, and furnace air flow and reflow. There are chapters on the influence of belt furnace and firing on silicon solar cells, thin film CIGS solar cells, dye-sensitized solar cells, crystalline solar cells, and lithium ion batteries, as well as how the processes affect the efficiency of each. The authors also address the influence of belt furnace on various processes such as metallization, engine valve heat treatment, brazing, post mold curing, and glass-to-metal sealing. The last few chapters also address Direct Bond Copper (DBC) technologies, and the effect of profile and atmosphere on the reflow process.

Engineering. --- Thermodynamics. --- Heat engineering. --- Heat transfer. --- Mass transfer. --- Machinery. --- Power electronics. --- Engineering Thermodynamics, Heat and Mass Transfer. --- Machinery and Machine Elements. --- Power Electronics, Electrical Machines and Networks. --- Electric furnaces. --- Electric heating --- Furnaces --- Production of electric energy or. --- Construction --- Industrial arts --- Technology --- Electronics, Power --- Electric power --- Electronics --- Machinery --- Machines --- Manufactures --- Power (Mechanics) --- Mechanical engineering --- Motors --- Power transmission --- Mass transport (Physics) --- Thermodynamics --- Transport theory --- Heat transfer --- Thermal transfer --- Transmission of heat --- Energy transfer --- Heat --- Chemistry, Physical and theoretical --- Dynamics --- Mechanics --- Physics --- Heat-engines --- Quantum theory --- Curious devices