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Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions. This book also: Provides an in-depth overview of copper, metal and aluminum materials and discusses the advantages and disadvantages of each in thermal management Discusses numerical simulation methods and techniques used in analysis of electronic devices and materials Covers system and component integration of advanced packaging materials Advanced Thermal Management Materials is an ideal book for microelectronics and packaging engineers, scientists and researchers in academia and industry interested in thermal packaging in high performance systems.  .

Electronic apparatus and appliances -- Temperature control. --- Electronic packaging -- Materials. --- Heat sinks (Electronics). --- Microelectronic packaging. --- Microelectronic packaging --- Microelectronics --- Heat sinks (Electronics) --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Thermal properties --- Materials --- Cooling --- Thermal interface materials. --- Thermal conductivity. --- Engineering --- Engineering materials --- Industrial materials --- TIMs (Electronics) --- Energy. --- Energy efficiency. --- Thermodynamics. --- Heat engineering. --- Heat transfer. --- Mass transfer. --- Electronics. --- Microelectronics. --- Metals. --- Energy Efficiency (incl. Buildings). --- Electronics and Microelectronics, Instrumentation. --- Engineering Thermodynamics, Heat and Mass Transfer. --- Metallic Materials. --- Engineering design --- Manufacturing processes --- Electronics

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Proceedings of the International Conference on Pipelines and Trenchless Technology, held in Wuhan, China, October 19-22, 2012. Sponsored by Pipeline Division of ASCE; China-U.S. Joint Center for Trenchless Research and Development at the China University of Geosciences; Center for Underground Infrastructure Research and Education, University of Texas at Arlington; Buried Asset Management Institute.International; Soil & Rock Drilling and Protecting Engineering Research Center, China Ministry of Education; and Wuhan Deawon Trenchless Technology Co. Ltd. This collection contains 198 papers on all aspects of pipeline engineering and trenchless technology. Topics include: condition assessment; corrosion control and monitoring; gas/oil regulatory update; geographic information systems; hazard assessments; hydraulic modeling; integrated asset management; leak detection and monitoring; pipeline design.transmission, distribution, and in-plant; pipeline failures; pipeline inspection; pipeline installation; pipeline rehabilitation; pipeline risk management; research and development; risk assessment; tunnel boring machines for pipeline and tunnel construction; and trenchless technologies. These papers will be of interest to engineers working with all types of pipelines.

Pipelines --- Pipe leakage --- Pipeline hydraulics --- Pipeline management --- Infrastructure --- Trenchless technology --- Engineering education --- Risk management --- Pipelines --- Pipe leakage --- Pipeline hydraulics --- Pipeline management --- Infrastructure --- Trenchless technology --- Engineering education --- Risk management