Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects.  Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis, and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor,  and inductive-based communication system, and bandpass filtering. ·Introduces a robust model that captures accurately all the loss modes of a TSV,  coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region; ·Enables readers to use a model which is technology dependent and can be used for any TSV configuration; ·Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors; ·Equips readers for fast parasitic extraction of TSVs for 3D IC design.

Engineering. --- Circuits and Systems. --- Electronics and Microelectronics, Instrumentation. --- Processor Architectures. --- Computer science. --- Electronics. --- Systems engineering. --- Ingénierie --- Informatique --- Electronique --- Ingénierie des systèmes --- Embedded computer systems. --- Integrated circuits -- Design and construction. --- Three-dimensional integrated circuits. --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Three-dimensional integrated circuits --- Mathematical models. --- 3D ICs (Three-dimensional integrated circuits) --- Microprocessors. --- Microelectronics. --- Electronic circuits. --- Integrated circuits --- Informatics --- Science --- Electrical engineering --- Physical sciences --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Design and construction --- Minicomputers --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Electron-tube circuits --- Electric circuits --- Electron tubes

Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

Application specific integrated circuits --- Systems on a chip --- Design and construction