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This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.  It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks.  Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.

Circuits and systems. --- Electronics. --- Engineering. --- Three-dimensional integrated circuits -- Design. --- Three-dimensional integrated circuits --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Three-dimensional integrated circuits. --- Integrated circuits. --- Chips (Electronics) --- Circuits, Integrated --- Computer chips --- Microchips --- 3D ICs (Three-dimensional integrated circuits) --- Microprocessors. --- Microelectronics. --- Electronic circuits. --- Circuits and Systems. --- Processor Architectures. --- Electronics and Microelectronics, Instrumentation. --- Electronic circuits --- Microelectronics --- Integrated circuits --- Systems engineering. --- Computer science. --- Electrical engineering --- Physical sciences --- Informatics --- Science --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Design and construction --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Minicomputers --- Electron-tube circuits --- Electric circuits --- Electron tubes

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