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Integrated circuits --- Timing circuits

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Integrated circuits --- Superconductors. --- Design and construction. --- Superconducting materials --- Superconductive devices --- Cryoelectronics --- Electronics --- Solid state electronics --- Materials

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High efficiency, large scale, stationary computing systems - supercomputers and data centers - are becoming increasingly important due to the movement of data storage and processing onto remote cloud servers. This book is dedicated to a technology particularly appropriate for this application - superconductive electronics, in particular, rapid single flux quantum circuits. The primary purpose of this book is to introduce and systematize recent developments in superconductive electronics into a cohesive whole to support the further development of large scale computing systems. A brief background into the physics of superconductivity and the operation of common superconductive devices is provided, followed by an introduction into different superconductive logic families, including the logic gates, interconnect, and bias current distribution. Synchronization, fabrication, and electronic design automation methodologies are presented, reviewing both widely established concepts and techniques as well as recent approaches. Issues related to memory, synchronization, bias networks, and testability are described, and models, circuits, algorithms, and design methodologies are discussed and placed in context. The aim of this book is to provide insight and engineering intuition into the design of large scale digital superconductive circuits and systems. Reviews modern research in the field of superconductive digital electronics, including novel devices and approaches; Provides comprehensive background on pertinent topics; Describes prospective methodologies for large scale integration of superconductive circuits.

Electronics --- Electrical engineering --- elektronica --- elektrische circuits

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With vastly increased complexity and functionality in the ""nanometer era"" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing e

Integrated circuits --- Microelectronics. --- Design and construction. --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment

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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Three-dimensional integrated circuits --- Design and construction.