Listing 1 - 9 of 9 |
Sort by
|
Choose an application
Sociology of the family. Sociology of sexuality --- Political sociology --- Politics --- Law --- United States --- Gay rights --- Homophobia --- Same-sex marriage --- Gay marriage --- Homosexual marriage --- Lesbian marriage --- Same-sex unions --- Marriage --- Civil unions --- Law and legislation --- Political aspects --- United States of America --- Gay marriages --- Homosexuality --- Lesbian relationships --- Attitudes --- Legislation --- Book --- Conservatism
Choose an application
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices.
Microelectronic packaging. --- Microelectronic packaging --- Electrical & Computer Engineering --- Electrical Engineering --- Engineering & Applied Sciences --- Electronic packaging. --- Packaging (Electronics) --- Packaging (Microelectronics) --- Engineering. --- Microwaves. --- Optical engineering. --- Electronics. --- Microelectronics. --- Electronic circuits. --- Electronics and Microelectronics, Instrumentation. --- Microwaves, RF and Optical Engineering. --- Circuits and Systems. --- Electronic apparatus and appliances --- Electronics --- Electronic packaging --- Microelectronics --- Systems engineering. --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Hertzian waves --- Electric waves --- Electromagnetic waves --- Geomagnetic micropulsations --- Radio waves --- Shortwave radio --- Electrical engineering --- Physical sciences --- Design and construction --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Mechanical engineering --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Microtechnology --- Semiconductors --- Miniature electronic equipment
Choose an application
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices.
Fluid mechanics --- Optics. Quantum optics --- Spectrometric and optical chemical analysis --- Electronics --- Electrical engineering --- telecommunicatie --- elektronica --- micro-elektronica --- elektrische circuits --- spectrometrie --- optica
Choose an application
Sexual minorities --- Gay couples --- Lesbian couples --- Children of sexual minority parents --- Gender minorities --- GLBT people --- GLBTQ people --- Lesbigay people --- LBG people --- LGBT people --- LGBTQ people --- Non-heterosexual people --- Non-heterosexuals --- Sexual dissidents --- Minorities --- Sexual minority parents' children --- Sexual minority parents --- Family relationships --- Legal status, laws, etc. --- LGBTQ+ families. --- LGBTQ+ parents. --- Children of LGBTQ+ people.
Choose an application
Jason Cianciotto and Sean Cahill, experts on lesbian, gay, bisexual, and transgender public policy advocacy, combine an accessible review of social science research with analyses of school practices and local, state, and federal laws that affect LGBT students. In addition, portraits of LGBT youth and their experiences with discrimination at school bring human faces to the issues the authors discuss. This is an essential guide for teachers, school administrators, guidance counselors, and social workers interacting with students on a daily basis; school board members and officials determining school policy; nonprofit advocates and providers of social services to youth; and academic scholars, graduate students, and researchers training the next generation of school administrators and informing future policy and practice.
Lesbian students --- Gay students --- Bisexual students --- Transgender youth --- Sexual minorities --- Homosexuality and education --- Gender minorities --- GLBT people --- GLBTQ people --- Lesbigay people --- LBG people --- LGBT people --- LGBTQ people --- Non-heterosexual people --- Non-heterosexuals --- Sexual dissidents --- Minorities --- Youth --- Students --- Education --- Education. --- LGBTQ+ youth --- Sexual and Gender Minorities --- Bisexuals --- GLBT Persons --- GLBTQ Persons --- Gender Minorities --- Homosexuals --- LBG Persons --- LGBT Persons --- LGBTQ Persons --- Lesbians --- Lesbigay Persons --- Men Who Have Sex With Men --- Non-Heterosexual Persons --- Non-Heterosexuals --- Queers --- Sexual Dissidents --- Sexual Minorities --- Women Who Have Sex With Women --- Gays --- Bisexual --- Dissident, Sexual --- Dissidents, Sexual --- GLBT Person --- GLBTQ Person --- Gay --- Gender Minority --- Homosexual --- LBG Person --- LGBT Person --- LGBTQ Person --- Lesbian --- Lesbigay Person --- Minorities, Gender --- Minorities, Sexual --- Minority, Gender --- Minority, Sexual --- Non Heterosexual Persons --- Non Heterosexuals --- Non-Heterosexual --- Non-Heterosexual Person --- Person, GLBT --- Person, GLBTQ --- Person, LBG --- Person, LGBT --- Person, LGBTQ --- Person, Lesbigay --- Person, Non-Heterosexual --- Persons, GLBT --- Persons, GLBTQ --- Persons, LBG --- Persons, LGBT --- Persons, LGBTQ --- Persons, Lesbigay --- Queer --- Sexual Dissident --- Sexual Minority --- Bisexuality --- Homosexuality --- Homosexuality, Male --- Homosexuality, Female
Choose an application
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices.
Fluid mechanics --- Optics. Quantum optics --- Spectrometric and optical chemical analysis --- Electronics --- Electrical engineering --- telecommunicatie --- elektronica --- micro-elektronica --- elektrische circuits --- spectrometrie --- optica
Choose an application
Choose an application
Choose an application
Listing 1 - 9 of 9 |
Sort by
|