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Book
Superplasticity and superplastic forming 1995
Authors: ---
ISBN: 0873393007 Year: 1995 Publisher: Warrendale The minerals, metals and materials society

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Superplasticity and superplastic forming 1998
Authors: ---
ISBN: 0873393988 Year: 1998 Publisher: Warrendale The minerals, metals and materials society

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Book
Crystal plasticity finite element methods in materials science and engineering
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ISBN: 9783527324477 Year: 2010 Publisher: Weinheim : Wiley-VCH Verl.,

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Fundamentals of Lead-Free Solder Interconnect Technology : From Microstructures to Reliability
Authors: --- --- ---
ISBN: 9781461492665 1461492653 9781461492658 1461492661 Year: 2015 Publisher: New York, NY : Springer US : Imprint: Springer,

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This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering technologies   Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering.


Digital
Fundamentals of Lead-Free Solder Interconnect Technology : From Microstructures to Reliability
Authors: --- --- ---
ISBN: 9781461492665 9781461492658 9781461492672 9781489978011 Year: 2015 Publisher: New York, NY Springer US

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Abstract

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering.

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