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Crosstalk --- Integrated circuit layout --- Integrated circuits --- Prevention --- Very large scale integration --- Design and construction
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Design reuse techniques have become the subject of books, conferences, and podium discussions over the last few years. However, most discussions focus on higher-level abstraction like RTL descriptions, which can be synthesized. Design reuse is often seen as an add-on to normal design activity, or a special design task that is not an integrated part of the existing design flow. This may all be true for the ASIC world, but not for high-speed, high-performance microprocessors. In the field of high-speed microprocessors, design reuse is an integrated part of the design flow. The method of choice in this demanding field was, and is always, physical design reuse at the layout level. In the past, the practical implementations of this method were linear shrinks and the lambda approach. With the scaling of process technology down to 0.18 micron and below, this approach lost steam and became inefficient. The only viable solution is a method, which is now called Automatic Layout Modification (ALM). It combines compaction, mask manipulation, and correction with powerful capabilities. Automatic Layout Modification, Including design reuse of the Alpha CPU in 0.13 micron SOI technology is a welcome effort to improving some of the practices in chip design today.
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Cell-based design methodologies have dominated layout generation of digital circuits. Unfortunately, the growing demands for transparent process portability, increased performance, and low-level device sizing for timing/power are poorly handled in a fixed cell library. Direct Transistor-Level Layout For Digital Blocks proposes a direct transistor-level layout approach for small blocks of custom digital logic as an alternative that better accommodates demands for device-level flexibility. This approach captures essential shape-level optimizations, yet scales easily to netlists with thousands of devices, and incorporates timing optimization during layout. The key idea is early identification of essential diffusion-merged MOS device groups, and their preservation in an uncommitted geometric form until the very end of detailed placement. Roughly speaking, essential groups are extracted early from the transistor-level netlist, placed globally, optimized locally, and then finally committed each to a specific shape-level form while concurrently optimizing for both density and routability. The essential flaw in prior efforts is an over-reliance on geometric assumptions from large-scale cell-based layout algorithms. Individual transistors may seem simple, but they do not pack as gates do. Algorithms that ignore these shape-level issues suffer the consequences when thousands of devices are poorly packed. The approach described in this book can pack devices much more densely than a typical cell-based layout. Direct Transistor-Level Layout For Digital Blocks is a comprehensive reference work on device-level layout optimization, which will be valuable to CAD tool and circuit designers.
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Modern Placement Techniques explains physical design and VLSI/CAD placement to the professional engineer and engineering student. Along with explaining the problems that are associated with placement, the book gives an overview of existing placement algorithms, techniques and methodologies. Modern Placement Techniques emphasizes recent advances in addressing the placement problem, including congestion-driven, timing driven, mixed macro-cell and standard cell placement. The book presents the Dragon placement tool, with detailed algorithm descriptions for wire length, congestion and timing optimization. Placement benchmarks and results produced by Dragon are explained in detail.
Integrated circuit layout. --- Integrated circuit layout --- Layout, Integrated circuit --- Integrated circuits --- Design and construction --- Electronic circuits. --- Electrical engineering. --- Computer-aided engineering. --- Circuits and Systems. --- Electrical Engineering. --- Computer-Aided Engineering (CAD, CAE) and Design. --- CAE --- Engineering --- Electric engineering --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics --- Data processing
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Integrated circuits --- Computer-aided design --- Integrated circuit layout. --- Three-dimensional integrated circuits --- Circuits intégrés --- Circuits intégrés tridimensionnels --- Computer-aided design. --- Conception et construction --- Conception assistée par ordinateur --- Conception et construction. --- Conception assistée par ordinateur. --- Integrated circuits - Computer-aided design
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Integrated circuit layout --- Integrated circuits - Very large scale integration - Design and construction --- Metal oxide semiconductors, Complementary - Design and construction --- Integrated circuits --- Metal oxide semiconductors, Complementary --- Layout, Integrated circuit --- Very large scale integration&delete& --- Design and construction --- Very large scale integration
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Metal oxide semiconductors, Complementary --- Integrated circuits --- Metal oxide semiconductor field-effect transistors --- Integrated circuit layout --- Design and construction --- -CMOS (Electronics) --- Complementary metal oxide semiconductors --- Semiconductors, Complementary metal oxide --- Digital electronics --- Logic circuits --- Transistor-transistor logic circuits --- MOSFET --- Field-effect transistors --- Metal oxide semiconductors --- Design and construction. --- Integrated circuit layout. --- Metal oxide semiconductor field-effect transistors. --- -Design and construction. --- Layout, Integrated circuit --- Metal oxide semiconductors, Complementary - Design and construction --- Integrated circuits - Design and construction