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Digital
Additive Manufacturing : Materials, Functionalities and Applications
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ISBN: 9783031047213 9783031047206 9783031047220 9783031047237 Year: 2023 Publisher: Cham Springer International Publishing

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This book focuses on the advances of additive manufacturing in the applications of wearable electronics, energy storage, biomedical implants and devices, drug delivery, and technologies for 4D printing, large-scale printing, and ceramics printing. It provides timely insights into the materials, functionalities, and applications of additive manufacturing.


Book
Additive manufacturing technology : design, optimization and modeling
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ISBN: 3527833935 3527833919 Year: 2023 Publisher: Wiesbaden, Germany : Wiley-VCH,

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Book
Molecular dynamics simulation : fundamentals and applications
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ISBN: 9780128166161 0128166169 0128164190 9780128164198 Year: 2022 Publisher: Amsterdam, Netherlands : Elsevier,

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"Molecular Dynamic Simulation: Fundamentals and Applications explains the basic principles of MD simulation and explores its recent developments and roles in advanced modeling approaches. The implementation of MD simulation and its application to various aspects of materials science and engineering including mechanical, thermal, mass transportation, and physical/chemical reaction problems are illustrated. Innovative modeling techniques that apply MD to explore the mechanics of typical nanomaterials and nanostructures and to characterize crystalline, amorphous, and liquid systems are also presented."--


Book
Metal powder-based additive manufacturing
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ISBN: 3527822240 3527822224 Year: 2023 Publisher: Weinheim, Germany : WILEY-VCH GmbH,

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Book
Additive Manufacturing
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ISBN: 9783031047213 Year: 2023 Publisher: Cham Springer International Publishing :Imprint: Springer

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Book
SIGGRAPH Asia 2018 Technical Briefs
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Year: 2018 Publisher: New York, NY : ACM,

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Book
Computational and Experimental Simulations in Engineering
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ISBN: 9783031687754 Year: 2024 Publisher: Cham Springer Nature Switzerland :Imprint: Springer

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This book gathers the latest advances, innovations, and applications in the field of computational engineering, as presented by leading international researchers and engineers at the 30th International Conference on Computational & Experimental Engineering and Sciences (ICCES), held in Singapore on August 3-6, 2024. ICCES covers all aspects of applied sciences and engineering: theoretical, analytical, computational, and experimental studies and solutions of problems in the physical, chemical, biological, mechanical, electrical, and mathematical sciences. As such, the book discusses highly diverse topics, including composites; bioengineering & biomechanics; geotechnical engineering; offshore & arctic engineering; multi-scale & multi-physics fluid engineering; structural integrity & longevity; materials design & simulation; and computer modeling methods in engineering. The contributions, which were selected by means of a rigorous international peer-review process, highlight numerous exciting ideas that will spur novel research directions and foster multidisciplinary collaborations.


Book
Computational and Experimental Simulations in Engineering
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ISBN: 9783031774898 Year: 2025 Publisher: Cham Springer Nature Switzerland :Imprint: Springer

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Computational and Experimental Simulations in Engineering
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ISBN: 9783031816734 Year: 2025 Publisher: Cham Springer Nature Switzerland :Imprint: Springer

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Multi
Image and Graphics
Authors: --- --- --- --- --- et al.
ISBN: 9783030873554 9783030873561 9783030873547 Year: 2021 Publisher: Cham Springer International Publishing :Imprint: Springer

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This three-volume set LNCS 12888, 12898, and 12890 constitutes the refereed conference proceedings of the 11th International Conference on Image and Graphics, ICIG 2021, held in Haikou, China, in August 2021.* The 198 full papers presented were selected from 421 submissions and focus on advances of theory, techniques and algorithms as well as innovative technologies of image, video and graphics processing and fostering innovation, entrepreneurship, and networking. *The conference was postponed due to the COVID-19 pandemic.

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