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Topological concepts are essential to understand many of the most important recent discoveries in the basic physics of solids. Topology can be loosely defined as the branch of mathematics studying the properties of an object that are invariant under smooth distortions. Topological phases, as a result, show a kind of robustness and universality that is similar in spirit to the famous universality observed at continuous phase transitions, but with a very different microscopic origin. This chapter introduces some of the key examples of topological phases of matter and places them in the broader context of many-body physics. Einstein famously commented that statistical mechanics was one kind of physics whose basic principles would last forever, because they were based only on the assumption that our knowledge of a complex system is incomplete. Topological phases show how a kind of macroscopic simplicity and perfection can nevertheless emerge in many-particle systems, even in the presence of disorder and fluctuations that make a complete microscopic description impossible.

Condensed matter. --- Topology. --- Topological defects (Physics) --- Geometric quantum phases. --- Quantum Hall effect. --- Matière condensée --- Topologie --- Hall quantique, Effet --- Matière condensée --- Topological defects (Physics).

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This book is a compilation of recent studies by recognized experts in the field of epitaxial graphene working towards a deep comprehension of growth mechanisms, property engineering, and device processing. The results of investigations published within this book develop cumulative knowledge on matters related to device-quality epaxial graphene on SiC, bringing this material closer to realistic applications.

Technology: general issues --- epitaxial graphene --- copper --- redox reaction --- electrodeposition --- voltammetry --- chronoamperometry --- DFT --- silicon carbide --- Raman spectroscopy --- 2D peak line shape --- G peak --- charge density --- strain --- atomic layer deposition --- high-k insulators --- ion implantation --- Raman --- AFM --- XPS --- graphene --- SiC --- 3C-SiC on Si --- substrate interaction --- carrier concentration --- mobility --- intercalation --- buffer layer --- surface functionalization --- twistronics --- twisted bilayer graphene --- flat band --- epitaxial graphene on SiC --- quasi-free-standing graphene --- monolayer graphene --- high-temperature sublimation --- terahertz optical Hall effect --- free charge carrier properties --- sublimation --- electronic properties --- material engineering --- deposition

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Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials.

Technology: general issues --- Energy industries & utilities --- electromagnetic bandgap (EBG) --- dual perforation (DP) --- parallel-plate noise --- power delivery network (PDN) --- printed circuit board (PCB) --- meander split --- power/ground plane --- crosstalk --- signal integrity --- equivalent circuit --- capacitive and magnetic coupling --- hall-effect current sensors --- commercial current sensor --- electromagnetic compatibility (EMC) --- electromagnetic interference (EMI) --- direct power injection (DPI) test --- transverse-electromagnetic (TEM) test --- bulk current injection (BCI) test --- Spread Spectrum --- DC–DC power converters --- digital communications --- channel capacity --- resonant coupling --- Electromagnetic Interferences --- Amplifiers --- CMOS integrated circuits --- susceptibility of the output pin --- electromagnetic compatibility --- power electronics EMC --- EMI mitigation techniques --- EMI filter design and optimization --- common mode noise --- EMI modeling --- Fourier series --- impedance balancing --- resonant frequency --- battery management system (BMS) --- Li-ion battery pack --- electric vehicles (EVs) --- hybrid electric vehicles (HEVs) --- IC-level EMC --- susceptibility to electromagnetic interference (EMI) --- direct power injection (DPI) --- anechoic chamber --- polyaniline --- gelatin --- composite --- microwave absorption --- dielectric permittivity --- electrical conductivity --- shielding effectiveness --- biochar --- eco-friendly material --- cementitious composites --- waveguides --- electromagnetic interference (EMI) suppressors --- sleeve ferrite cores --- cable filtering --- nanocrystalline (NC) --- split-core --- snap ferrite --- gap --- DC currents --- relative permeability --- impedance --- conducted emissions --- Discrete Wavelet Transform --- electromagnetic interference --- Empirical Mode Decomposition --- harmonics --- Switched-Mode Power Supplies --- transients --- Wavelet Packet Transform --- electromagnetic bandgap (EBG) --- dual perforation (DP) --- parallel-plate noise --- power delivery network (PDN) --- printed circuit board (PCB) --- meander split --- power/ground plane --- crosstalk --- signal integrity --- equivalent circuit --- capacitive and magnetic coupling --- hall-effect current sensors --- commercial current sensor --- electromagnetic compatibility (EMC) --- electromagnetic interference (EMI) --- direct power injection (DPI) test --- transverse-electromagnetic (TEM) test --- bulk current injection (BCI) test --- Spread Spectrum --- DC–DC power converters --- digital communications --- channel capacity --- resonant coupling --- Electromagnetic Interferences --- Amplifiers --- CMOS integrated circuits --- susceptibility of the output pin --- electromagnetic compatibility --- power electronics EMC --- EMI mitigation techniques --- EMI filter design and optimization --- common mode noise --- EMI modeling --- Fourier series --- impedance balancing --- resonant frequency --- battery management system (BMS) --- Li-ion battery pack --- electric vehicles (EVs) --- hybrid electric vehicles (HEVs) --- IC-level EMC --- susceptibility to electromagnetic interference (EMI) --- direct power injection (DPI) --- anechoic chamber --- polyaniline --- gelatin --- composite --- microwave absorption --- dielectric permittivity --- electrical conductivity --- shielding effectiveness --- biochar --- eco-friendly material --- cementitious composites --- waveguides --- electromagnetic interference (EMI) suppressors --- sleeve ferrite cores --- cable filtering --- nanocrystalline (NC) --- split-core --- snap ferrite --- gap --- DC currents --- relative permeability --- impedance --- conducted emissions --- Discrete Wavelet Transform --- electromagnetic interference --- Empirical Mode Decomposition --- harmonics --- Switched-Mode Power Supplies --- transients --- Wavelet Packet Transform

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• Reference Manager
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Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials.

electromagnetic bandgap (EBG) --- dual perforation (DP) --- parallel-plate noise --- power delivery network (PDN) --- printed circuit board (PCB) --- meander split --- power/ground plane --- crosstalk --- signal integrity --- equivalent circuit --- capacitive and magnetic coupling --- hall-effect current sensors --- commercial current sensor --- electromagnetic compatibility (EMC) --- electromagnetic interference (EMI) --- direct power injection (DPI) test --- transverse-electromagnetic (TEM) test --- bulk current injection (BCI) test --- Spread Spectrum --- DC–DC power converters --- digital communications --- channel capacity --- resonant coupling --- Electromagnetic Interferences --- Amplifiers --- CMOS integrated circuits --- susceptibility of the output pin --- electromagnetic compatibility --- power electronics EMC --- EMI mitigation techniques --- EMI filter design and optimization --- common mode noise --- EMI modeling --- Fourier series --- impedance balancing --- resonant frequency --- battery management system (BMS) --- Li-ion battery pack --- electric vehicles (EVs) --- hybrid electric vehicles (HEVs) --- IC-level EMC --- susceptibility to electromagnetic interference (EMI) --- direct power injection (DPI) --- anechoic chamber --- polyaniline --- gelatin --- composite --- microwave absorption --- dielectric permittivity --- electrical conductivity --- shielding effectiveness --- biochar --- eco-friendly material --- cementitious composites --- waveguides --- electromagnetic interference (EMI) suppressors --- sleeve ferrite cores --- cable filtering --- nanocrystalline (NC) --- split-core --- snap ferrite --- gap --- DC currents --- relative permeability --- impedance --- conducted emissions --- Discrete Wavelet Transform --- electromagnetic interference --- Empirical Mode Decomposition --- harmonics --- Switched-Mode Power Supplies --- transients --- Wavelet Packet Transform