Listing 1 - 2 of 2 |
Sort by
|
Choose an application
A new CubeSat is in development by students and professors of the University of Liège and the Centre Spatial de Liège. The CubeSat OUFTI-NEXT will measure the hydric stress in crop fields in order to enhance the management efficiency of the water resources for agriculture. This CubeSat incorporates a thermal imager to capture the electromagnetic radiation of the infrared band. In this project, it is analysed the performance of the different infrared detectors that can be used within the CubeSat optical instrument. There are a few examples of CubeSat missions observing in the Mid-Wave Infrared Band or in the Long-Wave Infrared band. However, any of these missions can observe in both bands at the same time. This Master Thesis describes the feasibility of an optical instrument for a CubeSat observing in both bands with the use of a single detector. With this aim, the performance of the two main groups of infrared detectors, photodetectors and thermal detectors, is measured in terms of temperature resolution and signal-to-noise ratio in the space environment. These computations are carried on with the model of equations developed in this Master Thesis.
CubeSat --- Dual-band --- Microbolometer --- Photodetector --- Signal-to-noise ratio --- Noise Equivalent Temperature Difference --- Infrared --- Ingénierie, informatique & technologie > Ingénierie aérospatiale
Choose an application
Micro and nano-electro-mechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within Integrated Circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors. The CMOS ICs and M/NEMS dies can be combined in the same package (SiP), or integrated within a single chip (SoC). In the SoC approach the M/NEMS devices are monolithically integrated together with CMOS circuitry allowing the development of compact and low-cost CMOS-M/NEMS devices for multiple applications (physical sensors, chemical sensors, biosensors, actuators, energy actuators, filters, mechanical relays, and others). On-chip CMOS electronics integration can overcome limitations related to the extremely low-level signals in sub-micrometer and nanometer scale electromechanical transducers enabling novel breakthrough applications. This Special Issue aims to gather high quality research contributions dealing with MEMS and NEMS devices monolithically integrated with CMOS, independently of the final application and fabrication approach adopted (MEMS-first, interleaved MEMS, MEMS-last or others).]
encapsulation --- n/a --- NEM memory switch --- magnetotransistor --- gas sensor --- nano-system array --- metal oxide (MOX) sensor --- capacitive pressure sensor --- real-time temperature compensation loop --- mechanical relays --- single-crystal silicon (SC-Si) --- MEMS relays --- MEMS --- oscillator --- micro-electro-mechanical system (MEMS) --- uncooled IR-bolometer --- microelectromechanical systems --- microbolometer --- programmable sustaining amplifier --- micro sensor --- CMOS-MEMS --- pierce oscillator --- MEMS resonators --- micro/nanoelectromechanical systems (MEMS/NEMS) --- resonator --- microhotplate --- NEMS --- application-specific integrated circuit (ASIC) --- MEMS modelling --- magnetic field --- chopper instrumentation amplifier --- microresonators --- interface circuit --- Hall effect --- thermal detector --- temperature sensor --- infrared sensor --- CMOS–NEMS --- CMOS --- atomic force microscope --- MEMS switches --- stent --- micro-electro-mechanical systems (MEMS) sensors --- nano resonator --- silicon-on-insulator (SOI) --- MEMS-ASIC integration --- Sigma-Delta --- MEMS characterization --- high-Q capacitive accelerometer --- mass sensors --- M3D --- CMOS-NEMS
Listing 1 - 2 of 2 |
Sort by
|