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Micro and nano-electro-mechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within Integrated Circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors. The CMOS ICs and M/NEMS dies can be combined in the same package (SiP), or integrated within a single chip (SoC). In the SoC approach the M/NEMS devices are monolithically integrated together with CMOS circuitry allowing the development of compact and low-cost CMOS-M/NEMS devices for multiple applications (physical sensors, chemical sensors, biosensors, actuators, energy actuators, filters, mechanical relays, and others). On-chip CMOS electronics integration can overcome limitations related to the extremely low-level signals in sub-micrometer and nanometer scale electromechanical transducers enabling novel breakthrough applications. This Special Issue aims to gather high quality research contributions dealing with MEMS and NEMS devices monolithically integrated with CMOS, independently of the final application and fabrication approach adopted (MEMS-first, interleaved MEMS, MEMS-last or others).]
encapsulation --- n/a --- NEM memory switch --- magnetotransistor --- gas sensor --- nano-system array --- metal oxide (MOX) sensor --- capacitive pressure sensor --- real-time temperature compensation loop --- mechanical relays --- single-crystal silicon (SC-Si) --- MEMS relays --- MEMS --- oscillator --- micro-electro-mechanical system (MEMS) --- uncooled IR-bolometer --- microelectromechanical systems --- microbolometer --- programmable sustaining amplifier --- micro sensor --- CMOS-MEMS --- pierce oscillator --- MEMS resonators --- micro/nanoelectromechanical systems (MEMS/NEMS) --- resonator --- microhotplate --- NEMS --- application-specific integrated circuit (ASIC) --- MEMS modelling --- magnetic field --- chopper instrumentation amplifier --- microresonators --- interface circuit --- Hall effect --- thermal detector --- temperature sensor --- infrared sensor --- CMOS–NEMS --- CMOS --- atomic force microscope --- MEMS switches --- stent --- micro-electro-mechanical systems (MEMS) sensors --- nano resonator --- silicon-on-insulator (SOI) --- MEMS-ASIC integration --- Sigma-Delta --- MEMS characterization --- high-Q capacitive accelerometer --- mass sensors --- M3D --- CMOS-NEMS
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Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc.
micromachining --- n/a --- turbulent kinetic energy dissipation rate --- microelectromechanical systems (MEMS) piezoresistive sensor chip --- WiFi-RSSI radio map --- step detection --- built-in self-test --- regularity of activity --- motion analysis --- gait analysis --- frequency --- acceleration --- MEMS accelerometer --- zero-velocity update --- rehabilitation assessment --- vacuum microelectronic --- dance classification --- Kerr noise --- MEMS --- micro machining --- MEMS sensors --- stereo visual-inertial odometry --- self-coaching --- miniaturization --- wavelet packet --- three-axis acceleration sensor --- MEMS-IMU accelerometer --- performance characterization --- electrostatic stiffness --- delaying mechanism --- three-axis accelerometer --- angular-rate sensing --- indoor positioning --- whispering-gallery-mode --- sensitivity --- heat convection --- multi-axis sensing --- L-shaped beam --- stride length estimation --- activity monitoring --- process optimization --- mismatch of parasitic capacitance --- electromechanical delta-sigma --- cathode tips array --- in situ self-testing --- high acceleration sensor --- deep learning --- marine environmental monitoring --- accelerometer --- fault tolerant --- hostile environment --- micro-electro-mechanical systems (MEMS) --- low-temperature co-fired ceramic (LTCC) --- classification of horse gaits --- Taguchi method --- interface ASIC --- capacitive transduction --- digital resonator --- safety and arming system --- inertial sensors --- MEMS technology --- sleep time duration detection --- field emission --- probe --- piezoresistive effect --- capacitive accelerometer --- auto-encoder --- MEMS-IMU --- body sensor network --- optical microresonator --- wireless --- hybrid integrated --- mode splitting
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Micro manufacturing involves dealing with the fabrication of structures in the size range of 0.1 to 1000 µm. The scope of nano manufacturing extends the size range of manufactured features to even smaller length scales—below 100 nm. A strict borderline between micro and nano manufacturing can hardly be drawn, such that both domains are treated as complementary and mutually beneficial within a closely interconnected scientific community. Both micro and nano manufacturing can be considered as important enablers for high-end products. This Special Issue of Applied Sciences is dedicated to recent advances in research and development within the field of micro and nano manufacturing. The included papers report recent findings and advances in manufacturing technologies for producing products with micro and nano scale features and structures as well as applications underpinned by the advances in these technologies.
path adaptability --- uncertainty quantification --- hardening --- empirical mode decomposition --- microlens array mold --- gaussian process modeling --- multi-objective particle swarm optimization --- micro reactors --- XRD --- surface roughness --- water impermeability tests --- nanocone array --- additive manufacturing --- antireflection nanostructure --- ultraprecision machining --- Surface-enhanced Raman scattering --- micro stereolithography --- optical encoder --- micro assembly --- micro-optics --- nanosphere array --- micro-assembly --- injection molding --- Portland limestone ternary fiber–cement nanohybrids --- hot embossing --- deterministic polishing --- micro-lens array --- process parameter optimization --- TGA/dTG --- intrinsic mode function --- micro factories --- three-dimensional elliptical vibration cutting --- flow control --- micro-EDM molds --- Image segmentation --- micro actuators --- culture dish adapter --- flexural strength --- SERS --- low PC clinker --- MIP --- selective laser melting --- micro sensors --- friction coefficient --- design of experiments --- Ti6Al4V --- micro-spring --- contactless embossing --- micro and nano additive manufacturing --- Taguchi’s method --- nanoimprinting --- perfusion culture --- micro and nano manufacturing --- data structure --- fluid jet polishing --- nitrogen supersaturation --- spatial uncertainty modeling --- active alignment --- variable pitch path --- conceptual design --- feature extraction --- blaze --- micro-nozzle --- product development --- opto-ASIC --- wafer-level optics --- residual error optimization --- stiffness control --- surface engineering and interface nanotechnology --- design for manufacturability --- anodic aluminum oxide --- plasma nitriding --- micro 3D printing --- hydrophobicity --- grating --- micro-fluidics --- closed environment --- chatter identification --- small recess structure
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