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This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.

Electronic Circuits and Devices. --- Interconnects (Integrated circuit technology) --- Carbon nanotubes. --- CNTs (Carbon nanotubes) --- Interconnections (Integrated circuit technology) --- Connections --- Engineering. --- Microprocessors. --- Electronic circuits. --- Circuits and Systems. --- Processor Architectures. --- Nanotubes --- Integrated circuits --- Systems engineering. --- Computer science. --- Informatics --- Science --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Design and construction --- Minicomputers --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics